Electrical systems

Real-time clocks feature an integrated unique ID

2007-03-07T02:12:00.001-08:00

Intersil's ISL12024/25 real-time clocks feature an integrated factory-set 64-bit unique ID that is read-only and tamper-proof for increased security and reduced footprint and BOM cost.

Intersil's ISL12024/25 real-time clocks feature an integrated factory-set 64-bit unique ID that is read-only and tamper-proof for increased security and reduced footprint and BOM cost. In a tiny 8-lead package, the devices integrate a standard clock, calendar and alarm functions and also feature an I2C communication link that provides a reliable communication channel for the unique ID. The I2C communication interface is universal and communicates with all devices on the board, saving design time and simplifying the entire system.

Continuing the trend towards feature integration, Intersil's micropower ISL12024/25 RTCs are suitable for both fixed and portable applications.

This level of integration benefits the customer by reducing design cost and footprint.

The ISL12025 also adds a CPU supervisor and watchdog timer for greater BOM reduction.

With on-chip timing and crystal compensation, the devices allow tuning of the crystal frequency through the microcontroller for accurate timekeeping.

The ISL12024/25 feature automatic battery backup in the event system power is interrupted and are designed to operate with a wide range of supply voltages from 2.7V to 5.5V and in a battery back-up mode down to 1.8V.

Power consumption in either case is quite low, with typical 800nA in battery mode.

This further enhances the security and reliability of the final product by extending operation in battery mode.

The ISL12024/25 also provide 4Kbits of EEPROM with eight modes of Block Lock control.

Block Lock control allows safe, secure memory for critical user and configuration data by preventing accidental corruption of data.

The EEPROM data retention is guaranteed over 2,000,000 write cycles.

The calendar has separate registers for date, month, year and day-of-week.

The calendar is correct through 2099, with automatic leap year correction.

The 64-bit unique ID is written, verified and locked at the factory, and it is only accessible for reading and cannot be altered by the customer.

The ISL12025 has integrated power-on reset (POR) and watchdog timer functions with five selectable VTRIP levels ranging from a default level of 2.63V to 4.64V, and has a single output for RESETb.

The ISL12024 has an IRQb/FOUT pin that is software-selected to provide alarm IRQb or frequency output FOUT .

The FOUT has four frequency settings: disabled, 1Hz, 4096Hz and 32,768Hz.

The alarm can be set to any clock/calendar value for a match (for example: every minute, every Tuesday or at 5:23 AM on March 21).

The alarm status is available by checking the status register, or the ISL12024 device can be configured to provide an interrupt via the IRQ/FOUT pin.

There is a pulse mode for the alarms allowing for repetitive alarm functionality.

Offering high reliability, the devices feature a data retention figure of 50 years, and an endurance of 2,000,000 cycles per Byte.

With two non-volatile alarms and a repeat mode (periodic interrupts), other key features of the devices include internal feedback resistor and compensation capacitors, 64-position digitally controlled trim capacitor, six digital frequency adjustment settings to +/-30ppm, 512x8-bits of EEPROM, 16-Byte page write mode (32 total pages), single byte write capability, and 400kHz data transfer rate.

Target applications for the devices include utility meters, audio video equipment, modems, network routers, hubs, switches and bridges, cellular infrastructure equipment, fixed broadband wireless equipment, pagers/PDAs, POS equipment, test meters/fixtures, office automation (copiers, fax), computer products, and security-related applications.

Passive electronic components in catalogue

2007-03-07T02:11:00.001-08:00

Recent product introductions are summarised in the latest 'What's new @AVX' catalogue, available from all local AVX sales offices.

Groundbreaking patented technology and intelligent design have allowed passives specialist AVX to develop a number of exciting electronic component devices in 2006 such as FLEXISAFE Ultra Safe capacitors for high protection against mechanical cracking issues; 2-terminal Land Grid Array capacitors that offer Equivalent Series Inductance similar to 8-terminal IDCs; and CoreCap capacitors that deliver Equivalent Series Resistance down to 3mandnumber8486; at 300kHz. The company also introduced the 9175 series Wire-to-Board Strip connector for connecting individual wires to a single row of contacts using IDC technology, radically reducing assembly time thanks to a dedicated single-wire insertion hand tool. Over 60 product families have been added to the company portfolio in 2006 (amounting to 19,500 new part numbers).

These have been summarised in the latest 'What's new @AVX' catalogue, available from all local AVX sales offices.

The company has succeeded in developing a reputation for innovation and reliable technology over the years, winning five major industry technology awards in the last fifteen months, including product of the year awards for its TACmicrochip, FLEXITERM and OxiCap capacitors.

Electronics testing and production on show

2007-03-07T02:10:00.000-08:00

Contax is to exhibit at Nepcon 2007 with fourteen new products covering a full range of processes including: placement, soldering, dispensing, x-ray and inspection, storage and wire processing.

Production automation system specialist, Contax, will be exhibiting at Nepcon 2007 at the NEC, Birmingham from 15-17 May 2007. On its stand, E40, Contax will be demonstrating 14 products covering a full range of processes including: placement, soldering, dispensing, x-ray and inspection, storage and wire processing. Four new products will be launched on the stand.

These are as follows.

Universal Instruments Genesis GX-11S: the latest in the Genesis range of placment machines is the GX-11S, a high performance system designed for high-mix, low volume environments.

The GX-11S is a single beam, overhead gantry, multi-function system configured with a 7-spindle FlexJet3 and 4-spindle InLine4 HF head with 5kg placement force.

Essemtec FLX2010-MK/MKL: a complete production system for all assembly operations.

This includes the dispensing of glue and conductive adhesives together with the placement of LEDs, or other SMD components and metal domes.

Two models are available, FLX2010-MK which has a placement area of 500 x 300mm or FLX2010-MKL for larger board sizes of up to 800 x 600mm.

Speedline Camalot FX-D: aimed at the mid to high-end market, this highly flexible new dispenser can be used as a stand-alone or in-line system and can be supplied with or without a heat facility.

It can also be reconfigured in the field to meet virtually any change in requirement.

Komax Q-Tools: demonstrated by Contax for the first time in the UK, Komax Q-Tools is a suite of instruments that is fully integrated into the Komax machine operating software.

By employing Q-Tools all the defined test parameters are verified before an operator can run production.

This ensures that the correct materials are used, and to the correct parameters, so dramatically reducing the amount of scrap produced.

In all, Contax will be exhibiting 3 placement systems on its stand.

In addition to the new Genesis GX-11S and FLX2010 MK/MKL, the popular Universal Instruments AdVantis system will also be featured.

For soldering applications, Contax will be demonstrating the Pillarhouse Jade selective soldering system for the first time in the UK.

Furthermore, it will be showing the popular ATF wave soldering machine and Essemtec RO300FC convection reflow oven.

Dispensing systems on show include the new Speedline FX-D dispenser, together with the popular Speedline MPM AccuFlex stencil printer.

For x-ray and inspection solutions, Contax will be displaying the the Omron VT-RNS automatic optical inspection (AOI) system and the phoenix/x-ray nanome/x high resolution x-ray system with CT capability.

Storage products include the recently launched Essemtec CSS4050 SMD tower holding over 500 component reels with automatic retreival and return along with the McDry MCU-301 humidity cabinet.

Finally, a new Komax wire processing system will available on Contax's stand.

The recently announced Alpha 455 'swivel' style crimp-to-crimp machine will be on show for the first time in the UK, and will incorporate the new Komax Q-Tools.

'This will be our best Nepcon ever,' said Mike Rapson, Managing Director at Contax .

'We have a wide ranging selection of products from the world's most innovative and successful suppliers, such as Universal Instruments, Speedline and Komax.

'We are now able to design and provide a full production line for any manufacturer - from small CEMs to large OEMs.

At our stand at Nepcon, we will be presenting a small snapshot of offerings, but will have our consultants available to provide information on all our systems, or advice on any specific production issue,' he said.

Low insertion force connectors assemble easily

2007-03-07T02:07:00.000-08:00

A drop-in replacement for common low insertion force connectors makes mis-mating impossible, says Hypertec of its HDL Series of low insertion force (ZIF) connectors.

Hypertac's HDL Series of low insertion force (ZIF) connectors combine high reliability and ease of assembly with mating cycle performance. Designed for use in exacting applications that require a high-quality electrical connection with frequent mating and unmating, the HDL series is a drop-in replacement for commonly used ZIF connectors. Environments such as military and industrial test and measurement, medical, transportation and telecommunications testing are highly intolerant of component and assembly failure, requiring the excellent levels of reliability and repeatability provided by the HDL Series.

The connectors can withstand 10,000 mating cycles, a performance increase of 50% more than standard contact technology.

Rapid mating and unmating is ensured by Hypertac's 180deg half-turn positive locking system and the provision of an extra guide pin eliminates any possible mis-mating.

Two Polarisation keying options allow users to create up to 36 unique keying options, preventing damage to pins and connectors, and hence reducing downtime and enhancing system reliability.

The HDL Series uses Hypertac's proprietary Hyperboloid contact system to achieve a high current rating of up to 4A, low contact resistance of 7m, and low insertion force of just 0.28N.

These self-cleaning contacts also ensure excellent performance under vibration.

Connectors are available with 156, 96 and 60 positions, at a pin pitch of 2.54mm and a contact diameter of 0.6mm.

They are rated for use across the -55 to +125degC temperature range.

As well as providing a dramatic increase in product performance when compared to existing alternatives, Hypertac also offers a flexible and responsive supply chain solution that can guarantee customers access to products when and where they are required.

The HDL Series is available immediately ex-stock via Hypertac's distribution partner Charcroft Electronics.

Shielded connectors for rail-transport application

2007-03-07T02:03:00.000-08:00

A shielded version of the modular HyperMod connector from Hypertac meets the emerging needs for high-speed signal interconnections in railway applications.

Hypertac has announced a shielded version of its modular HyperMod connector to meet the emerging needs for high-speed signal interconnections in railway applications, such as the communication networks made available to passengers within coaches. Its shielding effectiveness meets the exacting EMC requirements of railway environments. The HyperMod shielded modular connector was designed to respond to the growing need to protect signals against electromagnetic interference, driven by the growing use of electronic devices in mass transportation.

The continuous increase in transmission frequencies makes equipment more susceptible to such effects.

The shock-proof aluminium shell of the shielded HyperMod is protected by an environmentally-friendly (RoHS-compliant) conductive plating of trivalent chromium.

The sealing gasket, made of conductive elastomer, ensures shell-to-shell continuity.

The two locking devices available, either with a double lever or with screws, compress the seal to establish perfect grounding.

Encapsulating electronics with polymer compound

2007-02-27T21:54:00.002-08:00

The encapsulation of ignition distributors requires special materials and a dispensing system with precision temperature controls and exact material metering.

The encapsulation of ignition distributors requires special materials and a dispensing system with precision temperature controls and exact material metering. Manufacturers of sensitive electronic components often use an encapsulating compound to guard against dust, moisture and vibration. This under-hood application involves the protection of an ignition module against environmental factors and the high voltage output of the ignition system.

As vehicles become dependant on computer chips and electronics, it become important to protect these components against the constant heat, moisture, oil, dirt, vibration and in this case - high voltage.

The requirements are very demanding: the encapsulating compound that fills the distributor modules must act as a high quality insulator protecting the electronics from continuous high voltage.

The material must not contain any air inclusions (bubbles).

Bubbles lead to sparking which destroys the printed circuit board in the distributor.

This encapsulating compound consists of two parts; one is filled with a glass fiber.

Kern-Liebers Dispensing Technology developed a solution for this very difficult application in cooperation with the automotive component supplier.

During system development, attention is focused on temperature monitoring since acceptable results can only be obtained when specified temperatures are stringently maintained.

System temperature is continuously monitored at twenty measuring points and corrected if necessary.

Both material reservoirs are temperature-controlled, one at 80 degrees, the other at 60 degrees Celsius preventing the formation of bubbles and allowing the material reach the required fluidity.

A vacuum system used in the reservoirs reduces the pressure to 3 millibars removing trapped air bubbles.

The parts are pre-heated to 60 degrees Celsius, ensuring the mixed material retains it fluidity during dispensing.

The material is fed to the mixing unit by a reliable and proven media transfer system.

This system and all transfer hoses are temperature-controlled, keeping the material flowing properly.

A material ratio of 1:1 is precisely mixed with Kern-Liebers metering pumps ensuring an accurately mixed final compound.

Curing takes place in two, five-meter continuous furnaces, the first at 80 degrees and the second at 120 degrees.

Overly high temperatures are also not permitted since the module electronics are temperature sensitive and can be ruined by excessively high temperatures.

The system controller has the temperature indicators along with pressure sensors for the material reservoirs.

The operator keeps all system data in sight because it is displayed on a monitor at the loading and unloading position.

Kern-Liebers is a manufacturer or precision dispensing equipment with corporate offices in Schramberg, Germany employing more than 2700 employees in 21 operating companies on all continents.

Higher accuracy in semiconductor placement

2007-02-27T21:54:00.001-08:00

Assembleon is launching a new semiconductor component placement machine which delivers high speed and accuracy for applications involving tight tolerances and critical handling restrictions

Assembleon is launching a new semiconductor component placement machine which delivers an unbeatable speed/accuracy combination for applications involving tight tolerances and critical handling restrictions. One of foremost players in SMT component placement, Assembleon has seen component dimensions rapidly reduce as cost considerations have driven the electronics manufacturing industry towards assembly of flip chips, bare dies and chip-scale packages. Because parallel trends in the semiconductor industry now see manufacturers here assembling a variety of GaAs, optical, silicon and chip components on a common substrate, Assembleon is able to introduce the D-9 component mounter for this sector based on technology already proven in the SMT marketintroduces a new version of its Advanced Component Mounter (ACM) specifically dedicated to this sector.

A combination of accuracy, speed and versatility makes the ACM D-9 Semicon the platform of choice for a wide range of applications including stacked die, multi-chip modules, multi-chip packages, flip chip in package, flip chip on foil, flip chip on board, and high-accuracy optical component placement.

Based on state-of-the-art linear motor technology, touchscreen display, and modular design, Assembleon's technology the ACM has proved a strong contender in the SMT market and is now making a natural progression to the semicon industry, where it provides verified placement throughput of 2700 flip chips per hour with 9 micron accuracy at 3 sigma, delivering performance which is unprecedented in this sector.

With capability for handling a wide range of hybrid fabrication applications combining flip chips and bare dies with passive components, the ACM SemiconD-9 is ideal for the packaging and module markets.

The machine accommodates up to 75 different components simultaneously, with dimensions ranging from 0.3 to 44mm square and with a vision system which can recognise ball sizes down to 70 micron.

Advanced closed-loop z-axis design provides controlled placement forces from 0.9 to 40N, or fixed placement forces from 0.06N, ideal for fragile GaAs products.

The ACM SemiconD-9 accepts numerous feeder options, including tape and reel, surftape, waffle pack, direct wafer and gel pack, and supports a wide variety of substrates including FR4, flexfoils, boats, ceramics, leadframes, carriers, and so on.

An integrated flux dipping unit, depositing a flux layer from 20 to 120 micron in thickness, is an option.

Also optional is direct wafer feeding capability handling wafer sizes from 100 to 300mm (four to 12 inches), and die sizes from 0.5 to 25mm square.

This facility accommodates up to 25 unique part numbers, with automatic wafer change and wafer expansion, adjustable anvil, and further options such as a die flipping unit, barcode reader and wafer mapping.

In order to address the semiconductor market, the ACM SemiconD-9 is Assembleon's first venture into cleanroom compatibility, with Class 1000 and SEMI S2/S8 compliance.

The machine features a Windows NT-based GUI for ease of use, and is compatible with the SECS/GEM production management system interface.

The ACM SemiconD-9 is backed by comprehensive line engineering, set-up, ramp-up and production support worldwide.

Multi soldering tools connected up in one system

2007-02-27T21:53:00.003-08:00

A multi-tool soldering system allows up to five different bench top tools to be connected simultaneously such as soldering irons, hot tweezers and desoldering irons.

Soldering systems specialist JBC has introduced the MS 9000 multi-tool system that allows up to five different bench top tools to be connected simultaneously. This can be up to five soldering irons, five hot tweezers, two desoldering irons, or a combination of these. The system has four main components; control unit, tools stand block, electric desoldering pump and low voltage power supply.

The tools stand block, which accepts the quickly interchangeable tool modules, also has a connector for a second desoldering pump module.

The control unit monitors the complete system, enables the temperature of each tool in the stand to be set independently, displays the parameters for each tool and provides operational history such as total hours, sleep cycles and iron changes.

Features of the JBC Advanced range, including low temperature soldering and lightweight hand pieces, are incorporated in the multi-tool system.

