Sunday, January 21, 2007

Hermetic microelectronic packages

CPS Technologies offers hermetic microelectronic packages.

CPS Technologies now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum, and steel, CPS' highly engineered hermetic microelectronic packages enable successful communication for military, electronics, satellite, and aerospace markets. With over sixty years of combined experience in hermetic microelectronic packaging, CPS has supplied and assembled AlSiC (aluminum silicon carbide) components for use in hermetic microelectronic packages for select customers since 1987.

CPS operates in a vertically integrated 38,000 square foot manufacturing facility in Norton, MA, which is certified to ISO:9001:2000.

Providing quality assurance testing to MID-STD 883 and MIL-STD 202, CPS is compliant to DFARS clause 252.225-7014 ALT.1.

CPS' test and plating capabilities include Electrolytic Nickel per QQ-N-290 and ASTM B-689, electroless nickel per Mil-C-26074E and ASTM B-733, and Gold per ASTM B-488 and Mil-G-45205C.