Saturday, December 16, 2006

Manufacturing test and power on self test

Kozio has announced that an evaluation version of its kDiagnostics software is now shipping as part of Applied Micro Circuit's new Saguaro evaluation kit for the nP3705 packet processor.

Kozio, the leading provider of automated validation software ideally suited for board-bring up, manufacturing test and power on self test, today announced that an evaluation version of its kDiagnostics software is now shipping as part of Applied Micro Circuit Corporation's (AMCC's) new Saguaro evaluation kit for the nP3705 packet processor. Access to Kozio's full-featured evaluation software, as well as support from the company, is available immediately for custom designs using the PowerPC 440EP processor. This continues Kozio's long-running partnership with AMCC, as well as the company's FullCircuit evaluation program, which provides an evaluation version of kDiagnostics with a variety of third-party processor evaluation platforms.

Users have access to a full-featured evaluation version of the software, enabling them to test out the entire board in minutes and explore all the features of the technology.

'If you can get proven, pre-verified third-party diagnostics at a fraction of the cost of writing them yourself, it's hard to justify spending the engineering time developing custom code,' notes Al Arendt director of sales at Kozio.

'Our customers are enjoying increased success because their development engineers are spending more time developing products with higher performance, improved reliability and a wider range of features than their competitors.

Kozio is helping them deliver better products - on time.' Kozio's turnkey validation package is pre-installed on the Saguaro evaluation platforms, allowing potential customers to explore various benefits of kDiagnostics, including proven test suites for 440EP core and expansion bus, memories and all peripherals, with full access to all special-purpose Power PC registers.

Kozio's standard package includes test suites for DDR, SDRAM, EEPROM and DMA, with full programming capabilities during testing of UART, Ethernet (10/100), Gigabit Ethernet, PCI and connected devices, 12C and connected devices, USB port, and temperature sensor.

Kozio's support, including a full validation suite for board bring-up, is available immediately for any custom board using the 440EP processor.

Validation suites are provided for evaluation purposes, and a complete validation package can be prepared for custom 440EP boards in two weeks - even before the first custom board arrives from assembly.

In addition, Kozio can provide a fully automated test suite for manufacturing or production test and power-on-self-test, delivering the same test functions used for board bring-up.

Reflow soldering system saves operating costs

Reflow soldering system handles traditional high volume reflow for both leaded and lead free alloys, and offers exceptional efficiencies in operating costs.

Production automation system specialist, Contax, has announced the availability of Speedline's Electrovert OmniFlex 7 reflow soldering system in the UK, Ireland and Benelux. This advanced new system handles traditional high volume reflow for both leaded and lead free alloys, and offers exceptional efficiencies in operating costs. By utilising sophisticated new heating and cooling transfer technologies and energy efficient designs, the OmniFlex 7 uses up to 50% less power, and up to 30-35% less nitrogen than comparable platforms.

Furthermore, maintenance intervals are reduced, so resulting in a much lower cost of ownership.

Specific features include the ability to offer the higher peak temperature requirements and smaller process windows required for lead-free soldering.

The OmniFlex 7 features a temperature process capability to 350 deg C, high-efficiency heat transfer and exceptional zone-to-zone seperation, so enabling easy lead-free processing.

Further design enhancements include standard closed-loop blower control and an advanced chamber design for more balanced airflow with minimal turbulence.

This improves heat transfer and substantially reduces power and nitrogen consumption.

Another significant feature is the VariCool cooling technology.

The nitrogen cooling module consists of vertical cooling chambers that offer independent, closed-loop variable blower control for precise control of cooling profiles and assembly exit temperatures.

Finally, a proprietary self-cleaning Flux Extraction System (FES) continuously filters, traps and collects flux volatile particles throughout the pre-heat, soak and reflow zones.

These particles are collected in containment jars that can be quickly and easily removed.

This self-cleaning process significantly reduces the need for maintenance, so increasing system uptime.

'Speedline's new OmniFlex 7 offers a completely advanced, flexible design,' said Mike Rapson, managing director at Contax.