Furthermore JBC soldering systems are not only fast, reaching working temperature in only two seconds, but new technology, it is claimed, enables tips to last up to four times longer than those of conventional systems.

Potting electronic components quickly and cleanly

2007-02-27T21:53:00.001-08:00

Designed to precisely meter, mix and dispense potting compounds for electronics applications, a programmable servo-driven dispensing system is quick, clean and cost-effective.

The programmable servo-driven Servo-Flo 302 dispensing system is designed to facilitate quick, clean and cost-effective potting operations. The state-of-the-art meter/mix/dispense system precisely dispenses metered shots or beads of a single- or two-component epoxy, silicone, urethane or other potting compound used to protect electronics from harsh operating environments, including high temperatures and moisture. Servo-Flo's servo-motor drive with high-resolution, absolute encoder feedback delivers accurate and reliable performance for the most demanding applications.

The system dispenses programmable, profiled volumetric metered shots or beads at either a selectable pre-set speed or a variable analog-input speed for integration with X-Y-Z automation.

Servo-Flo 302 produces consistent, repeatable, accurate volumetric shot sizes for flow rate profiles programmed for filling the electronic module.

The Servo-Flo 302 system also features a full-color touch-screen operator interface, positive-displacement, precision metering pumps to ensure exact mix-ratio control, Snuf-Bak No-Drip dispense valve, No-Flush disposable static mixer and many more standard features.

The dispensing system offers advanced dispensing technology fully backed by an experienced technical support team and a two-year warranty, the best in the industry.

The system is available in two models, one for single-component materials, and a second model for two-component materials.

Sealant Equipment and Engineering is a leading manufacturer of precision meter/mix/dispense equipment and valves.

Vision sensor tracks wafers

2007-02-27T21:49:00.000-08:00

Palm-sized high performance vision sensor identifies and tracks wafers through the semiconductor manufacturing process.

Cognex, the world's leading supplier of machine vision systems to the semiconductor industry, today introduced a new high performance vision sensor for identifying and tracking wafers through the semiconductor manufacturing process. The palm-sized In-Sight 1701 is an enhanced version of Cognex's industry-leading In-Sight 1700 wafer reader, offering the most advanced optics technology ever available for reading identification scribes on wafers. 'As the need to identify wafers at virtually every step of the manufacturing process becomes essential, wafer readers must offer a high degree of mounting flexibility without any compromise in reading performance,' said Peter Neve, Director of Marketing, International Operations for Cognex.

'With its revolutionary new optical system, the 1701 delivers the best wafer images possible, regardless of how close or far away the reader is positioned from the wafer.

This makes it the ideal choice for those who need the reliability of Cognex wafer ID technology in a package that can be easily integrated with a variety of process equipment types, including handlers, probers, and other tools.' With its unique optical system, the 1701 is able to provide the largest area of illumination ever available in a wafer reader.

This enables the 1701 to image heavily degraded marks on wafers, even if the wafers are misaligned due to mechanical pre-alignment errors.

Like the In-Sight 1700, the 1701 wafer reader offers robust, reliable reading performance, utilising advanced OCR, 2D matrix, and bar code recognition algorithms to read soft-marked, super-soft-marked, or hard-marked SEMI standard codes on the front or back side of a wafer.

These algorithms also provide exceptionally high read rates on wafer marks that have been affected by CMP, edge beads, copper metalisation, blue nitride coating, and other process effects.

The 1701 also features an intuitive graphical user interface for easy set up and modfication, image 'tuning' capabilities that automatically balance lighting and image filters for optimal read settings, and built-in network and serial communications for connectivity to other process tools and/or the fab network.

SMT repair and rework station covers main tasks

2007-02-23T02:17:00.001-08:00

Rework station has four modules, hot air, desoldering, pick and place and soldering, to cover the main tasks for rework and repair of through-hole and SMT printed circuit boards.

JBC's AM 6000 rework station has four modules, hot air, desoldering, pick and place and soldering, to cover the main tasks for rework and repair of through-hole and SMT printed circuit boards. The hot air system will desolder any size of surface mount component and, with the help of a range of special protectors that surround the rework component, it concentrates the heat on the IC while also protecting the remainder of the circuit. Vacuum extractors are either integral with the protectors or, in the case of the smaller protector, mounted on miniature adjustable tripods.

A medium-sized surface mount device can be desoldered in less than 20 seconds.

Furthermore when the micro hot tweezers are specified even very small 0201 components can be soldered and desoldered.

Through-hole components and pads can be cleaned with the system's desoldering iron that has an integrated vacuum pump.

A pick-and-place suction pencil is provided for component positioning and a JBC Advanced 50W general-purpose soldering iron performs the soldering.

Other hand pieces from the Advanced range are compatible with the new AM 6000.

The stands for the soldering iron and desoldering iron detect when the tool is resting and switch the tool to a sleep mode, reducing the tip temperature to extend tip life by up to five times while preventing the tip's tin plating from oxidising.

The stands also have inserters/ extractors for the tip/ cartridge units so that users can change tips quickly and without burned fingers.

Semiconductor market changes into upturn mode

2007-02-23T02:16:00.002-08:00

Companies supplying the semiconductor industry have been busy developing new products during the current downturn, and enquiries are on the way up, says company opening new office in Dublin.

Semiconductor market changes into upturn mode Companies supplying the semiconductor industry have been busy developing new products during the current downturn. The increased number of enquiries received by TUV International recently for SEMI S2 assessment suggests that companies are looking to have new models ready for the middle of next year by which time it is expected that the market will be picking up again. TUV International are able to offer Assessment to the requirements of many SEMI guidelines including Semi S2 and SEMI S8, the ergonomics guideline, from our UK office in Birmingham and our new office in Dublin.

We are able to do this in cooperation with our extensive worldwide office network covering Europe, The USA, Far East and Eastern Europe.

Clear acrylic boards help check placement accuracy

2007-02-23T02:16:00.001-08:00

Clear acrylic visual placement inspection boards enable alignment checks of surface mount components such as BGAs, micro BGAs, CSPs and flip chips to be made without X-ray or camera systems.

ind out how to register for your free copy now.

The TopLine clear acrylic visual placement inspection boards from Kaisertech enable alignment checks of surface mount components such as BGAs, micro BGAs, CSPs and flip chips to be made without X-ray or placement camera systems. The 100 x 140mm boards are 1.6mm thick and have a sticky surface, with peel-off protective cover, so that components can be temporarily placed without soldering. Turning the board over shows the accuracy of the component placement and if all the solder balls are aligned on the pads.

The components can then be removed for re-use and any adjustments required can be made to the placer and the process repeated if necessary.

These new test boards are part of the TopLine range that includes over 1000 different dummy components that can be used in set-up and prototyping to save the cost of costly real components.

There are also 75 types of practice kits to enable manufacturers to optimise SMD assembly processes.

Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype designs and demonstrations.

Clear acrylic boards help check placement accuracy

2007-02-23T01:45:00.000-08:00

Clear acrylic visual placement inspection boards enable alignment checks of surface mount components such as BGAs, micro BGAs, CSPs and flip chips to be made without X-ray or camera systems.

The TopLine clear acrylic visual placement inspection boards from Kaisertech enable alignment checks of surface mount components such as BGAs, micro BGAs, CSPs and flip chips to be made without X-ray or placement camera systems. The 100 x 140mm boards are 1.6mm thick and have a sticky surface, with peel-off protective cover, so that components can be temporarily placed without soldering. Turning the board over shows the accuracy of the component placement and if all the solder balls are aligned on the pads.

The components can then be removed for re-use and any adjustments required can be made to the placer and the process repeated if necessary.

These new test boards are part of the TopLine range that includes over 1000 different dummy components that can be used in set-up and prototyping to save the cost of costly real components.

There are also 75 types of practice kits to enable manufacturers to optimise SMD assembly processes.

Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype designs and demonstrations.

DIN rail mounting supports simplify assembly

2007-02-23T01:38:00.001-08:00

DIN rail mounting supports with a 107mm wide Eurocard size offer integral DIN rail mounting foot elements for easy snap-fit assembly while also reducing the number of parts for assembly.

Camden Electronics has extended its range of din rail mounting supports with a 107mm wide Eurocard size that offers integral DIN rail mounting foot elements for easy snap-fit assembly while also reducing the number of parts required during assembly. These features yield significant savings on production costs compared with previous generation and competitive products. The new CIME/E DIN rail mounting supports offer modular construction, easy snap-fit assembly and are suitable for mounting standard Eurocard 107mm wide PCBs.

The range has side elements of 8.25mm and centre elements of 18.5 and 35mm.

These components can be combined to make up interface supports in a wide range of widths including 16.5, 35mm, 51.5 and 53.5mm.

Larger sizes are made up by simply adding more elements.

Compared with competitive products, Camden's new CIME/E DIN rail mounting supports offer significant benefits.

For example, they do not require any brass pins for joining elements together being moulded with strong plastic pins that locate in corresponding holes on adjacent elements.

This reduces the number of components required for assembly and eliminates the need to stock brass pins.

Camden's new 107mm DIN rail supports also feature snap-fit modular construction to enable a strong assembly to be achieved no matter how many elements are used.

Competitive products often rely on friction-fit only which results in an inferior assembly.

The DIN rail mounting supports offer a further time-saving enhancement with elements that incorporate a DIN rail mounting foot in the same moulding, again reducing the number of parts required to make up a complete assembly.

The new CIME/E supports are moulded in self-extinguishing UL94-V0 industry standard green polyamide 66 and are available in grey or black on request.

They are ideal for use in any application where a PCB assembly needs to be din rail mounted including control panels, power supplies, transformers, PLC/photoelectric interfaces, safety and monitoring modules, alarm monitoring, overvoltage protection, data recording, lightning protection, fuseholders, relay modules and optocouplers to name just a few.

Besides saving assembly time and costs, the innovative design of the supports has enabled Camden to reduce the prices of its DIN rail mouldings by around 10 to 15%.

The combination of lower piece part costs, moulded pins and integral foot elements allows customers to make significant savings in production costs.

Camden Electronics' new DIN rail mounting supports are available from the company and its franchised distributors including CPC, Rapid, Arrow Electronics, JPR Electronics and Azcon Component Solutions.

Camden Electronics, based at St.

Albans, Hertfordshire, UK, is a leading manufacturer and supplier of PCB terminal blocks, fuses and fuseholders, sealed lead acid batteries, LEDs, miniature switches, interface modules, enclosures, IC and PLCC sockets and relay bases for the electronics, telecommunications, lighting, and electrical industries.

Cellular system seals electronic control module

2007-02-23T01:37:00.000-08:00

A robotised cellular sealing system has been developed for sealing three gaskets onto an electronic control module.

Changes in the economy and uncertainty in some markets change how manufacturers view the capital equipment purchase decision. lean manufacturing practices and cellular plant layouts produce these trends in plant design : * Manufacturers are using smaller, less expensive machines. * Existing machines are sometimes rebuilt or reprogrammed.

* Flexible tooling instead of dedicated tooling enables part changes without capital expenditure.

* Higher volumes can be ramped up by adding machines as needed instead of purchasing larger machines with production capabilities not required.

* Prototyping is accomplished quickly without disrupting current production.

Kern-Liebers recently developed this cellular approach to dispensing for a Tier I electronics supplier.

The connectors in the electronic control module are sealed with three gaskets to protect against dust and moisture.

The gaskets, three millimeters wide and two millimeters thick, are made of single-component silicone.

A KUKA KR 3 robot was chosen for this highly compact system due to its small dimensions and was teamed with the Kern-Liebers DG-M01 modular dispensing system.

The robot controller is linked directly to the Kern-Liebers DG-M01 PLC system.

All dispensing and robotic parameters are entered directly and monitored continuously using a single teach pendant.

A ceramic sealing nozzle makes the system practically wear-free and eliminates the need for cleaning shots during operation.

The double-sliding shuttle table is loaded and unloaded manually.

The UV curing oven is just one meter long and cures the gaskets in only two minutes.

The system was designed by Kern-Liebers USA Dispensing Technology, built in Schramberg, Germany, and commissioned in just one day at the customer's plant in Mexico.

The DG-M01, because of its modular design and control integration capability, simplified the system design process.

Programming the robot to act as the dispensing arm of the DG-M01 was accomplished quickly and accurately.

Streamlining these design considerations reduces the payback time of the system and builds in flexibility to ease any future changes in part design or sealing material.

As the program ramps up, additional dispensing cells can be added.

Model changes are accomplished by changing programs which is not difficult since the Kern-Liebers DG-M01 holds up to 99 programs in memory.

Build and debug tools for embedded projects

2007-02-15T01:26:00.003-08:00

Luminary Micro's Stellaris LM3S811 Evaluation Kit, paired with the IAR Embedded Workbench KickStart Edition development tools, has been launched by the company.

Luminary Micro, a semiconductor company that designs, markets, and sells ARM Cortex-M3 processor-based microcontrollers, announced the immediate availability of its Stellaris LM3S811 Evaluation Kit paired with the IAR Embedded Workbench KickStart Edition development tools. The IAR Embedded Workbench is a powerful set of essential build and debug tools for embedded projects using both C and C++. The KickStart Edition allows projects of up to 32KB code size, enabling users to take advantage of the power of the Stellaris LM3S811 ARM Cortex-M3-based microcontroller.

'The KickStart Edition of IAR's Embedded Workbench - with its generous 32KB evaluation limit for code - combined with one of Luminary Micro's most popular hardware evaluation platforms provides a powerful platform for users to put the kit to full use doing real work,' said Luminary Micro Chief Marketing Officer Jean Anne stand.

Measuring just 3.5' by 1.5', the Stellaris LM3S811 Evaluation Kit is exceptional for its compactness and versatility, spanning the design spectrum from evaluation to prototyping to application-specific design by functioning as both an evaluation platform for the Stellaris LM3S811 microcontroller and a serial in-circuit debug interface for any Stellaris microcontroller-based target board.

The kit features: 50 MHz Stellaris LM3S811 ARM Cortex-M3-based microcontroller, 96x16 pixel OLED display, User-programmable push button and LED, Convenient reset push button and power indicator LED, Thumbwheel potentiometer input to the on-chip ADC Serial in-circuit debug interface over USB, Stellaris Peripheral Driver Library, which provides a convenient, no-hassle method of initializing, programming, and controlling peripherals on Stellaris microcontrollers, The KickStart Edition of the IAR Embedded Workbench for ARM supporting up to 32KB code size, Port and example application using FreeRTOS.org small footprint real time operating system, Stellaris CD packed with datasheets, schematics, applications notes, and programming examples.

In addition, the IAR KickStart Edition Evaluation Kit also supports demonstration applications available for download and trial on-line.

Demonstrations include: FreeRTOS.org from FreeRTOS.org, uC/OS-II from from Micrium, CMX-RTX from CMX, EmbOS RTOS from SEGGER Microcontroller Systeme.

The board is powered over USB (cable included) and contains silk-screened through-hole-mount pin headers that can be user populated with pin stake headers for use in hardware prototyping.

utilising a standard 20-pin ARM JTAG debug cable (also included), the Stellaris LM3S811 Evaluation Kit can be used as a serial in-circuit emulator for the user's application-specific target board.

'The LM3S811 microcontroller at the heart of the kit is a representative example of how Luminary Micro has put ARM's groundbreaking Cortex-M3 processor core to use in a highly cost-effective way,' said Mats Ullstrom, Product Director at IAR Systems.

LED components, displays and LED assemblies

2007-02-15T01:26:00.001-08:00

Forge Europa, a leading UK based manufacturer of LED components, displays and LED assemblies will be showing new products .

Forge Europa, a leading UK based manufacturer of LED components, displays and LED assemblies will be exhibiting at ICE 2007. At the exhibition, Forge Europa will be launching a new range of standard and custom designed LED assemblies along with new product developments such as aLED high power LED lighting assemblies, high intensity LEDs and long life LED technology. These aLEDs consist of a high power LED mounted onto a thermally optimised substrate complete with a connector or solder pads.

This takes the headaches of thermal design away and gives an easy to use sub-assembly.

The standard aLED range consists of 1w hexagonal shaped assembly, 1w triple cluster assembly, 1w lighting strip in single colour and in red, green, blue for colour mixing, and 1w double and triple LED lighting strips.

Additionally a diverse range of standard optics giving wide, medium and narrow beam patterns in a variety of sizes can also be supplied to fit the aLED devices, thus giving the lighting or gaming and casino designer a complete solution.

Also on show for the first time will be a new 6 pin surface mount RGB device with dazzling intensities of: red 275mcd, green 580mcd and blue 190mcd.

This is a versatile LED allowing users to mix colours and create specific colours including white.

