Assembleon is launching a new semiconductor component placement machine which delivers high speed and accuracy for applications involving tight tolerances and critical handling restrictions

Assembleon is launching a new semiconductor component placement machine which delivers an unbeatable speed/accuracy combination for applications involving tight tolerances and critical handling restrictions. One of foremost players in SMT component placement, Assembleon has seen component dimensions rapidly reduce as cost considerations have driven the electronics manufacturing industry towards assembly of flip chips, bare dies and chip-scale packages. Because parallel trends in the semiconductor industry now see manufacturers here assembling a variety of GaAs, optical, silicon and chip components on a common substrate, Assembleon is able to introduce the D-9 component mounter for this sector based on technology already proven in the SMT marketintroduces a new version of its Advanced Component Mounter (ACM) specifically dedicated to this sector.

A combination of accuracy, speed and versatility makes the ACM D-9 Semicon the platform of choice for a wide range of applications including stacked die, multi-chip modules, multi-chip packages, flip chip in package, flip chip on foil, flip chip on board, and high-accuracy optical component placement.

Based on state-of-the-art linear motor technology, touchscreen display, and modular design, Assembleon's technology the ACM has proved a strong contender in the SMT market and is now making a natural progression to the semicon industry, where it provides verified placement throughput of 2700 flip chips per hour with 9 micron accuracy at 3 sigma, delivering performance which is unprecedented in this sector.

With capability for handling a wide range of hybrid fabrication applications combining flip chips and bare dies with passive components, the ACM SemiconD-9 is ideal for the packaging and module markets.

The machine accommodates up to 75 different components simultaneously, with dimensions ranging from 0.3 to 44mm square and with a vision system which can recognise ball sizes down to 70 micron.

Advanced closed-loop z-axis design provides controlled placement forces from 0.9 to 40N, or fixed placement forces from 0.06N, ideal for fragile GaAs products.

The ACM SemiconD-9 accepts numerous feeder options, including tape and reel, surftape, waffle pack, direct wafer and gel pack, and supports a wide variety of substrates including FR4, flexfoils, boats, ceramics, leadframes, carriers, and so on.

An integrated flux dipping unit, depositing a flux layer from 20 to 120 micron in thickness, is an option.

Also optional is direct wafer feeding capability handling wafer sizes from 100 to 300mm (four to 12 inches), and die sizes from 0.5 to 25mm square.

This facility accommodates up to 25 unique part numbers, with automatic wafer change and wafer expansion, adjustable anvil, and further options such as a die flipping unit, barcode reader and wafer mapping.

In order to address the semiconductor market, the ACM SemiconD-9 is Assembleon's first venture into cleanroom compatibility, with Class 1000 and SEMI S2/S8 compliance.

The machine features a Windows NT-based GUI for ease of use, and is compatible with the SECS/GEM production management system interface.

The ACM SemiconD-9 is backed by comprehensive line engineering, set-up, ramp-up and production support worldwide.