'It is fully lead-free compatible and offers all the features that our customers need - low energy and nitrogen consumption and a self-cleaning FES facility.

This results in a very cost and energy efficient system that offers an excellent return on investment,' he said.

* About Contax - Contax is one of the UK and Ireland's most comprehensive suppliers of automation equipment.

Products range from PCB assembly, automatic optical and X-ray inspection, reflow solder, screen printing, precision liquid dispensing, cable preparation, robotic soldering and robotic assembly as well as cleaning systems.

Friday, December 15, 2006

Connector enables quick wire-to-board assembly

A low-profile, small PCB footprint, connector from allows users to easily connect individual wires to a single row of contacts using IDC technology.

Connector enables quick wire-to-board assembly A low-profile, small PCB footprint, connector from allows users to easily connect individual wires to a single row of contacts using IDC technology. The new 9175 connector from passives and connectors specialist AVX's Elco Europe Division allows users to easily connect individual wires to a single row of contacts using IDC technology. Currently available as two-and three-way IDC connectors, the part is both low-profile (3.45mm) with a small PCB footprint (two-way: 5.0x2.5mm, three-way: 7.5x2.5mm) and allows for quick, easy assembly thanks to a dedicated single-wire insertion hand tool.

Before assembly, the part is surface mounted to the PCB.

Using the hand tool, 26 or 28 AWG solid/ stranded wires are inserted into the contact slot.

This process cuts the insulation and enables the individual conductors of the wire to form a homogeneous joint.

The shape of the moulding forms a restraint to the wire when fully inserted in the contact.

Contact material is phosphor bronze, with five re-terminations achievable for each individual contact.

Parts offer a current rating of 1A continuous through all contacts at 25 deg C (ambient), with a voltage rating of 125V, delivering a minimum insulation resistance of 100Mand#8486;, and a maximum termination resistance of 20mohms.

Devices operate between -40 and +80 deg C.

Due to ease and speed of assembly to the small volume intricate/flexible connections of high value devices, 9175 connectors can be used for connecting two or three wires between PCBs, in high volume consumer market applications, for example speakers, buzzers, microphones, vibration mechanisms.

Nine orders for EFD Family of CFD Software

Flomerics has announced that it has received significant sales orders for its EFD family of computational fluid dynamics (CFD) software over the past quarter.

Flomerics has announced that it has received significant sales orders for its EFD family of computational fluid dynamics (CFD) software over the past quarter from Honda, WATTS Industries, Thales MESL, Boeing Shared Services Group, Meteor Gummiwerke, Philips Medical System DMC , Robert Bosch , ZF Getriebe and Eaton Electric. The EFD family of CFD software from Flomerics includes EFD.Pro - a fully embedded CFD solution within the Pro/ENGINEER environment; EFD.V5, - a fully embedded CFD solution within the CATIA environment, and EFD.Lab - a general-purpose fluid analysis tool that includes a built-in solid modeler. All the software products in the EFD family work directly with the native CAD geometry and require no translation of data, so the solid model maintains intelligence such as assembly hierarchy, constraints, and features.

Users can take advantage of the existing data to conduct 'what if?' analyses directly from within their chosen design platform.

EFD makes it easy to perform flow simulation because it analyses the geometry and generates the computational grid in the background while the user only needs to interact with the familiar MCAD interface.

The analysis engine at the heart of the EFD product suite is the same analysis engine used by SolidWorks in their tightly-integrated CFD software - CosmosFloWorks.

Thursday, December 14, 2006

Design, partitioning, test for system-in-package

The new System-in-Package (SiP) paradigm in electronics product implementation allows the mixing of optimum active and passive device technologies in bare die format within a single package outline.

The new System-in-Package (SiP) paradigm in electronics product implementation allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, short time-to-market functionality well matched to a wide range of low, medium and high volume electronics product applications. The novel addition of embedded passive component technology within such SiP modules also promises further performance, size, weight and cost benefits. The SiP approach allows board level functionality to be realised at the package level for smaller, lighter and higher functionality products.