As each chip can be controlled individually this makes it possible to produce light sources that are fully dimmable with no colour shift.

This item can be supplied binned for RGB or alternatively binned for white balance for those applications where consistency of white is critical.

This part is supplied in a top LED format but has a low profile design so only measures 3.2x1.8x1.45 making it ideal for situations where space is critical such as decorative edge lighting.

These LEDs are perfect for full colour displays, full colour backlighting, and attention grabbing lighting for gaming or casino equipment.

If you have a specific LED assembly requirement, customised solutions can readily be provided to meet specific applications.

Forge Europa can design tailor made assemblies to individual specifications.

As well as new products and services, the full range of Forge Europa LED Lamps and Displays will be on show so that visitors will have the chance to see the variety of ISO 9001 quality assured optoelectronics products.

Lead-free manual soldering - check the problems

2007-02-15T01:25:00.003-08:00

Specialists have noticed that being RoHS compliant and lead-free brings all sorts of new issues - so they believe that now is the time to look at manual soldering, - such as solder/desolder tips.

Has moving to lead-free caused soldering or desoldering tip problems? The specialists at Intertronics have noticed that being RoHS compliant and lead-free brings all sorts of new issues - so if you have sorted out your machine soldering changes they believe that now is the time to look at your hand soldering, either as part of your normal assembly process, or during rework and repair. Peter Swanson, managing director at Intertronics, suggested that: 'First check that your soldering iron tips are themselves RoHS compliant.

All Plato Soldering Tips manufactured since January 2004 are tinned with lead-free solder.' Swanson also believes that higher temperatures and high tin content solders, common in lead-free soldering processes, place additional strain on soldering iron tips.

He said that: 'many of our customers report that the tip life of our competitors' product has been badly affected when going 'lead-free'.

The long life of a Plato Soldering Tip reduces tip changes, decreasing the total number of tips used and decreasing production time - and saves money.

Some have reported five times the life of their previous tip.' It has been found that it can be even worse for desoldering tips, where there is extra abrasion during use.

Plato is the one of the largest manufacturers of soldering iron tips in the world, producing tips to fit the most popular soldering irons and soldering stations.

The long life and fast heat recovery of Plato Soldering Tips increases user effectiveness and decreases production times.

This is because Plato Soldering Tips are constructed from highly conductive premium grade copper to transmit heat to the work more quickly than other brands of soldering tips.

This quick heat recovery enables more joints to be soldered per minute, thus reducing manufacturing time and costs.

Intertronics supply replacement soldering and desoldering tips for: Weller, Pace, Ersa, Hakko and Edsyn and their experience shows that using a high quality Plato Soldering Tip increases soldering speed and decreases the total cost of manufacture.

Calculating oven size for lead-free

2007-02-15T01:25:00.001-08:00

Lead-free is mandatory but ever since the earlier introduction of lead-free solder paste there has been the question of how advanced a reflow oven should be.

Kaisertech, supplier of the Dima range of ovens, says the success of a reflow oven is not measured by size or the amount of heating zones but by the ability to create every possible reflow profile. A simple calculation will help to explain what is needed. For most lead-free reflow profiles the board needs about three to five minutes in the process chambers.

For manufacturers that produce only small batches of boards the speed of the conveyor is not really important.

If the oven runs at 20cm per minute a tunnel length maximum of 100cm (20cm x 5min) is required, or if the oven runs at 40cm per minute a tunnel length maximum of 200cm (40cm x 5min) is required.

The number of zones needed is a similar story.

High throughput ovens are using several zones, but in practice these zones are set at the same temperature.

Dividing one long zone into several smaller zones makes it easier to keep the temperature uniform over a longer distance.

In theory only three zones plus one cooling zone are required (ramp-soak-peak), but in practice it is easier to create an ideal profile when adding one extra heating zone.

Both the Dima Breeze and Solano ovens have been developed to provide powerful convection heating irrespective of the size and mass of the components.

Additionally an unlimited variation of temperature profiles is achieved by tunnel designs that include four top four bottom heating zones.

Forced hot air heating maintains consistent edge-to-edge temperatures, regardless of component size or density.

To eliminate the possibility of damage caused by static both have as standard equipment an air ioniser in the cool down zone.

Pick and place unit handles 0201 components

2007-02-15T01:24:00.001-08:00

An upgrade for hybrid pick and place systems make them capable of handling 0201 components utilising a new feeder which has much better and more accurate index steps.

Striving to have to most flexible and accurate Pick and Place machine available in its range, DIMA is proud to announce the successful upgrade for their Hybrid Pick and Place Systems making it capable to handle 0201 components. Being able to handle as many different components shapes and sizes available in today's market has always been the challenge for the DIMA Hybrid Pick and Place machines. Especially for those companies that have small to medium production series of many different kind of PCBs a flexible Pick and Place machine is a must.

Not only short changeover times but also the capability to handle almost every available component is important.

The Hybrid Pick and Place machine could already handle components ranging as small as 0402 up to 42 x 42mm large components.

Even 16mm high components and 0.4mm fine pitch components are being handled without problems.

By introducing a special feeder and pick up tool the Hybrid Pick and Place is now capable of accurately handling 0201 components.

Handling the 0201 component introduces a few new issues into a pick and place machine.

The smaller dimension and lower mass of an 0201-device compared even to its 0402-cousin hold the key to the likely increase in defect rates.

Because the nozzle is almost the same size as the component, there is a higher probability of miss-picking the component from the paper tape.

Moreover, the components can also move significantly, relative to their size, in the tape, unless the tolerance between the pocket dimensions and part dimensions are tightened.

Also, electrostatic effects resulting from separating the cover foil from the paper tape have a greater tendency to displace the lightweight components before it can be picked.

Finally since the smaller component dimensions allow closer spacing on the PCB, placement resolution must be almost twice as high for 0201s as for 0402s.

DIMA has succeeded in overcoming all these points of attention for the Hybrid Pick and Place machine utilising a new feeder that uses the same body as a standard 8mm feeder but with much better and more accurate index steps.

Compared to the standard 8mm feeder this new feeder uses 6 times more micro steps with a step repeatability of 30 micron.

Furthermore a special pick up tool has been developed to accurately pick up and place the 0201 component allowing interspacing of 150 micron.

Integration of this new feeder and tool will be possible not only on a new Hybrid Pick and Place machine, but DIMA also offers the possibility to upgrade all the Hybrid Pick and Place machine of their existing customers.

During Nepcon 2006 in Birmingham, UK (May 9 - 11) and during SMT 2006 in Nuernberg (Nuremberg), Germany (May 30 - June 1), DIMA SMT Systems will live demonstrate the new Hybrid Pick and Place capabilities.

DIMA SMT Systems also manufactures a full range of stand-alone and in-line systems for the SMT industry like stencil printers, reflow, curing and drying ovens, selective Conformal coating systems and dispensing systems.

Advanced passive components in product library

2007-02-08T23:08:00.003-08:00

Manufacturer of advanced passive components AVX has developed a new software product library for use with Agilent's Advanced Design System (ADS).

Leading manufacturer of advanced passive components AVX has developed a new software product library for use with Agilent's Advanced Design System (ADS). This enables customers to perform diagnostics on circuit designs before the manufacturing process, saving time and money. ADS is a powerful electronic design automation software tool that offers complete design integration to designers of RF products such as cellular and portable phones, pagers, wireless networks, and radar and satellite communication systems.

ADS features design links for RF architecture applications to generate complex, high-frequency systems and circuit designs faster.

'This library of AVX parts works in conjunction with Agilent's ADS software to assist design engineers and ultimately simplify and speed up the design process' said Larry Eisenberger, AVX senior field applications engineer.

With a complete set of simulation technologies ranging from frequency- and time-domain circuits to electromagnetic fields, ADS lets designers fully characterize and optimise designs.

The single, integrated design environment provides system and circuit simulators, along with schematic capture, layout, verification capability - eliminating the stops and starts associated with changing design tools mid-cycle.

AVX's ADS library includes 0402 to 1210 Accu-P capacitors, 0402 to 0805 Accu-L capacitors, 0402 and 0603 LGA couplers, 0603 and 0805 surface mount couplers, 0603 and 0805 low pass filters, and 0805 3dB couplers.

PCB assembly equipment for space science

2007-02-08T23:08:00.001-08:00

Contax has supplied PCB assembly equipment to the Mullard Space Science Laboratory (MSSL), a department of University College London, and the UK's largest university space research group.

Production automation system specialist, Contax , has supplied PCB assembly equipment to the Mullard Space Science Laboratory (MSSL), a department of University College London, and the UK's largest university space research group. MSSL has installed an Essemtec FLX2010V placement machine, Essemtec SP003 stencil printer and McDry humidity cabinet. These will be used in the manufacture of instrumentation for use in space.

Gary Davison, Head of Electronic Construction and Inspection at MSSL explained, 'We had been trying to get funding for this equipment for some time, and when we finally received it, we went to Nepcon to review our options.

'There is a demand for components that are used in space instrumentation to get smaller and lighter, so that the cost of the launch is reduced.

This meant that we needed to upgrade our equipment to meet this demand.

Previously everything was hand soldered, but with the new smaller components, such as the 0805 and 0603, it was getting harder to do this'.

He continued, 'Our equipment is very specialised and it can take up to a couple of weeks to build one board as all the components have to be repeatedly tested, verified and examined under a microscope.

There is no room for error when you are building instruments for use in space.

It is expected that the instrument will be up there for 10 years or more and we can't just go up and replace a component if it goes wrong.

Consequently, each component can cost up to GBP10,000, and we don't keep spares'.

MSSL were therefore looking for a tried and tested system that could offer total accuracy and repeatability.

Vision was an important feature for the placement machine, as MSSL needed to calibrate it to very precise measurements.

The FLX2010V relies on a combination of laser and vision centreing systems, with an integrated feeder management system automatically recognising the feeders and pickup position.

The final criteria was that the machine had a small footprint.

MSSL is based in a converted victorian mansion and space was a critical factor in the selection of their equipment.

'We chose the FLX2010V because it offered everything we needed,' said Gary Davison.

'It has all the functionality and features that we wanted - and room for future proofing,' he added.

In addition, MSSL purchased the Essemtec SP003 stencil printer and McDry humidity cabinet.

'We needed a good, sound system that offers repeatability.

We felt that the Essemtec could provide that and more,' continued Gary.

'And the humidity cabinet ensures that we can store semi-conductor flight components in a safe environment.

They are far too valuable to damage,' he explained.

Summing up, Gary Davison said, 'The equipment is now in use and we have been very happy with it.

Contax sorted out initial teething problems promptly and we would definitely use them again.

High performance silicone cables

2007-02-08T23:07:00.003-08:00

Now available from Quadrant is a range of high performance, high temperature silicone cables from German company HEW, a leading manufacturer of cables and wires for high temperature applications.

Now available in the UK from Quadrant is a range of high performance, high temperature silicone cables from German company HEW, one of Europe's leading manufacturers of cables and wires for high temperature applications. HEW carries out its own silicone compounding allowing them to offer a wide range of cables designed to meet specific customer requirements in terms of resistance to high temperatures, notches, tearing, flame, high voltage and hot steam sterilisation. Silicone rubber cables are highly resistant to extremes of temperature; retaining their physical properties over a temperature range of -50C to +180C and for short periods up to 250C.

The HEW range offers single core or stranded conductors manufactured from either bare copper or tin, nickel or silver plated copper.

Screened and unscreened single, multicore and twin-flat versions are available as are armoured, glass fibre versions and halogen free and flame retardant types.

These cables will find application in domestic appliances, lighting, shipbuilding, the automotive industry, mechanical engineering, medical equipment, heating equipment, nuclear power plants and as high voltage and fire security cables.

Curing adhesive for vehicle lighting assemblies

2007-02-08T23:07:00.001-08:00

A new UV/visible light curing adhesive for vehicle lighting assemblies is now available to bond an expanded variety of engineering plastics.

A new UV/visible light curing adhesive for vehicle lighting assemblies is now available to bond an expanded variety of engineering plastics. Intertronics have introduced the DYMAX 3-20469 which features fast cure speeds and the ability to cure through clear, UV blocked plastic and offers advanced features for a variety of vehicle lighting assembly applications. It cures through large gaps and forms excellent bonds and seals on assemblies with unusual shapes and less than perfect fitting joints.

In addition to headlamp assembly, other vehicle lighting applications for which UV cure adhesives have been used successfully include tail lights, fog lights, and side lighting.

DYMAX 3-20469 passes Ford's Headlamp Performance Tests (Ford WSS-M11P28-B2).

Structural adhesion to plastics and other construction materials means that a smaller amount of 3-20469 adhesive may be used than with some other types of adhesives and sealants, such that some manufacturers have reported this allows for a larger reflective area and consequent increased lamp brightness.

3-20469 cures in seconds upon exposure to a high intensity UV/Visible light.

Fast cures, ease of dispensing and in-line quality control capabilities allow for fast parts processing, ease of automation, JIT assembly, reduced work in progress, lowered energy costs and increased throughput, while avoiding off-ratio rejects and reducing the manufacturing footprint.

The one part 'cure on demand' approach to adhesive technology eliminates pot life and hazardous waste concerns.

Also available from Intertronics are adhesives for lens bonding, vent-hole sealing, lead tacking, bulb positioning and fixturing and various associated electronic coating applications.

High temperature grades are offered that withstand the heat generated in close proximity to bulbs for positioning and fixturing applications.

Some of the physical properties of these vehicle lighting adhesives include a wide range of viscosities, elongation from 20 to 300%, excellent thermal and mechanical shock, vibration, and moisture resistance characteristics.

The products have shown superior durability during extensive road testing under harsh environmental conditions.

Relays, switching and indication components

2007-02-08T23:03:00.000-08:00

Switchtec has reported record trading figures.

Switchtec has reported record trading figures for 2006. The specialist distributor of relays, switching and indication components' turnover has increased by 20% compared to the previous year. Sales Director Jeremy Lester said, 2006 has been an excellent year for the company.

In fairness, it started slowly but by mid year the situation had improved greatly.

August is usually a relatively quiet period for us, as a number of our suppliers are based in Italy and historically they shut down during August.

That can create a situation where we are without deliveries, so we have to pre-empt requirements and order in advance, but we can still loose out.

However, one of our overseas European suppliers Telergon, did not close this year, and Euroclamp, a major supplier to us, will not close during 2007.

So August was busier than normal, and order levels in September and October were very good.

November was our best month for five years, more than 25% over target.

Switchtec changed its relay supplier three years ago, deciding to take relays from the mighty Hongfa in China.

Continues Lester, Although we have never been bound to one supplier for relays, basically we had been using our biggest relay supplier for over 15 years.

So although we were very confident in the Hongfa product, taking it to market after a long term relationship with another supplier was a little daunting at first.

We have worked very hard marketing the Hongfa brand in the UK and I'm very pleased that the relationship is now bearing fruit, the range has been well accepted, and as our biggest franchise it is still maturing nicely.

Buyers now ask for the Hongfa product by name, and we have won several new customers in this key product area for Switchtec.

As well as the success of Hongfa relays, other new business areas are contributing to our success such as our own SCL timers and LED indicators.

Those ranges contributing to complete most project packages that our customers may require.

Switchtec has also increased its turnover in certain business areas.

Continues Lester, In particular, we have noticed an increase in orders from panel builders as opposed to straightforward OEM business.

EMC compatibility simulation reduces testing costs

2007-01-30T23:39:00.003-08:00

Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument.

Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument. EMC is a major design challenge in cockpit instruments because they have a clear face which makes them difficult to shield. FLO/EMC electromagnetic simulation software from Flomerics enables Thales engineers to evaluate its products' radiated emissions and susceptibility during the early design stages.

'We use FLO/EMC to identify and fix EMC problems prior to the prototype stage, usually by improving the shielding,' said Julien Blanc, EMC Specialist for Thales CDS.

'As a result, this eliminates the need for late-stage design changes which in turn saves money by avoiding the need for modification of prototypes and additional testing.' Thales is a leading international electronics and systems group that employs 60,000 people in 50 countries.

Thales makes a wide range of cockpit and display systems for military and commercial aircraft.

EMC is usually a major concern in the design of these systems.

For example, engineers need to ensure that emissions from the display do not interfere with radio communications or radar-based collision detection systems.

In the past, these concerns were addressed by building prototypes and testing them for EMC compliance.

This often required expensive fixes on the existing design.

In any case, the prototype had to be modified or re-built from scratch and the testing process had to be repeated.

This was expensive and in some cases had an impact on the product launch date.

To improve the design process, Thales evaluated several different electromagnetic simulation methods.

'We evaluated the major calculation methods and the leading software packages,' Blanc said.

