con:card+ is a new quality seal for MicroTCA and AdvancedTCA connectors, which helps to deliver a significant increase in the reliability of these systems.

con:card+ is a new quality seal for MicroTCA and AdvancedTCA connectors, which helps to deliver a significant increase in the reliability of these systems. Jointly developed by HARTING Electronics and Co KG and ept and Co KG, con:card+ features a number of technical innovations, including a feature known as GuideSpring for reliable positioning, especially smooth contact surfaces, wear-resistant coating, relaxation-resistant material and rugged press-in connection. The selection of suitable connectors is an essential and decisive factor in ensuring the reliability of AdvancedMC modules.

In order to reach the target availability of 99.999% , all system components must be carefully co-ordinated, and they must function reliably.

Otherwise, it becomes virtually impossible for PCB manufacturers in series production to meet the strict tolerances for the AdvancedMC modules as defined in the respective specifications.

Just a single card with tolerances slightly larger than allowed by the specifications can lead to a system breakdown.

Now, however, the GuideSpring concept used in con:card+ offsets these tolerance deviations by constantly pressing the module against the opposite wall.

As this is displaced towards the middle, the slot is optimally designed for the AdvancedMC module, and the mating reliability is greatly increased.

In addition, the GuideSpring secures the module position against shock and vibration, preventing loss of contact and surface wear.

The specification for the AdvancedMC entails 200 mating cycles for a module.

The nickel/hard gold layer on the relatively soft copper can only stand up to this high load if the contact surface is absolutely smooth.

This is the case with the con:card+ connector.

With years of experience in stamping techniques and the utilisation of high-performance stamping tools with special process components, HARTING and ept are actively involved in minimising gold pad wear.

In order to better meet the high requirements placed on the connectors, a palladium/nickel (Pd/Ni) surface with additional gold flash is used.

As a result, wear resistance is increased by roughly 30%.

Even when applied very thinly, Pd/Ni surfaces offer a quality and corrosion-resistant coating that meets the high requirements placed on the connection far better than pure gold.

Unlike conventional mating systems with male and female connectors, the AdvancedMC module has only one contact tongue per contact.

In order to ensure a permanently reliable contact, this single contact tongue must press against the gold pad with sufficient force throughout the unit's entire lifetime.

In addition, the thickness of the AdvancedMC modules may fluctuate by +/-10%.

To meet this challenge, HARTING and ept have used a special alloy with very low relaxation as the contact material for the con:card+ connector.

Press-fit technology results in a gas-tight, corrosion-resistant, low-resistance quality mechanical connection between the pin and the through hole of the PCB.

This remains reliably in contact and stable, even under conditions of high mechanical and thermal loads, such as vibration, bending and frequent temperature changes.

This technology offers a significant advantage over other processing techniques, and measurements have confirmed that the required transmission rates are easily attained.

The con:card+ quality seal was created by the HARTING Technology Group and ept in order to guarantee customers the best possible system availability.

All connectors are jointly developed by the two firms, and feature identical mechanical, electrical and top quality properties.

Production and sales, on the other hand, are handled independently, as the two partners are competitors.

This allows users to choose from two independent supply sources while simultaneously profiting from the two companies' bundled core competencies.