However a major obstacle to the successful introduction of this new technology is the lack of a robust design methodology supported by rigorous simulation tools, accurate component and technology models.

The ADEPT-SiP project, that is funded through the DTI Technology Programme under the Design, Simulation and Modelling Technology priority area, is directed at eliminating this obstacle.

The 30-month ADEPT-SiP project started in May 2006 and will develop and demonstrate a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions.

It will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets.

Other key design stages will include thermal and EMC design, and design-for-manufacture, for test, reliability and for environmental impact.

Novel, high density embedded passive substrate technologies will be designed and simulated, process characterisation undertaken and component models developed for the full range of passive components and interconnection and assembly structures.

The core design, simulation and modelling activities will then be proven in SiP technology demonstrators.

The ADEPT-SiP project partners include Filtronic Broadband and Zarlink Semiconductors' Advanced Packaging Division based in Caldicot as SiP product end-users, Leeds University as modelling provider, Zuken, QuantumCAD and Flomerics as design providers, and Wurth Elektronik and TWI as technology providers.

Professional circuit board repair kit

The new CircuitMedic CRC 201-2102 professional circuit board repair kit from Intertronics is a comprehensive package of equipment and information.

The new CircuitMedic CRC 201-2102 professional circuit board repair kit from Intertronics is a comprehensive package of equipment and information - it is probably the most complete and versatile circuit board repair kit to be found anywhere. Applications cover removal and replacement of coatings and components, repair of conductors and edge contacts, as well as plated holes, jumper wires, legend masking, key and slot, lifted lands. Naturally the kit includes lead free repair frames.

When you consider all the bad things that can happen to circuit boards to cause a reject, it's a wonder how some of them survive at all! They get nicked, cracked, broken, scratched, burned, conductors get ripped up, plated holes get torn out.

Some don't pass the final inspection.

Others become the victim of changed specifications or just may not look right.

That's where the CRC Professional Repair Kit comes in.

It's the total package.

The kit includes dry film, epoxy-backed circuit frames, and unique replacement circuits that do not use messy liquid epoxy.

It includes eyelets and setting tools for plated through hole repair, Circuit Tracks to repair damaged circuits, epoxy and colour agents for solder mask or base board repairs, and a comprehensive manual - all packaged in a convenient carrying case.

In addition Intertronics supply a PDF download - Repair Guide - this 186 page document gives a step-by-step walk through of all the likely repair processes - how to do it, tools needed, procedures, inspection etc, aimed to make one-off repairs easy or regular repair processes more successful.

Wednesday, December 13, 2006

Mini OTDR sets new performance standards

The new Yokogawa AQ7270 fibreXplorer is a mini OTDR which sets new standards in terms of performance, speed of operation, and ease of use.

Mini OTDR sets new performance standards The new Yokogawa AQ7270 fibreXplorer is a mini OTDR (optical time-domain reflectometer) which sets new standards in terms of performance, speed of operation, and ease of use to aid the installation and maintenance of core, metro and access networks including FTTH (fibre to the home) and PON (passive optical networks). The AQ7270 offers the industry's best performance in terms of event separation capability and the shortest dead zone - less than 80 cm - to enable multiple-event detection even when events are close to one another. Its high-speed operation optimises work efficiency, while automatic test functions enable installation operatives to execute tests easily and reliably.

'The worldwide spread of broadband services has stimulated the installation of optical fibre in metro and access networks, which in turn has increased the demand for portable and reliable test equipment to aid the installation and maintenance of these networks', comments Terry Marrinan, Sales and Marketing Director, Europe and Africa, of Yokogawa Europe's Test and Measurement Group: 'Our new mini OTDR has been developed to address these challenges with the particular aims of improving operability to boost work efficiency and cost-effectiveness.' The AQ7270 is a compact, lightweight instrument measuring only 287 x 182 x 75mm and weighing 2.9kg.