'We selected FLO/EMC because its predictions consistently matched our physical testing results and it is easy to use.' For example, in a recent experimental study, FLO/EMC predicted that radiated emissions at 160 MHz would be 33dBuV/m in the far field and 95dBuV in the near field.

Actual measurements were 35dBuV/m in the far field and 92dBuV in the near field.

FLO/EMC uses the Transmission Line Matrix (TLM) method for solving Maxwell's equations, which solves for all frequencies of interest in a single calculation and therefore captures the full broadband response of the system in one simulation cycle.

In a recent application, calculated resonant frequencies for a cockpit instrument perfectly matched the test results for the same polarization.

This insight quickly led to the design change of putting conductive material on vertical slits in the side cover of the cockpit instrument.

Re-running the simulation showed that this solved the problem.

The result was that the very first prototype met EMC specifications.

'We have used FLO/EMC to simulate seven recent products and in each case we have found and fixed EMC problems in the qualification stage,' Blanc said.

'Fixing problems in the early stages of the project is much less expensive because it avoids the need for building and testing additional prototypes to evaluate potential fixes.'

Robotic dispensing and mixing/degassing equipment

2007-01-30T23:39:00.001-08:00

Intertronics will be showing how to solve adhesives problems at the Southern Manufacturing Show at Thorpe Park.

If you specify or use adhesives then you really need to meet the adhere people at Intertronics - and the Southern Manufacturing Show at Thorpe Park on February 7th and 8th is a great place to do just that. New products from Intertronics include low cost robotic dispensing and single process mixing/degassing equipment. The IandJ7100 bench top Cartesian dispensing robot is an ideal choice when cost and bench space are important considerations.

With prices starting at circa GBP4K this brings robotic dispensing within reach of small assembly shops, specialist manufacturers and dedicated project cells within larger companies - ideal for subcon production.

It will be of interest to producers of all kinds from instrumentation, electronics, sound systems to decorative and display industries where flexibility and cost are vital factors.

The IandJ7100 handles a dispensing area of 200mm x 150mm and is capable of storing up to 100 different programs, but takes up less than 1/2 metre on the bench.

It is ideal for dispensing adhesives, coatings, gaskets, potting, filling and shielding materials to a resolution of 0.02mm.

The IandJ7100 offers 3 axis continuous path or point to point operation using dots, lines, arcs and circles, with full step and repeat copy functions and automatic offset calculations.

Implementation is simple, as is 24/7 operation with 'quick fluid' purge function and 100 program capacity - each with up to 4000 points.

Mixing and degassing of materials such as precious metal pastes, pharmaceuticals or optical adhesives is generally a two-part process taking a very significant amount of time, especially when product pot life can be measured in minutes - Intertronics have changed all that with the introduction of their Thinky ARE-250.

This patented benchtop planetary mixer is proven in Japan and the US with many thousands installed in laboratories and electronics manufacturing facilities.

The Thinky technology is now available CE marked - says Peter Swanson, MD at Intertronics - 'the ARE-250 mixes, disperses and degasses down to micron level without a vacuum and in the customer's own pot.

It is ideal for expensive material mixes such as filled epoxies for die attach and for materials of variable viscosities.' Indeed, the ARE-250 may be used to formulate and mix adhesives, sealants, molding compounds, lubricants, slurries, coatings, inks, paints, abrasives, bio chemicals, cements, medical compounds, cosmetics/personal care materials, detergents, conductive pastes, dental materials, foods, construction materials or any other materials which are hard-to-mix, hard-to-degass, or hard-to-wet.

Typical applications include epoxies and polyurethanes, especially where optical clarity or thermal conductivity must be maintained (by eliminating bubbles).

The benefits of the ARE-250 can especially be seen in time critical situations such as two-part polyurethane with an isocyarate component and a pot life of around 10 minutes - single process mix and degassing relieves the pressure on the operative and the process by ensuring the adhesive is workable for maximum possible time.

The whole mixing/degassing can be done in a much reduced time frame of seconds to minutes dependant on materials.

ARE-250 also mixes gold leaf particles, glass micro-spheres, aluminium oxides and nano-particles and provides 5 program memories, each with 5 process profiles available.

These are operator determined and programmed in for instant access.

It is found for example that some materials benefit from multiple mixing/degassing/mixing/degassing cycles with different timing and spin speeds at each stage.

Vertical reversed connector for quick isolation

2007-01-26T22:42:00.001-08:00

Available from specialist distributor Switchtec, Euroclamp's SVR vertical reversed connector block enables quick, efficient isolation of equipments and circuitry by way of the connector's design.

Available from specialist distributor Switchtec, Euroclamp's SVR vertical reversed connector block enables quick, efficient isolation of equipments and circuitry by way of the connector's clever design that utilises push-in female connections for power and signal terminations. Ideal for electronic housing manufacturers and PCB manufacturers/assemblers, the connectors will also find favour with OEMs, panel builders, CEMs, kitters, and the building automation industry. In lengths from 2 to 24 poles, the Euroclamp SVR connector blocks are available in a standard flangeless design, or with a flange at each end for surface mounting - for example to a PCB.

Although lots of niche applications require it, this latter type of connector is not so readily available from other manufacturers.

When mounted in the base part of an electronic housing, the SVR connector block takes all incoming power and signals wires, so that when the top half of the equipment (the electronics) is lifted off, the male connecting strip is totally isolated.

The SVR connector blocks accept standard 5mm pitch male connecting strips, either the vertical or horizontal PCB connector PV/H**-5.00, or the vertical pin strip PVS**-5.00.

With an insulation resistance of 100Mohms, a test voltage of 2kVrms/60s, the connectors are rated at 16A/250V according to EN60998, or 12A/250V to EN61984.

The SVR connector is available as standard in green, but as with all Euroclamp terminal blocks they are also available in red, yellow, blue, orange and black, and other special colours are available upon request.

Euroclamp's SVR series are CE marked and are fully RoHS compliant while UL CSA and VDE approvals are pending.

Along with all Euroclamp products, Switchtec is able to offer the SVR connectors ex stock.

Through panel terminals ease interconnectivity

2007-01-26T22:39:00.000-08:00

Euroclamp's MPT OEthrough panel terminals offer ease of installation and wiring in applications where there is a need to interconnect internal components, particularly in sectionalised housings.

Aimed at OEMs, panel builders, CEMs, equipment manufacturers, and filter manufacturers, Euroclamp's MPT OEthrough panel terminals offer ease of installation and wiring in applications where there is a need to interconnect internal components, particularly in sectionalised housings. They also offer good insulation properties and help to reduce stray capacitance problems by maintaining wiring in a more regulated, consistent fashion. Ideal for use in filters and control panels, there are twelve versions of the MPT series currently available based on the following models; the MTP275 rated at 24A, MPT410 (32A), MPT610 (41A), MPT1010 (57A), MPT1612 (76A), MPT2515 (101A) and the latest addition to the range, the 150A rated MPT5018.

Available from specialist distributor Switchtec, the MPT series is supplied as standard in grey plastic, however Euroclamp is able to produce the terminals to order in many colours including black, green, orange, blue, red, etc.

To suit a wide range of applications, most of the MPT series are available with different termination types.

The options available are solder tag, hook, blade or screw.

Offering versatility and convenience, there are two methods of fixing the MPT series terminals to the panel; wedge comb is fast, easy and secure, alternatively a locknut style provides a more secure fixing whilst taking a little longer to fit.

Most of the MPT series have UL/CSA, VDE, IMQ and CE approvals and Euroclamp are constantly adding to or improving the range.

Euroclamp identified that there were a small number of manufacturers for this type of terminal and that demand was strong.

As a manufacturer of terminal blocks and connectors, Euroclamp used its in-house expertise to design and manufacture a range of through panel terminal blocks.

Competitively priced, Euroclamp MPT series through panel terminals are fully RoHS compliant and available ex stock from Switchtec.

Hermetic microelectronic packages

2007-01-21T23:22:00.001-08:00

CPS Technologies offers hermetic microelectronic packages.

CPS Technologies now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum, and steel, CPS' highly engineered hermetic microelectronic packages enable successful communication for military, electronics, satellite, and aerospace markets. With over sixty years of combined experience in hermetic microelectronic packaging, CPS has supplied and assembled AlSiC (aluminum silicon carbide) components for use in hermetic microelectronic packages for select customers since 1987.

CPS operates in a vertically integrated 38,000 square foot manufacturing facility in Norton, MA, which is certified to ISO:9001:2000.

Providing quality assurance testing to MID-STD 883 and MIL-STD 202, CPS is compliant to DFARS clause 252.225-7014 ALT.1.

CPS' test and plating capabilities include Electrolytic Nickel per QQ-N-290 and ASTM B-689, electroless nickel per Mil-C-26074E and ASTM B-733, and Gold per ASTM B-488 and Mil-G-45205C.

Guide to board-mounted electromechanical products

2007-01-21T23:20:00.000-08:00

Farnell InOne has launched a new online guide to board-mounted electromechanical (EMech) products giving design engineers the widest choice available in one place.

Farnell InOne, the high service distributor providing electronic products and services to millions of engineers and purchasing professionals, has launched a new online guide to board-mounted electromechanical (EMech) products giving design engineers the widest choice available in one place. With over a 1000 new products, from 30 manufacturers including Omron, Tyco, XP Power and Hammond, the EMech guide showcases the latest components including relays, switches, transformers, power supplies and enclosures, all available at www.farnellinone.com <>. The new guide is part of Farnell InOne's 'Technology First' initiative, which provides topical information on key and changing areas of core design and architecture as well as detailing the latest products to hit the market.

It follows hot on the heels of Farnell InOne's Microprocessor catalogue, which provides comparisons of development kits from leading microprocessor suppliers, and its Optoelectronics catalogue, the only industry guide to list a complete range of optoelectronic technology.

This campaign gives Farnell InOne the perfect platform to showcase its exclusive relationship with suppliers such as XP Power.

Steve Head, Sales and Marketing Director at XP, comments: 'Our relationship with Farnell InOne has grown from strength to strength and this campaign highlights their awareness of our market and our customers' needs.' Jamie Furness, EDE Development Manager at Farnell InOne, comments further: 'As new technology areas emerge and develop, it is essential that we keep our customers informed.

Technology First guides are designed to help electronic design engineers select the products they need easily and quickly.

They provide a wealth of supporting technical information, associated links and reference material available f to download at Electronics Design World.

Solvent formulation, blending, mixing, packaging

2007-01-13T23:50:00.001-08:00

CPS Chemical Products and Services is to open a new UK manufacturing facility at the European headquarters of its sister company, MacDermid Autotype.

CPS Chemical Products and Services, the leading European manufacturer of high quality, environmentally friendly chemicals, solvents and associated products for the screen and offset print industries, has announced that it is to open a new UK manufacturing facility at the European headquarters of its sister company, MacDermid Autotype. Based in Wantage, Oxfordshire, the new facility will produce the full range of CPS products and represents a significant investment for the company, which is part of a longer term programme of European expansion, designed to improve still further the quality and choice of products and the support provided to both the company's dealer network and thus to end users. In addition, the company has appointed a new Commercial Manager, Simon Jones, formerly with MacDermid Autotype, who explains that, 'The new UK plant includes a full-scale production operation, with bulk formulation, blending, mixing and packaging of solvents and aqueous products.

Just as importantly, the new operation gives us the opportunity to strengthen our research and product development resources, increase our range of technical and applications support services and, with the support of our sister company, to rationalise a number of our administrative functions in order to enhance still further our competitiveness in the European marketplace'.

CPS currently manufactures an extensive range of chemicals and solvents, stencil and ink cleaning equipment, recycling and filtration systems, for use in manual and automated screen and offset print operations.

The chemical product range includes screen adhesives, degreasers and preparation products, photo-emulsions and screen fillers, and screen cleaning and reclamation chemistry.

In each case, the company concentrates on developing products that both minimise environmental damage, during manufacture, use and disposal, and improve working conditions for screen printers, through reduced solvent emissions, the elimination of aggressive or harmful substances and the promotion of process automation.

Simon Jones adds, 'Our new UK manufacturing facility will also form our headquarters from which we can support our customers via our extensive European dealer network.

We have relocated and retained key staff from other CPS sites and will be recruiting as required to strengthen the team still further.

In addition, we have retained the services of one of the founders of CPS, Dr Charles Hansen, who is recognised throughout the industry as a leading expert on the formulation of environmentally friendly chemistry and this relationship will be vital as we begin to develop a new generation of products that will improve the screen and offset print working place still further

Information and resources for RoHS compliance

2007-01-13T23:50:00.000-08:00

Farnell InOne, the number one source for RoHS compliant products and information, has re-energised its dedicated RoHS website.

Farnell InOne, the number one source for RoHS compliant products and information, has re-energised its dedicated RoHS website, with a new RoHS First Aid Kit that provides emergency assistance to design engineers trying to meet the requirements of the July 1st law. The RoHS First Aid Kit provides access to Farnell InOne's full range of free RoHS support services. As part of the emergency support Farnell InOne's BoM (Bill of Materials) upload service now comes with a guaranteed 48 hour turnaround time, with a dedicated BoM Response Team just two clicks away, ready to take on the task of updating customer product listings with RoHS compliant alternatives.

Other essential First Aid Kit services include downloadable certificates of compliance, 'Coming Soon' - an email notification service of when chosen RoHS products arrive in stock, and advanced search facilities for sourcing the right compliant components.

Gary Nevison, head of product market strategy, Europe and Asia Pacific at Farnell InOne comments: 'In the final run up to the 1st July, Farnell InOne is committed to making conversion as easy as possible for design engineers who aren't yet ready for RoHS.

The new First Aid Kit puts all of our services in one online location readily accessible for whatever RoHS eventuality an engineer is facing.

The web site has always been a leading industry site and will continue to support engineers up to and beyond July 1st.

Electronic and industrial components

2007-01-12T23:49:00.003-08:00

Farnell InOne, the international distributor of electronic and industrial components, has launched a new 'Technology First' initiative.

To help design engineers decipher the wave of new and developing technologies hitting the electronics market, Farnell InOne, the international distributor of electronic and industrial components, has launched a new 'Technology First' initiative. The 'Technology First' series begins with the launch of a new catalogue of development kits from the leading microprocessor suppliers. The catalogue is an industry-first in providing engineers with a platform for unbiased choice and comparison, showing all the latest microprocessor offerings, such as 32-bit ARM core processors, in one place.

The twenty-page microprocessor catalogue lists development kits from ten leading microprocessor suppliers, including Microchip, STMicroelectronics, Texas Instruments and Freescale.

The wide range of kits allow engineers to develop their designs from concept to solution without incurring full-scale production costs whilst the catalogues simple format enables them to compare features and benefits alongside price and performance.

Other technologies which the 'Technology First' series will focus on later in the year include optoelectronics and power/analogue signal paths, providing topical information on a number of areas including architecture and core design.

Supporting technical information, associated links and reference material will be available to download from Electronics Design World, Farnell InOne's online community for electronic engineers at www.farnellinone.co.uk.

Jamie Furness, EDE development manager at Farnell InOne, comments: 'With so many new technologies coming on to the market, we feel it's really important to make sure that design engineers have all the information needed to make informed decisions that will help them achieve real benefit from these cutting edge developments.

We're delighted to be able to share our technical expertise and offer design engineers the support they need in adopting these new technologies.

Farnell InOne's 'Technology First' series will help engineers choose the best components to meet their design needs from the widest choice of leading manufacturers.'

Metal matrix composite end effectors are stronger

2007-01-12T23:49:00.001-08:00

End effectors made from metal matrix composite (aluminum silicon carbide), offer a lower inertial response, higher stiffness and higher strength than more traditional end effector materials..

CPS Corporation, the worldwide leader in the design and production of metal matrix composites, introduces its new end effectors for automated wafer fabrication machinery. Made from CPS' metal matrix composite, AlSiC (aluminum silicon carbide), the end effectors have the strength and stiffness of steel at one third the density. CPS' end effectors are more cost-effectively manufactured.

They offer a lower inertial response, higher stiffness and higher strength than more traditional end effector materials, such as stainless steel, molybdenum, graphite composites, and ceramic.

This makes them both ideal for the robotics and automation industries as well as hermetic vacuum compatible.

Using CPS' unique QuickCast process, the manufacturer is able to integrate functional components, such as fiber optic feeds, wafer shoes, and location pins, into the end effector during production.

The CPS AlSiC near and net-shape fabrication process both produces the composite material as well as fabricates the product geometry, resulting in a cost-effective product and that allows for rapid prototyping.

AlSiC end effectors may be coated with functional coatings including Ni plating, anodization, and Teflon impregnated anodization.

All CPS parts are custom-made to meet customer specifications.

* About CPS Corporation - CPS Corporation is the worldwide leader in the design and high-volume production of metal matrix composites.

With over 30 years combined experience, CPS engineers and scientists use a net-shape fabrication process, including patented QuickSet injection molding and QuickCast infiltration.

AlSiC components are utilized in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets.

SM component re-reeling service offered

2007-01-11T23:48:00.000-08:00

A new re-reeling service, enabling passive components to be re-reeled to individually specified quantities, suits surface mount passive components such as resistors, capacitors and inductors.

Farnell InOne, the number one source for RoHS compliant products and information, has launched a new re-reeling service, enabling passive components to be re-reeled to individually specified quantities. Available for surface mount passive components such as resistors, capacitors and inductors, the new service is ideally suited to small-scale production runs, where components normally come in large reel quantities but the build only requires a part reel quantity. The required components can now be re-reeled onto a new reel, ready to pick and place, saving time and money.

The new service from Farnell InOne will help engineers to eliminate the problem of wasted components.

No unused stock needs to be left on the machine and the associated storage problems for unused components will be eradicated.

In turn, assembly efficiency is improved and customers only buy what is needed.

The service comes complete with leader and trailer tape, securely reeled on a 7in reel and ready to go on a pick and place machine.

It is available for a wide range of passive components from many of the market-leading manufacturers including AVX, EPCOS, Phycomp, Multicomp, Murata, Welwyn and Panasonic.

Fuel cell power systems lineup

2007-01-11T23:46:00.000-08:00

Jadoo Power Systems has announced it will be showcasing its award-winning XRT and N-Gen fuel cell product lineup at the Consumer Electronics Show.

Jadoo Power Systems has announced it will be showcasing its award-winning XRT and N-Gen fuel cell product lineup at the Consumer Electronics Show (CES) during ShowStoppers CES 2007 on Monday, January 8, 2007 at 6:00 PM at the Wynn Hotel in Las Vegas. honouree of the prestigious International CES Innovations 2007 Design and Engineering Award and winner of Electronic Products Magazine Product of the Year, the XRT and N-Gen fuel cell products provide essential alternative clean power for a variety of power-hungry applications when the grid is either unavailable or unreliable. For example, during the Katrina Hurricane disaster when legacy battery and generator technology failed, Jadoo fuel cell technology was available to power critical emergency radio communications, law enforcement surveillance products, remote satellite phones, modems, walkie-talkies, and laptops.

The N-Gen and XRT provide 100W at 110VAC/12VDC of rugged portable fuel cell power.

utilising Jadoo's patented N-Stor Fuel Cell Canisters, multiple fuel runtime options are available.

The Jadoo N-Stor360 can provide 360W-h (30A-h) of predictable continuous runtime and there is no degradation or memory effect as with standard batteries.

When used with the XRT, N-Stors can deliver upwards of 2200W-h (180A-h) of runtime.

Weighing only 50 pounds, the XRT can deliver the equivalent energy of standard gel-cell batteries that weigh over 150 pounds.

Either system can now be equipped with true UPS functionality - available at anytime the 'grid' power goes down.

'We are very excited to be demonstrating the XRT and N-Gen products at the upcoming ShowStoppers CES show,' said Jack Peterson, VP of Sales and Marketing at Jadoo.

'Our commercial success with this product line is a testament to the Jadoo Power team's commitment to deliver the highest quality, best value fuel cell products available today.

Providing critical power support for emergency preparedness, law enforcement, and other off-grid applications is our company mission and to be recognised for these efforts is outstanding.

Press-in tools produced for advanced connectors

2007-01-11T03:01:00.000-08:00

Following the recent launch of AdvancedMC Type B+ connectors for AdvancedTCA use, Harting has introduced a set of press-in tools to speed their assembly onto printed circuit boards.

Following the recent launch of the Harting AdvancedMC Type B+ connectors for AdvancedTCA applications, Harting has introduced a set of press-in tools to speed their assembly onto printed circuit boards. The tools are designed for different specifications of connector: both with and without pegs. In addition, the tools can be used with PCBs both with and without the additional mounting fixture option.

The new tools can be used with all Harting manual or pneumatic presses, or with the fully automated CPM press-in machines.

The AdvancedMC Type B+ connector for AdvancedTCA is designed to meet the mechanical and electrical requirements of PICMG (PCI Industrial Computer Manufacturers Group) AMC.0.

The inclusion of the press-in option is scheduled for the next revision of the AMC.0 specification.

Wave soldering system uses lead-free alloys

2007-01-10T03:01:00.001-08:00

Wave soldering system combines proven core subsystem design with all the latest technological developments for lead-free alloys, including spray fluxing and preheat modules.

Production automation specialist, Contax, is announcing the availability of the Speedline Electrovert VectraElite wave soldering system. Following its global launch at Productronica in November 2005, this new machine is now available exclusively from Contax in the UK, Benelux and Ireland. As the next generation of its highly successful Vectra wave soldering system, the VectraElite combines proven core subsystem design with all the latest technological developments for lead-free alloys.

New features include: Optima and ServoJet spray fluxing systems, upper High Velocity Convection (HVC) preheat module, Post Wave Cooling (PWC) module, UltraFill nozzle technology, and a host of system wide improvements such as expanded system wide access, reduced ventilation requirement, and an advanced control system.

* ServoJet and Optima Spray Fluxing Systems - two newly developed advanced spray fluxing systems designed to yield optimum performance for lead-free applications.

The VectraElite benefits from the most advanced reciprocating spray fluxing systems in the industry.

This is due to its combination of the ServoJet, which provides high velocity flux jetting technology with concentric air atomisation and the Optima, which features the latest in Ultra-Spray ultrasonic technology along with its Smart Motion traversing mechanism.

Along with programmable selective spray and self cleaning features, both of these advanced spray fluxing systems provide exceptional deposition uniformity and complete flux penetration of plated-via holes.

* Post Wave Cooling (PWC) Module - this provides accelerated cooling capabilities that in addition to reducing product exit temperatures can also reduce the possibility of fillet lifting often associated with lead-free alloys.

'The new VectraElite offers the very latest in wave soldering technology from Speedline,' said Mike Rapson, managing director at Contax.

'In addition to improved system wide access, a new rollout solder pot design, and an advanced control system, the VectraElite offers a number of unique advanced technologies.' These include UltraFill nozzles, upper High Velocity Convection (HVC) preheat module and its advanced range of spray fluxing systems.

'The VectraElite is the most advanced, high performance wave soldering system available in its class, and ideally suited for today's demanding lead-free applications,' he said.

* About Contax - Contax is one of the UK and Ireland's most comprehensive suppliers of automation equipment.

Products range from PCB assembly, automatic optical and x-ray inspection, reflow solder, screen printing, precision liquid dispensing, cable preparation, robotic soldering and robotic assembly as well as cleaning systems.

All of this is backed up by Contax's unique support programme called 'hands-on' and an extensive second user department to fully support their installed base.

PCB maker upgrades its Web site

2007-01-10T03:00:00.001-08:00

A global supplier of printed circuit boards use world class operational management to provide customers with on-time delivery and quality engineering into every process.

GSPK Circuits, situated in Knaresborough, North Yorkshire, UK, are pleased to announce the launch of its new website. The company; a global supplier of printed circuit boards (PCBs), operate a manufacturing division based at the GSPK Technology Park on Manse Lane. GSPK Circuits have been supplying the global electronics industry with PCBs for more than 40 years and utilise world class operational management to provide customers with on-time delivery and quality engineering into every process.

The incorporation of lean manufacturing across all departments, increasing effectiveness and efficiency has enabled the company to successfully differentiate itself within the market place.

The company's growing success has resulted in the need to establish a website to clearly communicate GSPK Circuit's success and ongoing achievements.

The company enlisted the help of local web-designers Extreme Creations, based in Harrogate, North Yorkshire who worked alongside the GSPK Circuits team to create a website which truly reflects the company's vision.

Providing detailed information about the company's background, technical capabilities and services available, as well as regularly updated news items and case studies; the website makes an interesting read.

Steve Lloyd, managing director for GSPK Circuits, said: 'The website is well worth a visit and will assist us in gaining greater brand awareness for GSPK Circuits '.

'Having been carefully designed, the website reflects the company's growing success and is a useful tool for keeping existing customers up-to-date and offering potential business opportunities to new customers.' Lloyd continued: 'With the new website comes the potential to form partnerships with other like-minded companies, something we fully support and are keen to pursue.'

Electronics test firm supports networked processor

2007-01-09T03:00:00.000-08:00

Provider of embedded functional test and diagnostics capabilities for board bring-up, manufacturing test and power-on self test, supports AMCC's PowerPC 405EZ networked industrial processor.

Kozio, the leading provider of advanced embedded functional test and diagnostics capabilities ideally suited for board bring-up, manufacturing test and power-on self test, today announced support for AMCC's new PowerPC 405EZ networked industrial processor. The 405EZ is the first in AMCC's family of high-performance networked industrial processors. Kozio will offer a turnkey diagnostics package for hardware test and debug solutions for custom 405EZ-based boards, giving product designers a complete diagnostics solution in two weeks that will save development effort, board bring-up, and production testing time.

'We use Kozio's diagnostic software internally to accelerate our validation of new PowerPC processors', said Pini Herman, senior manager of Hardware Development at AMCC.

'We have found the kDiagnostics package invaluable in allowing us to quickly debug our validation hardware and thereby minimize the bring-up time for new SoCs.

We are delighted that Kozio has announced support for the 405EZ processor and look forward to using their tools as we debug this new product.' Replying: 'We see more and more companies turning to 32-bit SoCs to replace their 8-bit and 16-bit MCUs and Kozio is providing an excellent set of software tools to help with this transition,' stated Joseph Skazinski, president of Kozio.

'Our turnkey hardware test products provide clear value as customers design and manufacture new products incorporating 32-bit processors such as AMCC's 405EZ PowerPC processor.' The shift to 32-bit processors is being driven by industrial controller applications that require the increased computing power of 32-bit SoCs to handle the additional tasks of networked communications, more sophisticated algorithms and more complete operating systems.

32-bit processors continue to drop in price, and in some cases their cost is lower than traditional 16-bit MCUs.

Kozio's diagnostics software kDiagnostics, kManufacturing, kPOST and kField provide a full board test report within minutes of running the software.

Kozio's turnkey diagnostics package includes pre-verified test suites for analog and digital peripherals, timers, IEEE 1588 Fast Ethernet, USB, CAN, comprehensive memory test suites for SRAM , and CellularRAM, and support for the 64-bit on chip-bus.

The package also includes full Flash memory capabilities as well as detection and testing of peripherals.

Evaluation versions of kDiagnostics are now available.

Kozio continues to partner with AMCC to provide complete support for their newest processors, including the PowerPC 405EZ, the first of a family of high-performance, low-power-consumption solutions for SoCs.

Kozio will be ready to support the 405EZ product developers when the chips are available, and will deliver turnkey diagnostics for custom boards to customers using the AMCC PowerPC 405EZ within two weeks after a purchase order is issued.

Components tested include the PowerPC 405EZ, SRAM, CellularRAM, GPIO, 12C, IEEE 1588 Ethernet, USB USB 2.0, two CAN 2.ob ports.

10-bit ADC, 10-bit DAC, PWM, Flash memory.

This list is adjusted for custom boards based on a product's block diagram.

* Benefits of using Kozio products - by providing proven test software at the earliest stage of processor-board development, Kozio shortens the product development cycle, saving customers time and money.

Kozio uses a suite of hardware tests that are pre-verified.

By using existing processor validation boards, reference processor-boards, and adapters to test out our hardware diagnostics before they are delivered to customers, Kozio has had great customer success in delivering ready-to-run self-booting embedded test software.

All that is required is the board schematic, not the hardware itself.

The same test suites are available in turnkey packages for production test and to ship with the final product.

* About Kozio - Kozio is the leader in embedded test solutions for today's electronic products.

Kozio delivers turnkey software that provides a comprehensive suite of hardware diagnostics used for debugging and testing custom boards implementing processors from AMCC, ARM, IBM, Intel, Freescale, TI or MIPS.

Kozio's clients build state-of-the-art products where successful use of the newest technologies with shortened development cycles requires them to constantly innovate to stay ahead of their competition.

Kozio software improves test methodologies and streamlines the development process with proven solutions for board bring-up diagnostics, manufacturing test, environmental test, power-on self-test, in-field diagnostics and returns testing.

By delivering thorough software diagnostics ahead of the hardware, Kozio reduces project schedule risk and development costs while increasing test coverage.

Headquartered in Longmont, Colorado, Kozio products are available through a direct sales force and worldwide distributors.

* About AMCC - AMCC is a global leader in network and embedded PowerPC processing, optical transport and storage solutions.

AMCC products enable the development of converged IP-based networks offering high-speed secure data, high-definition video and high-quality voice for carrier, metropolitan, access and enterprise applications.

AMCC provides networking equipment vendors with industry-leading network and communications processing, Ethernet, SONET and switch fabric solutions.

AMCC is also the leading vendor of high-port count SATA RAID controllers enabling low-cost, high-performance, high-capacity storage.

AMCC's corporate headquarters are located in Sunnyvale, California, USA.

Sales and engineering offices are located throughout the world.

Transition to lead-free soldering simplified

2007-01-09T02:59:00.000-08:00

A production assembly equipment company has made a series of enhancements that optimise existing soldering systems for a simple, cost-effective transition to lead-free soldering.

With the introduction of ROHS legislation in July this year, soldering will undergo considerable changes. Not surprisingly, electronics manufacturers the world over are reviewing their processes and identifying the equipment, materials and procedures that will be compatible with the higher temperatures and narrower processing windows that are associated with lead-free production. As a leading manufacturer of Production Assembly Equipment worldwide, OK International has supplied countless soldering systems to its clients over the years; systems that are known for their reliability, robustness and longevity; systems that are perfect for lead-free manufacture even though they have been in use in the industry for years.

With this in mind, and with the clear intention to protect its customers from added investments where none are needed, OK International has developed a series of cost-effective enhancements for its Metcal MX-500 and SP200 soldering systems that optimise them for lead-free manufacture.

The first of these is a range of new SmartHeat PowerTips for the Metcal MX-500 system.

Specifically designed for lead-free applications, these tips provide the highest thermal performance possible, allowing the user to solder even the most demanding joint without heat damage.

OK International's european product manager Craig Brown explained: 'If you simply turn up the temperature, you risk burning off the flux and ending up with an insufficient joint.

Instead, we have developed a series of tips that are extremely efficient in transferring more energy to the joint.' The company found that different solder tip geometries allow different amounts of energy to flow to the solder joint.

Calculated mathematically using its length, width and shape, each solder tip's 'Conductivity Factor' indicates how efficient it is in conducting this energy - the higher the number, the more efficient the tip.

'By using this Conductivity Factor we have designed our tips for improved thermal performance, enabling us to keep our source temperatures constant while meeting the needs of lead-free soldering.

This is a first for our industry,' added Brown.

Based on its 10 most popular tip geometries, OK International has introduced a range of seven SmartHeat PowerTips for use with existing Metcal MX-500 systems.

It plans to add new geometries as lead-free manufacture takes hold.

For the Metcal SP200 soldering system, the company has taken a different approach: here the cartridges have been upgraded with a new high-power coil assembly that delivers additional power to lead-free solder joints; again, with no need for increased source temperatures.

Both systems use OK International's powerful SmartHeat technology to ensure that the solder joint being reflowed receives exactly the energy required.

This eliminates the risk of heat damage and allows the solder tip to work at lower temperatures for a longer useful life.

Working life can be extended still further thanks to OK International's Auto Sleep Stand.

In conjunction with SmartHeat technology, this interrupts the energy flow to the solder tip the instant the hand-piece enters the cradle, reducing tip temperature to a minimum idling level as it rests in the stand.

This reduces the oxidisation that can be a problem with higher temperature lead-free solders and fluxes, and this can be further reduced with the help of the stand's special brass wire wool cleaning compartment.

In addition, tip temperature returns to optimum working levels within a second of the hand-piece being removed from the stand, so no working time is lost.

A further issue in moving to lead-free manufacture is contamination between lead-containing and lead-free solders.

As Brown explained: 'The two principal problem areas are the stand and the tips: the stand contains waste solder that has dripped from the tip and the hand piece can be used with any tip, so it is important to know which stand and which hand piece are being used with which solder.' OK International has introduced two simple but effective accessories that clearly identify lead-free equipment: first, a green cradle that can be inserted into the Auto Sleep Stand; and second, green lead-free identification rings that can be slipped onto soldering tips and cartridges.

These accessories can be used with any of OK International's soldering systems.