It features a large (8.4in) high-luminance LCD display with a dark background which makes it easy to read the screen and manipulate markers, even in bright sunlight.

The AQ7270 Series includes eleven models, each of which will test up to four wavelengths covering the requirements of core, metro and access networks.

Seven wavelengths: 850, 1300, 1310, 1490, 1550, 1625 and 1650 nm - are currently available in the product line-up.

Key features which improve operational efficiency are the instrument's speed of operation and its powerful integrated test functions.

Fast power-up enables users to start testing within 10 seconds on turning the OTDR on, while one-button testing is used to execute preset test routines for dramatically improving the productivity of operatives without specialist technical skills.

The AQ7270 is equipped with a number of functions to help users to execute a reliable measurement easily, including a fully automatic mode which sets appropriate test conditions according to the fibre under test, carries out the measurement, and saves the data to a file.

In addition, a 'fibre in use' indicator and alarm prevents on-channel measurements being made on fibres with in-service wavelengths.

Other features include multiple languages for menus, internal data storage of up to 1000 traces) and external USB storage.

A number of options are available to expand the instrument's test capability and work efficiency, including an optical power monitor, light source, built-in printer and built-in dummy fibre to aid near-end evaluation.

Oscilloscopes for the German Federal Armed Forces

Agilent Technologies has won a European-wide bid to supply the German Federal Armed Forces with more than 1500 digital storage oscilloscopes (DSOs).

Agilent Technologies has won a European-wide bid to supply the German Federal Armed Forces with more than 1500 digital storage oscilloscopes (DSOs). The Agilent 6000 Series oscilloscopes will be used by engineers and technicians to test electrical equipment at the maintenance and repair facilities of the German air force, navy and army. Agilent will begin delivering the oscilloscopes before the end of the year.

Agilent created the 6000 Series oscilloscopes to meet the challenges that engineers and technicians face with testing sophisticated electronic designs.

Today's designs are no longer based only on analog technology, but increasingly contain digital signals and serial communication buses, creating an environment of mixed fast and slow signals.

This mixed-signal environment means engineers need to measure composite signal conditions and view time-correlated analog and digital signals.

Agilent's 6000 Series oscilloscopes give engineers these capabilities.

'Our new 6000 Series has made its mark on the oscilloscope market,' said Hans-Janduuml;rgen Bochtler, sales manager for Agilent's Electronic Measurement Group in Germany, Austria and Switzerland.

'Since introducing the new oscilloscope family last year, we have recorded significant growth and won market share in this highly competitive arena'.

The 6000 Series includes 19 different oscilloscope models with frequency ranges from 100 MHz to 1 GHz with two or four analog channels.

The series also includes mixed signal oscilloscopes (MSOs) that offer 16 digital channels integrated with the analog channels.

The 6000 Series oscilloscopes offer many technological innovations, such as a high-resolution display and fast signal processing speed, which simplify the task and shorten the time it takes to identify intermittent interference signals.

They also offer deep digital memory, multiple standard I/O interfaces (LAN/USB/GPIB), and progressive serial trigger possibilities for I2C/SPI/CAN/LIN buses.

With optional application packages, the oscilloscopes can decode the signals from these specialised buses and quickly make internal FPGA measurements.

In November 2006, Agilent added three models to the 6000 Series that are optimised for use in test systems.

Because of their LXI (LAN eXtensions for Instrumentation) interfaces and compact form-factor (only 44 mm high), these models are especially suitable for installing in test racks.

Tuesday, December 12, 2006

Reliability test alliance

Agilent Technologies has announced a formal agreement with Core Wafer Systems (CWS) for the semiconductor test market space.

Agilent Technologies has announced a formal agreement with Core Wafer Systems (CWS), a leading provider of accelerated and long-term reliability test solutions and analysis tools for the semiconductor test market space. The Advanced Scaleable Unified Reliability (ASUR) suite of solutions from CWS exclusively uses Agilent's system tester and instruments for the Single Device Reliability (SDR) and multi-site Parallel Device Reliability (PDR) test products. ASUR includes fifth-generation PDQ-WLR, the accelerated reliability standard in the test industry offered by Agilent since 1994.

Complementing the testing methodology is the Reliability Data Analyser (RDA) software from CWS for real-time, post-test analysis and lifetime prediction for devices, metallisation and dielectrics.

As part of the agreement, Agilent offers CWS software reliability solutions, services and test structure libraries, which are uniquely compatible with Agilent hardware.

Agilent will sell a turnkey solution and support the integrated software and hardware as a single source vendor for reliability customers.

'CWS' software reliability test solutions are a natural extension to the reliability solutions already supported by the Agilent B1500A semiconductor device analyser and the Agilent 4070 series of parametric testers,' said Minoru Ebihara, vice president and general manager of Agilent Hachioji Semiconductor Test Division.

'Now we can offer a complete range of semiconductor reliability test solutions, from instruments to systems, and the modular nature of our approach makes it easy and cost-effective for our customers to start small and add later to their reliability test capabilities as their needs change'.

'We are pleased to continue and expand our partnership with such an established and well-respected leader in the industry,' said Roger Goetz, CEO, Core Wafer Systems.

'This alliance with Agilent will allow us to further expand our reach to the worldwide customer base'.

'Now all customers will have convenient access to these advanced tools, which will help them increase efficiency and lower their overall cost-of-test at the deep nanometer scale'.

Core Wafer Systems (CWS) specialises in single-site and multi-site (parallel) accelerated and long-term reliability testing and analysis, and provides modular wafer-level and package-level solutions for current and emerging technologies.

Analyser optimised for serial-data-based designs

Agilent Technologies announces an oscilloscope measurement system with specialised tools for designing, debugging and validating designs that include high-data-rate serial buses.

Agilent Technologies announces an oscilloscope measurement system with specialised tools for designing, debugging and validating designs that include high-data-rate serial buses. The new Agilent DSA80000B digital signal analyser (DSA) system offers the industry's lowest noise floor, jitter-measurement floor and trigger jitter, and the flattest frequency response, making it possible for engineers to gather more accurate data about the low-voltage differential signals in their designs. The DSA80000B DSA is ideal for engineers working in the communications, data storage, computer, aerospace/defence and consumer electronics industries.

Agilent's DSA80000B DSA is built around an Infiniium DSO80000B Series oscilloscope and the InfiniiMax probing system, which provide critical capabilities for achieving accurate and repeatable measurements.

The oscilloscope and probe capabilities are augmented with high-speed serial data analysis and EZJIT Plus jitter-analysis software to give designers additional capabilities for designing, debugging and validating their serial-data-based designs.

The high-speed serial data analysis software provides designers with a fast and easy way to pinpoint signal integrity problems and validate performance for serial interface designs.

It allows designers to perform mask testing, characterize serial data streams that employ embedded clocks, and decode 8b/10b data from serial data streams.

The software also enables designers to verify compliance to computer, communications and data-communications standards such as PCI Express, Serial ATA (SATA), serial attached SCSI (SAS), Fibre Channel (FC), XAUI and Gigabit Ethernet.

With the faster edge speeds and shrinking data-valid windows in today's high-speed digital designs, insight into the causes of signal jitter is critical for ensuring the reliability of designs.

The EZJIT Plus jitter-analysis software helps designers identify and quantify jitter components.

Time correlation of jitter to the real-time signal makes it easy to trace jitter components to their sources.

The DSA80000B DSA's superior signal integrity capabilities come from Agilent's RF design experience, proprietary packaging technologies and CMOS ADC architecture.

Superior signal integrity helps engineers maximise design margins because they do not waste measurement accuracy due to poor noise, jitter or frequency response of the oscilloscope or probing system.

Monday, December 11, 2006

Draft-802.11n MIMO test solution

Agilent Technologies has announced an innovative test solution in support of the draft-802.11n specification.