OK International's series of SmartHeat PowerTips, enhanced SP200 tip cartridges, Auto Sleep Stand and the green lead-free identification cradle and rings all offer clear evidence of OK International's deep understanding of its customers' needs and its dedication to ensuring that they get the most out of their investments in the electronics manufacturing workbench.

All equipment and accessories are available through OK International and its global distribution network.

Solder paste squeegees are polymer lubricated

2007-01-08T02:58:00.000-08:00

Solder paste squeegees are infused with polymer lubricant, which significantly reduces friction and stencil wear when using silver and tin solder alloys in all kinds of stencil printer.

In the July 1st switch-over to lead-free soldering, Intertronics have been a leading light in supply of related products to ensure compliance and improve efficiency. Their Permalex squeegees are infused with polymer lubricant, which significantly reduces friction and stencil wear when using silver and tin solder alloys in all kinds of stencil printer. These pastes are both more abrasive than the outgoing leaded solder paste, so all pcb manufacturers/assemblers will be pleased to find that Permalex squeegees are a long-lived solution which can eliminate the sticking typically seen with standard metal squeegees and greatly improve the quality of their stencil printing process.

Permalex metal squeegees feature a unique base alloy with a multi-step metallurgical bonding process which results in a smooth, hard, low friction edge designed to prevent stencil wear.

This eliminates scavenging and improves solder paste deposition, while reducing stencil pulling and stretching, thus improving pad registration and stencil life.

Ensure products withstand high voltages

2007-01-08T02:57:00.000-08:00

Ensuring a product remains electrically safe - John Barnett explains how technical advances ensure the effective production line use of electrical flash/hi pot/dielectric withstand testing.

The terms flash test, hipot and dielectric withstand test all relate to the same fundamental test and describe the process for ensuring that a product remains electrically safe when subjected to a high voltage, or to check for any signs of damage or poor quality of the basic insulation of a product. A high voltage can occur when transients are present on the power supply. In such circumstances the product must not expose the user to a hazardous voltage.

Poor or damaged insulation can also occur during construction, particularly if wires are trapped within the chassis or case of a product.

This test is therefore designed to stress the product's insulation and ensure that there are no defects in the construction and that internal wiring and conductor spacing is correct.

If the test is omitted, then a product with poor insulation or internal conductor spacing, may fail under the influence of environmental factors such as ingress of moisture, dirt, or the effect of vibration.

These defects cannot be consistently detected by any other electrical safety test.

* Test standards - legislation such as the Low voltage directive, machinery and medical devices directives demand that all manufactured products are subjected to this fundamental electrical safety test.

In addition a number of independent and government product approvals agencies require that this test is performed, and that records are kept for each product design, and for each product manufactured, before their approvals mark can be displayed on the product.

Within the European marketplace these directives must be obeyed for a product to comply with the CE mark regulation.

The view that this type of test is essentially destructive is often an area for discussion.

This view originates from the use of this test in laboratory type testing, where the long applied test time may degrade the insulation, resulting in ionisation and potentially destructive breakdown.

However in terms of production line testing the short (less than two second) applied test time and 5mA trip setting effectively reduces this risk.

Applying a DC insulation test immediately after this test will provides a means of ensuring that the insulation has not been degraded.

The flash/hipot test itself can be used to take quantative measurements for process control, but the pass and fail criteria are that a breakdown must not occur, or that typically 5mA of leakage must not flow in the test circuit.

In certain exceptions this leakage can be increased where it can be demonstrated that a good product has high leakage due to the inclusion of devices such as line filtering capacitors within the design.

* Testing times - routine testing on the production line invariably demands high product throughput and is often carried out by relatively low skilled test operators.

Factors such as these bring specific demands in terms of reducing the overall test time burden and the safety implications of installing a high voltage test area within the production environment.

Modern flash/hipot testing systems have been developed that utilise a 10% higher voltage than would be applied during a type test, but for a much reduced test time of a few seconds.

It is also recommended that the leakage current limit is reduced to 5mA to maximise operator safety and the majority of product routine testing standards has adopted this approach, and to ensure that if a product fails, that destructive damage is avoided.

In addition other new techniques have been introduced to address other issues over production line throughput.

For example, it is usual to precede the flash test with a phase to neutral continuity test to ensure that the product is switched on.

This eliminates the possibility of incorrect testing - since all circuits must be connected to the supply during the test.

For the same reason, lower leakage trip levels can also be that are set just below the normal level measured for a batch of good product, when tested with the supply switched on.

The test will then record a fail condition if the product is tested with the supply not switched on.

* Operator safety - in terms of operator safety, the introduction of the EN50191 standard - A Guide for the Erection and Operation of Electrical Test Installations - sets out requirements for defined test areas in accordance with various safety measures - particularly where high voltage testing is to be used.

By employing arc detection and leakage trips, sensitive electronic equipment can also now be safely tested in a non-destructive way.

For example, low levels of leakage can be safely detected with the new digital era of test equipment, allowing sensitive electronic components and PCBs to be tested, and reworked if necessary as part of the production line process.

Other special techniques are also available for the safe testing of Class II double insulated products and for products that have high levels of AC leakage which may be fitted with line filters or suppression capacitors.

This can be achieved by using a higher DC test voltage, but incorporating a bespoke design of test enclosure system with user interlock or special 'test nests' to house the product under test.

Another technical advance has been the development of test systems for newly emerging smart electronic and electrical products that utilise circuits that are not electrically connected to the supply, unless powered.

Mostly found in microprocessor controlled intelligent products.

To overcome such problems a technique known as quadrature testing has been introduced which performs the test whilst the product is fully energised and operational from an isolated supply.

In this way all secondary circuits and conductors are connected to the product supply terminals during the application of the test voltage.

This technique is becoming very common due to the inclusion of microcontrollers in the modern consumer products such as ovens, washing machines, tumble dryers and AV and IT products.

Technical developments such as these have ensured that modern flash/hipot testing systems continue to enable manufacturers to meet their product compliance standards and that the tests can be applied safely without any disruption to fast moving efficient production lines.

* About the author - John Barnett is with Clare Instruments.

Traditional solderability test methods questioned

2007-01-07T02:56:00.000-08:00

Lead-free use has exacerbated the need to distinguish between solderability and 'soldering ability' tests to maintain integrity of electronic assemblies, writes Graham Naisbitt.

Graham Naisbitt, has called attention to the need for manufacturers to draw a clear distinction between solderability - a quantitative measurement of how well molten solder wets component joints and PCB pads indicating the robustness of the surface finish - and soldering ability - a term used to describe how well a specific combination of flux and solder work together to solder a component to a PCB. While this is not a new problem, it has become more critical as lead-free solder becomes the norm after the EU's Restriction of hazardous substances (RoHS) deadline and the release of updated International Electrotechnical Commission (IEC) and Association Connecting Electronics Industries (IPC) soldering standards. Previously, manufacturers using tin/lead alloys could compensate for poor solderability by tuning the soldering process - thus improving the soldering ability of the assembly.

However, this is no longer an option for lead-free solder because it is a much less forgiving process.

Consequently it is now critically important for manufacturers of high reliability electronics to determine the solderability of components and PCBs prior to assembly.

Solderability testing now needs a much higher level of precision, repeatability and reproducibility to take account of unforgiving nature of the high tin content alloys that have been recommended by IEC and IPC.

While tweaking the soldering process might have been acceptable to overcome poor solderability and improve soldering ability for some assemblies using familiar lead alloys, it just won't work with lead-free solder alloys - particularly in no-clean processes.

Unreliable solder joints would be almost inevitable.

Assemblers need to know for sure that they are using boards and components of known acceptable solderability that will always solder satisfactorily in their established and optimised process without any form of tweaking or adjustment.

The higher soldering temperatures and thermal issues of lead-free allied with unproven on-board electrochemical and contamination reactions between various other process chemistries are just too complex and poorly understood to let the soldering process be changed at will.

After extensive soldering analysis involving 30,000 individual tests, imminent new IPC standards recognise that wetting balance force measurement and globule testing is better than traditional 'dip-and-look' manual judgements for quantitatively determining solderability to the precision required so that adjustment to the soldering process becomes unnecessary.

The main problem with the traditional dip-and-look technique - which is highly popular, quick and inexpensive - is its lack of adequate Gauge Repeatability and Reproducibility (or Gauge R and R for short).

This is a measure of how repeatable and reproducible tests are when performed by different people at different times.

According to the IPC: 'Users who believe that the 'dip-and-look' methodology has a respectable Gauge RandR would be in for an extreme shock'.

'The IPC committees have also voted that no new solderability test methods will be introduced into the standards without a demonstrated, industry acceptable Gauge R and R value.' The IEC recommends wetting balance force measurement and globule testing and we are attempting to harmonise standards documents, to provide acceptable Gauge RandR to its defined methodology.

Defining new test methods is critical because the reliability of electronics hinges on the performance of the solder.

There are compelling environmental reasons for switching to lead-free solder alloys.

Unfortunately this does mean changing from tried and trusted tin/lead alloys to alternatives that have not been subject to such intense performance analysis.

Consumers might not feel so comfortable about moving less tried and tested alloys if their lives are reliant on it, for example, if they are a passenger on a large aircraft.

Our mission is to reduce, or if possible remove, all doubt; but that will not be a trivial task.

Gen3 Systems manufactures the Must System Solderability Tester for wetting balance force measurement and globule testing.

The equipment is ideal for both tin/lead and lead-free alloy testing and has been used by the industry for many years.

The company has also produced a lead-free bath and globule set and lead-free accessories kit to allow existing Must Solderability Tester owners continuing use of their equipment.

To support the transition to lead-free alloys, new standards for the MUST Solderability Tester (IPC-J-STD 002 and 003) and its award winning Auto-SIR (IPC 9201A SIR Handbook and IPC-TM-650, 2.6.3.7) are due to be published during the (northern) summer.

* The transition to lead-free solder - the electronics industry has grown up with tin/lead solder.

The IEC defines these alloys as Sn60Pb40A, Sn63Pb37A or Sn62Pb36Ag02B.

Over four decades the long-term performance of tin/lead alloys has been intensely studied.

The IEC and IPC have issued comprehensive documentation, standards and test methodologies that allow manufacturers to ascertain the reliability of their electronics assemblies.

Lead is now banned from electronics assemblies and intended for sale in the EU.

Legislation of a similar nature is likely to be introduced in Japan, California and China.

Both IEC and IPC committees are working hard to try and ensure that revisions to the existing standards are published as quickly as possible, but neither group will have published documents until late 2006.

However, both the IEC and IPC are recommending high tin alloys as the best replacements for tin/lead.

Specifically, the IEC stated: 'The preferred alloy composition should be either Sn96.5Ag3.0Cu0.5 or Sn99.3Cu0.7'.

'An alloy consisting of 3-4% Ag and 0.5-1% Cu with the remainder made up of Sn may also be used instead of Sn96.5Ag3.0Cu0.5'.

'A solder alloys comprising 0.45-0.9% Cu with the remainder made up of Sn may be used instead of Sn99.3Cu0.7.' IPC stated: 'The solder composition shall be tin (Sn)96.5 silver (Ag)3.0 copper (Cu)0.5 (SAC305) as defined by J-STD-006'.

The IPC does allow other lead-free solder alloys if agreed between user and vendor.

High tin alloys have not been as well characterised as traditional tin/lead solders.

While the IEC and IPC have been rapidly assimilating data on the long-term performance of lead-free alloys it will be some time before comprehensive information is available.

Accordingly, both the IEC and IPC are defining thorough testing regimes - with acceptable Gauge R and R - for manufacturers whose products will be used in safety critical applications.

* About Gen3 Systems - Gen3 Systems is dedicated to tackling the demanding electronics reliability challenges of lead-free assembly and further electronics miniaturisation.

The company is a specialist manufacturer of test and measurement equipment used to predict the reliability of electronic circuits and systems in the field.

In addition, the company designs and manufactures conformal coating process equipment in both in-line and bench-top formats.

Naisbitt is a member of the IEC's TC91 WG3, the working group that formulates test standards for the assembly industry.

Naisbitt is also leader of Solderability Testing Standard IEC 60068-2-69, co-leader of Solderability Testing Standard IEC 60068-2-54, and member of IPC-J-STD 002 and IPC-J-STD 003.

Gen3 Systems is founded on the former Concoat Systems.

Concoat Systems and its company slogan 'Engineering Reliability in Electronics' (which has been retained by Gen3 Systems) was a familiar name in Europe, Asia and much of North America.

The new company was launched by its family owners after former sister company Concoat was sold to US firm Chase Corporation in 2005.

Gen3 Systems operates from new premises near Farnborough Business Park, on the M3 corridor and just 30 minutes from London's Heathrow Airport, UK.

The company has an entirely new management team focused on the needs and requirements of its customers around the world.

Gen3 Systems also provides training, equipment and expertise for manufacturers requiring assessment of their electronic products' reliability.

The company also assists with standards development via both the IPC and IEC.

The company's product range and services include the following.

Autosir Surface Insulation Resistance Testing System.

Must System2+ Solderability Testing System.

Soldapro Thermal Profilers.

CMseries Cleanliness Testing Systems.

SCseries Spray Conformal Coating Systems, batch and in-line.

DCseries Dip Conformal Coating Systems, batch and in-line.

Testservices for Circuit Reliability, Solderability and Cleanliness.

* About the author - Graham Naisbitt is managing director of Gen3 Systems.

Fuel cell power systems lineup

2007-01-07T02:55:00.000-08:00

Zoom lens enhances electronics part inspection

2007-01-06T23:53:00.000-08:00

Designed for use with 1/2in or 1/3rdin CCD cameras a high performance TV Macro Zoom Lens benefit a range of surface inspection tasks including PCB inspection and components production monitoring.

Moritex, a leading international manufacturer of fibre optic illumination and optical lensing systems for various machine vision and inspection applications, has announced new additions to its comprehensive selection of Macro Zoom Lenses. Designed for use with 1/2in or 1/3rdin CCD cameras the high performance TV Macro Zoom Lens (MLZ) range are the perfect choice for a range of surface inspection tasks including semiconductor and LCD manufacture, PCB inspection, electronic components production monitoring and alignment applications. Weighing less than 100g the MLZ lens series are compact, versatile 4:1 zoom lenses designed for integration into small spaces.

Offering 173mm of working distance, MLZ lenses provide plenty of room between the lens and the subject for robotic arms, machinery etc Motorised versions of the MLZ lens series are available for integration into highly automated manufacturing equipment.

Available in a choice of eight different lens magnifications (0.02 x to 2.4x), with or without integrated coaxial episcopic illumination, a wide range of subjects can be imaged given the 10:1 zoom ratio.

Advanced telecentric optical design ensures high resolution, high contrast images free of TV distortion.

The MLZ series comes complete with adjustable and lockable focus, iris and zoom.

This allows the user to set up the lens for optimum performance and then lock the settings in.

By extending the objective lens in the tip section users can increase the magnification of the lens.

Soldering/desoldering systems can be 'tailored'

2007-01-06T23:52:00.000-08:00

Soldering/desoldering systems offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.

OK International announces four new soldering/desoldering equipment packages as additions to its MFR Series. Setting new standards for flexibility, capability, reliability and value in high-performance rework equipment. Unique design features, state-of-the-art tools and a range of upgrade options.

The MFR Soldering/Desoldering Systems are the latest range of soldering/desoldering equipment from OK International.

Designed to offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.

* The MFR-DSI and MFR-DSX Systems for desoldering, comprise OK International's compact bench-top MFR power supply and its innovative desolder gun.

Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench.

The MFR/DSX uses compressed shop air, making it powerful and ideal for higher volume desoldering tasks.

* OK International adds its high-performance soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.

All four packages use lightweight MFR Soldering/Desoldering System hand-pieces, whose unique features ensure high quality, cost-effective performance.

The handle of the desoldering tool is fully adjustable from 'gun' to 'pencil' position, offering maximum operator comfort.

Like all the MFR System hand-pieces, it incorporates a reactivation switch that senses when it is in use, and that works with 'Auto Standby' and 'Auto Off' functions to save on energy usage and prolong tip life.

The large-capacity chamber that catches molten solder during desoldering is made of thermal plastic, rather than potentially hazardous glass.

It contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution.

Also in the chamber is a fume filter that traps the solder fumes that can harden on cooling and block the pumps.

The press-fit desoldering tips make changeovers easy.

The operator simply handles the tips using a heat-resistant cartridge removal pad.

This represents a major departure from the normal screw-fit tips that require special tools for attachment and removal.

Operations that are unwieldy, especially when the tips are hot, and that can potentially damage the thread, or crush or break the tips.

The range of desoldering tips includes long-reach geometries for easy access to high-density areas on the PCB.