Draft-802.11n MIMO test solution Agilent Technologies has announced an innovative test solution in support of the draft-802.11n specification. The 802.11n standard adds Multiple-Input Multiple-Output (MIMO) to increase data throughput and increase range. The accuracy, fast measurement speed and reliability of Agilent's new test solution make it the ideal choice for manufacturing managers and engineers performing high-volume test on draft-802.11n devices or modules.

Agilent's solution consists of the N4011A MIMO/Multi-Port Adapter and the N4010A Wireless Connectivity Test Set, configured with Option 103 for WLAN Tx/Rx analysis and Option 108 for 802.11n MIMO modulation analysis.

A MIMO upgrade kit is available for customers who currently own the N4010A test set.

The N4011A connects to the N4010A test set to provide four switchable RF I/O ports for testing devices of all WLAN formats, including draft-802.11n.

The N4010A Option 108 and N4011A combination provides fast electronic switching to allow capture and analysis of WLAN bursts on multiple channels without compromising measurement accuracy.

This innovative technique allows full demodulation of the MIMO signal, providing greater insight to failure mechanisms revealed by measurements such as channel isolation and single-channel or MIMO EVM.

'In high-volume manufacturing environments, the speed of the N4010A/N4011A provides increased throughput, while its measurement accuracy and repeatability provide users with confidence in the quality of the test device,' said Earl Thompson, vice president and general manager of Agilent's Wireless Division.

'This level of performance is critical to ensuring the lower cost of test that today's manufacturing managers and engineers demand'.

'In the process, it helps them improve their overall competitiveness as well as profitability'.

Agilent's draft-802.11n MIMO test solution also provides an interface to connect the device-under-test to a golden radio.

This 19-inch rack-width setup enables calibrated multi-channel receiver tests and uplink/downlink throughput testing.

When coupled with N4010A's parametric tests, these capabilities provide a comprehensive test functionality which ensures product quality.

The Agilent N4010A Wireless Connectivity Test Set is flexible enough to measure the latest emerging wireless standards.

As a versatile multi-format wireless connectivity test solution, it can be configured to meet the needs of today's Bluetooth, Bluetooth EDR, WLAN 802.11a,b,g and n and ZigBee applications.

New capability for spectrum analysers

Agilent Technologies has introduced a new Time Division - Synchronous Code Division Multiple Access (TD-SCDMA) measurement capability for its PSA Series high-performance spectrum analysers

Agilent Technologies has introduced a new Time Division - Synchronous Code Division Multiple Access (TD-SCDMA) measurement capability for its PSA Series high-performance spectrum analysers - the industry's first and only test and measurement solution for analysis of HSDPA/8PSK signals over TD-SCDMA. This measurement capability enables RandD engineers to quickly and efficiently troubleshoot and analyse complex time-varying TD-SCDMA signals, thereby significantly speeding time to market. TD-SCDMA is the official 3G mobile telecommunications standard in the People's Republic of China.

It combines TDMA and spread-spectrum CDMA technologies.

Agilent's new measurement capability for TD-SCDMA is comprised of two different measurement personalities.

Option 212, TD-SCDMA Modulation Analysis, troubleshoots and measures the quality of TD-SCDMA modulated signals, while Option 213, HSDPA/8PSK Modulation Analysis, troubleshoots and measures HSDPA/8PSK channels over TD-SCDMA.

Featuring pass/fail indicators, these measurement personalities allow the engineer to quickly verify conformance to the TD-SCDMA standard.

'As a true leader and innovator in test and measurement solutions for new and emerging communication standards, Agilent is fully committed to supporting the TD-SCDMA market in China,' said Guy Sene, vice president and general manager of Agilent's Signal Analysis Division.

'That commitment is demonstrated today as we become the first and only supplier to provide analysis of HSDPA/8PSK signals over TD-SCDMA.

This capability will enable today's RandD engineers to stay on the leading edge of wireless standards, while quickly moving forward to TD-SCDMA deployment'.

The Agilent PSA Series spectrum analszer offers high-performance spectrum analysis up to 50 GHz with a leading-edge combination of analysis bandwidth, flexibility, speed, accuracy, and dynamic range.