All OK International soldering/desoldering tips are driven by proprietary SmartHeat technology.

This technology, unique to OK International, takes the guesswork out of heat management by sensing the amount of heat energy needed at the pad and providing this accurately and instantaneously.

In this way, reliability and quality are guaranteed, cost of ownership is minimised, throughput is maximized and the PCB and components are protected from heat damage.

Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in 'standby' or 'off'.

Most importantly, they will flag when the system or a tool are not grounded, and the unit will shut down.

This feature is only found on OK International MFR Systems and is essential when working on static-sensitive devices.

Thanks to the modularity of the MFR Soldering/Desoldering System, users build their equipment as their volume and requirements change.

The power units offer two ports to which any of the MFR Series tools can be attached, and for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.

With the MFR Series and its new cost-effective, high-performance solder/desolder packages, OK International proves once again its leadership in the supply of production assembly equipment.

Electronics workstations assembled quickly

2007-01-05T23:52:00.003-08:00

Components for ESD sensitive manufacturing and test equipment, and electronics based workstation applications have a novel rapid assembly fastener and durable, scratchproof epoxy coatings.

MiniTec UK , the Basingstoke based manufacturer of machine framing systems has developed a range of components for ESD sensitive manufacturing and test equipment, and electronics based workstation applications The special components, based upon MiniTec's aluminium profile system with the unique and rapid assembly 'Powerlock-N' fastener, have durable and scratchproof epoxy coatings providing complete external electrical insulation. The profiles form complete machine and workstation frames in conjunction with special conductive connecting elements. Both elements and insulated profiles enable the frames complete electrical conductivity which is fundamentally important for ESD compliance.

The system also removes the need for cumbersome earth cabling or additional assembly costs being incurred.

Furthermore, complete equipotential bonding of the machine frame is assured throughout the life of the equipment with no maintenance.

MiniTec UK supply a complete design and manufacturing service for ESD compliant machine frames and workstations with the system being used extensively in manufacturing and assembly areas throughout a wide range of application areas including medical and consumer electronics, semiconductor assembly, solar panel manufacture and specialist research applications.

MiniTec's machine building system with its unique 'Powerlock' fastening system is well proven for rapid assembly; a single-sized fastener design connects all profile sizes with no specific preparation, pre-machining or special tools required.

The comprehensive range suits an endless choice of frame and workstation configurations together with a wide selection of ancillary components including positioners, sensors, safety fence parts, doors, wheels and guards.

The range is aimed at the cost effective design and fabrication of complete machine systems and workstations for production and test, materials handling and automated manufacturing.

Specifying MiniTec's machine building system for machine frames and workstations is simplified with a choice of hard copy or PDF catalogues, an on-line e-catalogue, ICAD software for AutoCAD and CADmenu for other systems, or with the unique web-based i-CAD interactive software that allows customers to view, examine and download 2D or 3D, CAD files for each component in the range and produce complete parts lists for simplified ordering.

MiniTec's CAD software options are the envy of the building profile industry, combining graphical displays of system components with itemised category lists and indexed sections for all MiniTec machine building products.

Silicon compound gives clear and simple potting

2007-01-05T23:52:00.001-08:00

A clear silicone potting compound provides non-yellowing optical clarity for light transmission, while protecting sensitive opto-electronic components such as LEDs, displays or solar panels.

Sometimes you need to be really clear about things - very transparent. Perhaps you need to view potted components or need true non-yellowing optical clarity for light transmission, while providing support and protection for potting of sensitive opto-electronic components such as LEDs, displays or solar panels. The Opti-tec 7020 clear silicone potting compound from Intertronics provides these capabilities while also allowing circuitry to be viewed for inspection or rework purposes.

Opti-tec 7020 is a two-part clear liquid silicone which will cure at room temperature or can be accelerated at increased temperatures.

It features a non-yellowing catalyst system and a low viscosity which allows ease of flow around complex parts, providing electrical insulation and shock protection.

When fully cured Opti-tec 7020 exhibits a refractive index of 1,406 and a thermal operating range of -60 deg C to +200 deg C.

Perhaps the clearest demonstration of Opti-tec 7020 is simply to try to spot which assembly has actually been potted - so clear is it that often a second look is needed!

Keithley sponsors Weblog for semiconductor testing

2007-01-04T23:51:00.000-08:00

The first Weblog, or Blog, for engineers confronting testing issues in the semiconductor industry informs of the latest technical and business developments and their impact on testing.

Keithley Instruments, a leader in solutions for emerging measurement needs, announces the first Weblog, or Blog, designed exclusively for engineers confronting testing issues in the semiconductor industry. The Semiconductor Test Blog informs visitors of the latest technical and business developments in the semiconductor industry and their impact on testing. The Blog is coordinated by 'Solid State Technology' magazine and can be accessed directly at http://sst.pennet.com.

The Blog contains links to a library of white papers and Webcasts, as well as announcements of upcoming conferences and events of interest to the semiconductor test and measurement community.

Visitors can also post responses to particular items or post questions to other Blog visitors.

David M Barach, publisher of 'Solid State Technology', believed the Blog will play an important role in the semiconductor industry.

'Engineers responsible for testing in the fast-paced semiconductor industry need to be aware of the latest developments in the field,' said Barach.

'The new Semiconductor Test Blog is the hub for those seeking the most up to date information on the latest test techniques in developing next-generation semiconductor devices,' said Barach.

Mark Hoersten, Keithley's vice president of Business Management, stressed the importance of testing in new device research and development.

'The ability to perform accurate and repeatable measurements at ever-shrinking device levels is critical to engineers developing next-generation semiconductor materials,' said Hoersten.

'The Semiconductor Test Blog will help scientists and engineers stay ahead of the development curve.' * About Keithley - with 60 years of measurement expertise, Keithley Instruments has become a world leader in advanced electrical test instruments and systems from DC to RF (radio frequency).

Its products solve emerging measurement needs in production testing, process monitoring, product development, and research.

The company's customers are scientists and engineers in the worldwide electronics industry involved with advanced materials research, semiconductor device and wafer characterization and functional test, and the production of end products such as electronic assemblies or portable wireless devices.

The value Keithley provides its customers is a combination of precision measurement technology and a rich understanding of their applications to improve the quality, throughput, and yield of their products.

List holds RoHS exempt products

2007-01-04T23:50:00.000-08:00

Electronics distributor has produced a comprehensive list of RoHS exempt products including those formally approved, those rejected, any in limbo and ones requested but still pending.

Farnell InOne, the number one source for RoHS compliant products and information, is the only distributor in the industry to produce a comprehensive, dedicated list of RoHS exempt products. Working in conjunction with ERA Technology, Farnell InOne now offers a continuously updated record of exemptions, including those formally approved, those rejected, any in limbo and ones requested but still pending. Exemptions are one of the most hotly debated RoHS topics of the moment, and arguably one of the most confusing.

Whilst being exempt from the challenging environmental legislation may seem like a dream come true - get it wrong and design engineers could be in trouble.

The main challenge for engineers lies in assessing what is exempt or not in scope and how to keep track of the changing status of certain materials, components and products.

Gary Nevison, head of product market strategy at Farnell InOne commented: 'Traditionally, in order to find a comprehensive list of exemptions, engineers would have to spend a great deal of time trawling through a variety of websites such as the European Commission's and the DTI's.

Now, they can simply log-on to the Farnell InOne dedicated RoHS Web site.

Alternatively, if they are subscribers to ERA Technology's environmental newsletter, they can view the list in the July edition of its RE4view publication.' Currently, there are 28 applications which have been formally approved as exempt, three either rejected or withdrawn, one in limbo and over 70 requested but pending a decision.

However, this is constantly changing - something which the list from Farnell InOne reflects.

'This comprehensive new list, which cannot be found anywhere else online, will be continuously updated to reflect the latest exemption news.

We are consistently striving to offer design engineers the best possible service and this is another industry first we are delighted to offer,' concluded Nevison.

SMT connectors are robust for handling

2007-01-03T23:50:00.000-08:00

A family of surface-mount D-Sub connectors has optimised design to provide compatibility with modern assembly processes and robustness to withstand handling as well as long-term reliability.

SMT connectors are rubust for handling A family of surface-mount D-Sub connectors has optimised design to provide compatibility with modern assembly processes and robustness to withstand handling as well as long-term reliability. Harting has introduced a new family of surface-mount D-Sub connectors whose design has been optimised to provide compatibility with modern assembly processes as well as long-term reliability. A combination of stamped terminals and a specially designed insulator is used to achieve 100% co-planarity, resulting in a robust device capable of withstanding all normal handling processes.

Die-cast brackets offer a large solder area on each side of the connector to add significant physical mounting resiliency.

In addition, they control the centre of gravity to ensure perfect stability of the connector throughout the reflow solder process.

The insulator includes two zero-insertion-force positioning pegs to maintain reliability in pick-and-place mounting operations, which is also aided by the inclusion of a large flat surface for a vacuum pipette.

The connector uses riveted nuts which are designed so that their square rear side is inserted into a matching square hole in the brackets, thus ensuring long-term retention.

The surface-mount D-Sub range includes 9- and 15-pole versions which are delivered in 120-piece reels.

For larger sizes, packaging will be to customer equipments.

The range includes 9 to 25 positions, standard angled, with a large choice of mounting hardware.

Performance levels 2 and 3 are available as standard; other requirements can be supplied to meet customer needs.

A low profile range combining the same features and benefits is planned for release in the future.

Fume extraction avails healthy lead-free rework

2007-01-03T23:49:00.000-08:00

Concerned by the acrid odour given off by lead-free fluxes and solder pastes, rework professionals are increasingly calling for better health and safety measures and better fume extraction.

Lead-free reworking processes require higher temperatures and greater use of more active fluxes, which could account for the stronger smell of the gases released during lead-free rework. The often unpleasant odour is a matter of concern for many electronics manufacturing operators, who are worried that it may signal an increased health hazard. Even though the smell of a gas is not necessarily an indicator of its impact on health, the UK's Health and Safety Executive (HSE) concurs that rework professionals are right to be concerned.

This is partly thanks to the fact that, after years of no-clean solder fluxes, lead-free has triggered a return to the electronics workbench of rosin-based fluxes.

In its booklet 'Solder Fume and You' (www.hse.gov.uk/pubns/indg248.pdf), the H and S underlines the possible health hazards that can arise from the use of rosin-containing flux materials.

When they are heated to the higher lead-free processing temperatures, they form fumes, or colophony, that can irritate the skin, respiratory tract and eyes.

It warns that 'Rosin-based solder flux fume is now regarded as one of the most important causes of occupational asthma in Britain', and adds that if ventilation is poor, the effects may also be felt by others in the work area even if they are not involved in the soldering process.

Not surprisingly, the UK coshh regulations include Maximum Exposure Limits (MEL) for rosin-based colophony.

The HSE recommends that 'exposures should be reduced to as far below the MEL as is reasonably practicable, for example by the provision and use of a suitable local extraction ventilation system'.

It is clear that a healthy working environment makes sound economic sense, and by investing in their operators' health businesses guard against the more expensive consequences of staff turnover, sick leave, healthcare and potential legal costs.

At the same time they benefit from increased operator efficiency, quality, throughput and a host of other human-related factors that, although they may be difficult to measure, invariably add significantly to the 'bottom line'.

While health and safety is the top priority in deciding to invest in and optimise fume extraction systems, there are additional advantages to taking this step.

One of these advantages, we believe, is extended soldering iron tip life.

OK International's market development manager, Craig Brown, explained: 'At higher temperatures, lead-free fluxes tend to boil and spit, creating more colophony.

Unless this is removed by an effective fume extraction system, it can form 'black tip', a solid black deposit on the solder iron'.

'This acts as a barrier, preventing the solder from wetting and worse still, if it burns onto the tip itself, it reduces the tip's thermal performance and useful life.

We are now conducting tests to prove this theory.' It is essential that companies weigh their options carefully when selecting a fume extraction system, as a raft of variables must be considered.

These include the quality of the filtration system, which is classified for the size of the particulates that it will capture.

OK International's fume extraction systems all use top ranking multistage filtration with EU14 HEPA filters.

Other variables include the type of extraction systems that will optimise air filtration: High Pressure (Tip) Systems fit onto the individual soldering irons, while high volume Arm Systems draw colophony from a general work area.

Other issues to take into account include how many users will be attached to any one extraction system?

At what distance?

What bore tubes should be used in order to draw the fumes away completely without cooling the soldering iron tip and without the colophony cooling, depositing in and clogging the tubes?

At what vacuum or speed should the system operate?

Is it better to use a benchtop or a central system?

Brown said that engineering expertise is crucial if all of these variables are to be combined into an efficient, cost effective system.

He also warns that opting for a low-cost, off-the-shelf air purifier will give manufacturers a false sense of security.

'These units are often based on simple carbon filtration that removes the visible smoke particles to leave the impression of cleaner air.

But they leave behind the more dangerous, smaller and invisible particulates.

A good quality unit should offer at least a 99.5% efficiency for removing particles down to 0.3 micron.' With a deep understanding of its clients' needs and its wealth of expertise in designing and supplying world-class equipment and systems to the global electronics assembly industry, leading equipment supplier OK International is the ideal partner for electronics manufacturers who want to make cost effective investments to improve their working environments and optimise their efficiencies.

Products in OK International's fume extraction range include the following.

* MFX-2200 Fume Extraction System - designed to provide filtration for up to eight manual electronics assembly workstations, the system's powerfull performance can also be harnessed to remove particulates and gases from exhaust cabinets and even small bench-top wave and reflow soldering ovens.

* BTX-208 Fume Extraction System - offers high performance extraction of solder fumes direct from the tip of the hand soldering iron - and can be easily configured to form an extraction network for up to eight workstations.

* BVX-100 Single Arm Fume Extraction System - requires no installation, offers flexible operation, has a space-saving footprint and matches the airflow of larger multi-user systems.

* BVX-200 Two Arm Fume Extraction System is a truly portable system that combines strong fan performance with efficient filtration and quiet, flexible operation.

It features the same motor as the single arm model, but with an innovative one-stage impeller design to provide more than double the total free-blowing airflow.

Tektronix instruments controlled from PCs

2007-01-02T23:49:00.001-08:00

National Instruments is supporting digital storage oscilloscopes in NI SignalExpress Tektronix Edition, a PC-based measurement software to quickly process measurements without programming.

National Instruments has announced support for the Tektronix TDS1000B and TDS2000B Series of digital storage oscilloscopes in NI SignalExpress Tektronix Edition, an interactive PC-based measurement software design and test engineers use to quickly acquire, analyse and document measurements on the benchtop without programming. With USB plug-and-play capability, SignalExpress Tektronix Edition makes it easy for engineers to connect to and control Tektronix instruments from their PCs. 'SignalExpress Tektronix Edition extends the performance of the new TDS1000B and TDS2000B Series oscilloscopes, giving our customers remote instrument control, live waveform measurement, analysis and reporting capabilities right on their PC and all in one software environment,' said Bob Bluhm, vice president, Value Scope Product Line, Tektronix.

'This further enhances the value of the world's best selling family of oscilloscopes.' SignalExpress Tektronix Edition makes it possible for engineers to seamlessly connect their stand-alone instruments to PCs and perform instant control, measurement analysis and documentation.

The software delivers USB plug-and-play connectivity that automatically detects the Tektronix oscilloscope and prompts engineers with an auto play dialogue.

With a single mouse click, engineers can configure all instrument communication, view live measurement data and take immediate control of the oscilloscope.

Using SignalExpress Tektronix Edition, engineers can access more than 200 measurement, processing, analysis and reporting capabilities to apply to live data acquired from Tektronix oscilloscopes and signal sources via USB, GPIB and Ethernet/LAN.

Engineers can also drag-and-drop acquired data from the Tektronix oscilloscopes directly into Microsoft Excel, Word, Outlook, PowerPoint and WordPad for easy analysis and reporting.

SignalExpress Tektronix Edition provides additional time-saving features such as automated measurement sweeping and limit testing.

'National Instruments is committed to delivering the most comprehensive instrument control solution over any communication bus, including USB, GPIB and Ethernet/LAN,' said John Pasquarette, NI director of Software Marketing.

'SignalExpress Tektronix Edition extends our commitment by improving measurement productivity on the design bench.' The SignalExpress Tektronix Edition Base version, along with a 30-day free trial of the Professional version, ships as part of the standard configuration with the Tektronix TDS1000B, TDS2000B and DPO4000 Series oscilloscopes.

Engineers can upgrade to the Professional version for advanced signal processing, analysis, documentation and connectivity.

* About National Instruments - for 30 years, National Instruments has been a technology pioneer and leader in virtual instrumentation - a revolutionary concept that has changed the way engineers and scientists in industry, government and academia approach measurement and automation.