These capabilities, coupled with the PSA Series' powerful one-button measurements, make it an innovative and comprehensive solution for RandD and manufacturing engineers in cellular and emerging wireless communications, aerospace and defence.

Sunday, December 10, 2006

Current thinking on testing protective earthing

Jim Wallace, research and technology manager at Seaward Electronic, looks at the merits of using 25A and 200mA currents to test protective earthing conductors in electrical and electronic appliances.

Jim Wallace, research and technology manager at Seaward Electronic, looks at the merits of using 25A and 200mA currents to test protective earthing conductors in electrical and electronic appliances. Debate in the appliance industry on the most appropriate test current for checking the integrity of the protective earthing conductor has been around for many years. Historically a higher test current of 25A has often been favoured on the premise that it will best detect any damaged conductors present.

In addition, when analogue instruments were widely used for low resistance measurement, it was often necessary to use high test currents to produce sufficient voltage drop across the sample to generate the necessary needle deflection.

With modern electronics this is no longer necessary and more recently, given the growth in popularity of portable hand held test instruments, others have come to prefer a lower test current of 200mA as a means of eliminating any risk of damage to the equipment under test.

In reality, the different test currents both have their merits and the IEE Code of Practice for In-service Testing and Inspection of Electrical Equipment recommends both 25A and 200mA.

However, for routine testing and testing after repair of appliances and testing of fixed installations, the majority of European standards now specify a test current of 200mA.

Protective earthing conductors are designed to prevent electric shock by allowing the passage of electric current under fault conditions.

In Class I electrical equipment the protective earthing conductor resistance needs to be of sufficiently low value to prevent the voltage on external metal parts rising to a level where the shock potential presents a hazard to life.

A variety of national and international standards define a maximum acceptable level of resistance of a protective earthing conductor.

These standards not only specify the maximum resistance values but also define the test current, the open circuit voltage and the duration of that test.

With any item of electrical equipment it is likely that the protective earthing conductor will comprise various lengths of flexible cable linking the equipment to the point of electrical supply.

It is also possible that various types of switching mechanism may exist including relays and electrical switches.

Any measurement of a protective earthing conductor will therefore encounter both bulk and contact forms of electrical resistance.

Both these types of resistance can have implications on the use of different test methods with varying currents, voltages and time durations.

Bulk resistance is the material along the conductors' path.

This will tend to be constant although it will be affected by temperature and in certain cases by physical pressure.

Contact resistance, however, is a variable resistance that occurs at the interface between two conducting surfaces.

Contact resistance is made up of constriction resistance and film resistance and will be dependent on the contact force between the two surfaces in contact.

Careful inspection of the contact interface between two conducting materials will show that surfaces that may appear flat and uniform to the naked eye will invariably comprise a series of rough peaks and valleys when viewed under a microscope.

In reality, the two mating surfaces will therefore only make contact with each other where the surface peaks (asperites) meet and the actual surface area of this real contact area is typically much smaller than may be apparent.

In these circumstances constriction resistance occurs as the electrical current is channelled through small point contacts that occur at these peak points or interfaces.

Layers of oxide and dirt that are formed on the material's surface also create film resistance.

These oxides have higher resistance than the conducting material on either side of the junction.

The impact of these different types of resistance can therefore have significant impact on the results obtained from varying levels of test current.

It follows, therefore that irrespective of the test current, contact resistance between the test probe and the appliance under test can give a variation in measurement performance.

It is therefore important to ensure a secure connection to the equipment under test.

The perceived benefit of the relatively high 25A test current is that it will be capable of overcoming the implications of film resistance.

However, and conversely, excessively high levels of test current will cause temperature rise throughout the protective earthing conductor path.

If applied long enough will have a significant impact on the resistance value measures.

In the event of a damaged protective earthing conductor, where several strands are broken, a high current test may also detect the damage by 'fusing' the cable.

Fusing occurs due to the heating effect of the test current - the current flows, generating heat and the wire melts apart resulting in an open circuit.

The fusing action is produced by a temperature rise in the cable and it therefore takes a finite time for the cable to fuse.

The temperature rise and hence the ability to fuse a damaged cable depends upon the test current and the test duration.

In protective fuses this is referred to as the I2t rating.

The higher the current or the longer the test duration the higher the probability of fusing the damaged cable.

The probability of the test fusing a cable with broken strands will therefore depend on: a) how many strands are broken b) the magnitude of the test current c) the duration of the test The purpose of the earth continuity test is to ensure that accessible conductive parts, which rely upon protective earthing as a means of protection against electric shock, are connected to the protective earth of the supply.

There may also be accessible conductive parts which are protected through other means such as double insulation or protective impedance but which are connected to protective earth for functional reasons such as signal screening.

These earth paths may not be designed to carry high currents and passing a high test current through them may therefore result in damage to the equipment under test.

A 200mA test current is rapidly becoming the European standard for in-service testing and testing after repair.

In particular, those test instruments that comply with the requirements of EN61557-4 are capable of making accurate resistance measurements using a 200mA test current.

The use of a lower test current such as 200mA also reduces or eliminates the risk of damage to the EUT caused by passing high test currents through paths to ground that are not intended to provide protective earthing.

One of the reasons often provided for the use of a higher test current is that the resistance values being measured are in the order of 0.1 ohms and, in principle, a higher test current will aid the measurement process.

However, this particular argument loses some of its merits with the development of modern test technology that enables very accurate resistance measurements to be made using low test currents.

This work has been pioneered by Seaward Electronic in the form of a new-patented high intensity pulse or spike test that overcomes the previous contact resistance problems that inhibited the wider application of protective earth testing using 1A or 200mA test currents.

As a result the new concept successfully conquers variations in measurement that can be caused by weak contact resistance between the test probe and the appliance under test, for example, when measuring continuity of tarnished or corroded parts such as a kettle element or in detachable IEC power cables.

Importantly, the unique low current test technology introduced by Seaward enables valid earth continuity tests to be carried out using battery powered testers, significantly increasing the portability and versatility of hand held testers and speeding up the testing process.

This new test feature is now incorporated across all instruments in the company's new PrimeTest range of hand held portable appliance testers.

In summary, both 25A and 200mA are recommended internationally as a valid test current for the in-service inspection of electrical equipment and both are of value to electricians and test engineers.

However, a high test current doesn't necessarily detect a damaged PE path and does not always give better accuracy.

In addition, modern electronic technology means that low current testing can now be applied more effectively than may have been the case in the past.

Whatever the test current, contact resistance is an ever present variable.

However, a short duration high current spike prior to a 200mA test can overcome such problems.

Entry level portable appliance safety checker

The latest addition to the Seaward Primetest range of safety testing instruments for electronic and electrical appliances is a hand held portable appliance checker.

The latest addition to the Seaward Primetest range of safety testing instruments for electronic and electrical appliances is a hand held portable appliance checker. The new Primetest 50 is an easy to use basic electrical safety checker that provides an immediate 'pass/fail' indication at the push of a button for electrical appliances and equipment. The lightweight instrument is battery powered for maximum portability and incorporates clear, easy to follow operating instructions.

As well as essential earth continuity and insulation resistance tests, the checker incorporates an IEC lead test and a power socket test.

This introductory level instrument is designed for use for those with little or no electrical testing experience including maintenance staff in commercial premises, schools, colleges, care homes and the leisure industry.

The Primetest 50 is also available as part of an optional PATSolutions package that links the instrument with appropriate test accessories and test data recording software in keeping with the specific requirements of individual users.

For example, the Primetest 50 can be used with the new PDA-based PATGuard Workabout software for mobile data input that allows test results on different electrical appliances to be recorded immediately for subsequent print out or storage.

The Primetest range from Seaward incorporates a range of electrical safety testing instruments, each with different technical capabilities and test functions for use by all involved in ensuring the safety of electrical equipment used in the workplace.