Leveraging PCs and commercial technologies, virtual instrumentation increases productivity and lowers costs for test, control and design applications through easy-to-integrate software, such as NI LabVIEW, and modular measurement and control hardware for PXI, PCI, PCI Express, USB and Ethernet.

Headquartered in Austin, Texas, NI has more than 4,000 employees and direct operations in nearly 40 countries.

For the past seven years, 'Fortune' magazine has named NI one of the 100 best companies to work for in America.

* About Tektronix - Tektronix is a leading test, measurement, and monitoring company providing measurement solutions to the communications, computer, and semiconductor industries worldwide.

With over 60 years of experience, Tektronix provides general purpose test and measurement, video test and monitoring and communications network management and diagnostic products that enable its customers to design, build, deploy, and manage next-generation global communications networks and advanced technologies.

Precise motion control aids miniaturisation

2007-01-02T23:39:00.001-08:00

One of the best investments those in the semiconductor industry can make is in precise motion control to meet continual miniaturization of semiconductor process, says Dave Arguin.

It may not be breaking news that the last five years have been somewhat of a roller coaster ride in the semiconductor industry - with an emphasis on downward motion. According to a recent profile of the semiconductor industry, Yahoo Finance declared, '_the bottom dropped out [of the industry] in 2001 - and stayed dropped out through 2002 and much of 2003'. 'By just about any measure, the decline was the sharpest in the history of the industry.' The profile blamed this bleak period on weak sales for all kinds of electronics gear: 'From PCs to cell phones to networking equipment, [low sales] meant soft demand for the chips that make them work.' While numbers were a little better for 2003, 2004 and slightly better still in 2005, the semiconductor's overall fiscal health is still struggling.

The point of this sobering economic outlook is no mystery: to remain competitive in the semiconductor industry, manufacturers must consider every possible way to maximize revenue and, perhaps more critically, to reduce expenses while improving quality.

With profit margins already razor thin, keeping expenses as low as possible is a matter of corporate life and death.

While it may seem paradoxical, one viable way to save money would be to spend it.

To its credit, the industry has never shied away from making sound investments, devoting an impressive US$10 billion - 14% of sales - to the purchase of capital equipment.

The key is to ensure that the equipment being purchased is not only sensibly priced, but also that it will translate to savings based on reduced downtime, lower maintenance costs, and improved throughput.

One of the best investments those in the semiconductor industry can make is in the field of precise motion control; certainly, there is ample evidence to support this contention.

'Moore's Law', developed in 1965 by Gordon E Moore, co-founder of Intel Corporation in 1968, predicted that the number of transistors the industry would be able to place on a computer chip would double every year.

His prediction has proven to be incredibly accurate; consequently, each new generation of chip technology has driven the continual miniaturization of semiconductor process manufacturing.

As this miniaturization continues, the need for better and more precise motion control becomes more essential.

Further evidence can be found at Web site, www.future-fab.com, which states, 'As semiconductor process technology approaches the theoretical limits of atomic physics, motion control solutions are becoming increasingly important to the design and performance of next-generation process tools and to the overall factory effectiveness (OFE) of the fab.' Conversely, as precise motion control increases in importance, manual operator interaction with semiconductor tools becomes a less viable option because it introduces variables into a well controlled process.

Any manual intervention cannot be performed with a high level of repeatability, and intervention can disturb the precisely controlled process and introduce foreign particles into the process ('Single Control Design is Within Reach', 'Design News', June 6, 2005).

With the case for better motion control firmly established, the question of which system to use comes to the forefront.

There are myriad assemblies that can be incorporated into any machine or system that is moving the product into, out of, or around the work area in a semiconductor manufacturing operation.

While linear ways or ball slides have traditionally been the devices of choice to control this movement, there are now alternatives that offer comparable precision and efficiency.

What's more, because they require far less maintenance, the alternatives can produce significant savings in the form of decreased operational downtime.

One of the most innovative devices now available for motion control in semiconductor manufacturing - in machines such as wire bonders, die bonders, magazine handlers, inspection equipment, dispensing systems, printers, and test handlers - is a 'slide', which consists of a precision aluminum guide and carriage, driven by a precision rolled stainless steel leadscrew.

These slides are available with a wear-compensating, anti-backlash driven carriage.

Two rails can be used in parallel for a wider wheel base and additional driven or passive carriages can also be added.

More important than the slide's mechanical specifications are the cost-cutting benefits of the device.

Ball slides require lubrication on a regular schedule, which is not only time-consuming but drives up the total cost of the manufacturing process.

There are slides available that are self-lubricating and thus require no lubrication throughout the life of the mechanism.

This also makes them suitable for many wash-down environments.

Without the need for lubrication, another financial benefit is realized.

Lubricants present a constant threat of work area contamination: if a device or part is lubricated, dust will be drawn to that product like a magnet.

Ultimately, this can lead to increased wear and tear, which can diminish the life of the part and subsequently lead to increased downtime.

As anyone connected to the semiconductor market can attest, 'downtime' is dreaded in the industry.

Semiconductor manufacturing is a high-volume exercise, and the ability to keep up with demand by maximizing operational uptime, tool utilization and efficiency - even when demand is sagging - is critical.

In this innovative, new slide, a lead screw drives the carriage, eliminating the need for a separate drive component.

The lead screw is now captured within the slide, which, in turn, can be positioned to the side of the equipment rather than in the middle.

The value of this design cannot be overstated, as the center space is a key work area in many applications.

Consequently, the machine designer is afforded greater flexibility to add features and accomplish tasks that would otherwise not be possible.

Further, alignment concerns between the screw and guide are alleviated by the slide's integrated configuration.

With a performance that is comparable to ball slides in many ways, the slide is actually more economical - not just over the long-term with decreased downtime, but initially as well.

Replacing traditional linear ways and a separate drive can represent a cost savings of about 50%.

Consider the savings that can be accrued when multiplied by the number of slide assemblies that might be used in a chip facility.

In a given machine, anywhere from two to ten traditional assemblies may be utilized.

Larger companies in the semiconductor marketplace may use as many as 1000 machines in their facility.

A 50% cutback in parts costs over this number of machines will represent dramatic savings that can have a positive impact on a company's 'bottom-line' profit.

The new, compact slide assembly is becoming a very popular alternative to linear ways, ball slides and square rails.

As has already been seen in the medical and packaging markets, there is a place for it in the semiconductor industry.

In fact, some 60 to 70% of all applications that are driving with a lead screw can use a slide as well, so the product's usage in the semiconductor industry is virtually limitless.

Pick-and-place for fine pitch and odd-form

2007-01-01T23:38:00.000-08:00

A pick-and-place system has two trolleys and also dual heads, allowing both fine-pitch/odd form electronic components and chips/ICs to be placed on PCBs extremely accurately.

The Assembleon AX-201 pick-and-place system from Kaisertech has two trolleys and also dual heads, allowing both fine-pitch/odd form electronic components and chips/ICs to be placed on PCBs extremely accurately. Apart from operating independently it can also be configured together with either the AX-301 or AX-501 modules to boost production, or operated, for example as a prototyping solution or for short production runs. Even 01005 components can be placed between the leads of a QFP at full speed.

It is said to deliver more output for a lower investment, is completely self-calibrating, and offers more feeder positions with a wider variety of components for increased production line flexibility.

Interchangeable robot heads make it easy to scale production output in 7500 component-per-hour steps without rebuilding or recalibration.

The AX-201 will handle up to 18,000 components/h with a placement accuracy of 20 micron.

Component range is 0.4 x 0.2mm to 45 x 45mm and 66 x 2mm to 165 x 2mm for odd form, and maximum component height is 40mm.

Board sizes up to 515 x 457mm and 0.3 to 6mm thick can be accommodated.

Easy and flexible product changeover is provided by off-line feeder set-up and off-line placement program creation, enabling reconfiguration to be achieved in just minutes.

Through Kaisertech, Assembleon engineers can help customers to optimise line output and yield, minimise process changeover times, improve the production line's ramp-up, and continually manage machine operational costs.

Furthermore, a remote 'LIFEsupport' service provides continuous monitoring of a line to maximise first pass yields and guarantee performance to pre-defined levels.

It also helps reduce maintenance costs and gives early warning for parts replacement and component replenishment.

Electronics production equipment catalogue issued

2007-01-01T23:37:00.000-08:00

Available in both print and CD format, Kaisertech's 166-page 2007 electronic production equipment catalogue contains items from small tools and consumables to capital equipment.

Kaisertech's 166-page 2007 electronic production equipment 'Katalogue' is now available in both print and CD format.

The A4 publication has 14 sections that contain items from brand leaders, together with own products, ranging from small tools and consumables to capital equipment.

Typical equipment includes SMT pick-and-place systems, vision inspection, fume extraction, dispensing, soldering and rework, environmental test, ESD products, cable and component preparation and others.

Fuel cell power unit is rewarded

2006-12-31T23:37:00.000-08:00

Jadoo Power Systems was honoured with an Electronic Products' Product of the Year Award for its N-Gen Fuel Cell Power Unit.

Jadoo Power Systems (Jadoo), the leading supplier of portable fuel cell systems, has announced that it was honoured with an Electronic Products' Product of the Year Award for its N-Gen Fuel Cell Power Unit. The Jadoo N-Gen is an easy to use fuel cell system generating 100W and 12VDC of clean fuel cell energy. Power support is critical when grid power is either unavailable or unreliable and many applications, including portable radio and laptop battery recharging, law enforcement surveillance installations, critical off-grid communications devices like satellite phones, walkie talkies, modems and network repeaters, can take advantage of the features of the N-Gen.

utilising the company's patented N-Stor Fuel Canisters, the N-Gen power unit has multiple fuel runtime options.

For example, using Jadoo's N-Stor360 can provide 360W-h (30A-h) of predictable continuous runtime.

There is no degradation or memory effect as exists with a standard battery.

When used with the company's award winning XRT product, upwards of 2200W-h (180A-h) of runtime and 110VAC support can be achieved.

'Fuel cells show great promise in driving devices off-grid without the environmental, bulk, or weight penalties of batteries and generators, but required design-in for their particular application.

The N-Gen Fuel Cell Power Unit is the first prosumer fuel cell system, with industry-standard battery connectors for easy integration into consumer devices,' said Alix Paultre, Executive Editor, Electronic Products Magazine.

'These power systems use 130 and 360W-h fuel cartridges with onboard intelligence to provide accurate state-of-fill information for ease of use and predictable operation.' The editors of Electronic Products, a leading trade publication for electronic design engineers, evaluated thousands of products launched in 2006 on the basis of innovative design, significant advancement in technology or application and substantial achievement in price and performance.

The 2006 Product of the Year Awards will be announced in the January 2007 issue of Electronic Products with a cover feature and a brief description of each product.

2006 marks the 31st anniversary of Electronic Products' 'Product of the Year' Awards, which began recognizing the best products in the industry in 1977.

'We are honoured to be chosen by the editors of Electronic Products Magazine for this prestigious award,' said Jack Peterson, VP of Sales and Marketing at Jadoo.

'Our team has worked hard to deliver the highest quality, best value fuel cell products available today.

Providing critical power support for emergency preparedness, law enforcement, and other off-grid applications is our company mission and to be recognised for these efforts is outstanding.

3-D TRF-G30 LED Bulb Glows Colourfully

2006-12-31T23:35:00.000-08:00

LEDtronics announces TRF-G30 LED Bulbs that offer beautiful lighting in many versatile applications.

LEDtronics announces TRF-G30 LED Bulbs that offer beautiful lighting in many versatile applications. The G30 series LED bulb comes in a globe covering that allows the LEDs to shine in multiple directions (three dimensions) while still being protected from the environment. This hardy bulb is perfect in any situation that allows for 25mm Edison screw base attachments.

Applications perfect for this bulb include decorative lighting, lamps, tollbooths, low-level beacon warning lights, receiving docks, task lighting, cabinets, displays, concealed lighting, retail store shelves, and more.

These high quality and patented LED bulbs can directly replace standard 120 volts AC Type incandescent bulbs allowing a long lifespan up to 100,000 hours.

Furthermore, these LED bulbs are resistant to shock and vibrations, and will not burnout from frequently being switched on and off.

The best part of the G30 series bulb is they only consume 13 watts of power while still creating so much light! These bulbs require no retrofitting kits and will install like a normal bulb allowing you to replace old and outdated incandescent bulbs painlessly.

In addition, an optional E27 European screw base is available to fit 27mm screw bases instead of the standard 25mm.

Revised Surface Insulation Resistance standards

2006-12-30T04:31:00.001-08:00

Gen3 Systems has announced the release of revised Surface Insulation Resistance (SIR) standards designed to improve reliability and integrity testing of products assembled with lead-free solder.

Gen3 Systems, a company dedicated to 'Engineering reliability in Electronics' has announced the release of revised Surface Insulation Resistance (SIR) standards designed to improve reliability and integrity testing of products assembled with lead-free solder. IEC (International Electrotechnical Commission) has published a new SIR test standard (IEC 61189-5) on August 31, 2006. Additionally the US-based IPC (Association Connecting Electronics Industries) will also shortly release new SIR testing standards: IPC-TM-650 2.6.3.7 and IPC 9201A SIR Test Handbook.

In addition, the IPC recently published a standard, employing SIR techniques, to determine the influence of sub-surface reactions known as CAF (Cathodic (or Conductive) Anodic Filamentation).

The new standards, for both individual materials and production process characterisation, adopt different test parameters for humidity, temperature, test duration, voltage bias, measurement frequency and test coupon, to take into account the effects of new production processes when using lead-free assemblies.

Lead-free assemblies are rapidly becoming the norm following the EU's Restriction of hazardous substances (RoHS) legislation that passed into law on July 1, 2006.

Any manufacturer now wishing to import electronic assemblies into the EU must ensure the printed circuit boards (PCBs), components and solder contain no lead.

Similar RoHS legislation is likely in many US states and China in the near future.

'What is not widely appreciated is that modern lead-free electronic circuit production is dominated by chemistry, and pretty aggressive chemicals at that,' says Gen3 Systems' MD Graham Naisbitt.

'Ionic residues arise from a multitude of manufacturing process 'contaminants' such as unreacted plating residues, improperly cured solder resists, soldering fluxes and inadequately cleaned assemblies (including those manufactured using no-clean processes).

Other contaminants may be non-ionic in nature, left behind, for example, by surfactants increasingly used to aid no-clean flux do its job.' These ionic contaminants (in the presence of electric potential and humidity) can cause failure due to electro-chemical reactions.

Exhaustive research by the world-renowned national physical laboratory (NPL) in the UK, and Concoat Systems (the forerunner of Gen3 Systems), determined that measurements of changes in SIR would be a valuable, if not essential, metric in determining the susceptibility of electronic circuits to electro-chemical failure.

However, to date, SIR testing has only been used to characterise individual process chemistries such as solder.

In addition, NPL's research has now shown the test parameters used for these tests have yielded grossly misleading data.

Now the revised standards define SIR testing procedures that can be used to characterise a process using a test vehicle assembled with the actual process materials used for modern lead-free, no-clean technology.

In the new procedure the assembly under test is driven to failure to establish at what point reliability is compromised by the reactions of ionic (and non-ionic) residues.

This is important because of the differences in lead-free assembly compared with production using eutectic solder (60% tin(Sn) and 40% lead(Pb)).

The IPC is now recommending lead-free alloys such as SAC305 (Sn96.5% Ag3.0% Cu0.5%) for electronics assembly.

These solders require much higher reflow and flowsoldering temperatures (219 deg C compared to 183 deg C for eutectic solder).

'The higher processing temperatures typical of lead-free assemblies change how contamination forms.

For example, all fluxes leave residues, but at elevated temperatures, these residues are more likely to be absorbed into the substrate increasing the overall ionic contamination,' says Naisbitt.

Gen3 Systems manufactures the Auto-SIR insulation resistance testing system.

The system has been developed in collaboration with the NPL.

The Auto-SIR tests to all major international standards, including the revised versions specifically recommended for lead-free assemblies.

The Auto-SIR employs Frequent Monitoring Trend Analysis (FMTA).

This can be used to monitor long-term process condition trends.

Naisbitt is a member of the International Electrotechnical Commission's (IEC) TC91 WG3, the working group that formulates test standards for the assembly industry.

He is also Leader of Solderability Testing Standard IEC 60068-2-69, Co-leader of Solderability Testing Standard IEC 60068-2-54, and Member of IPC-J-STD 002 and IPC-J-STD 003.

Further information: SIR testing SIR testing was established as a method for evaluating electronic assembly materials and processes as one measure of reliability.

The objective of SIR testing is drive test coupons to failure to determine at under what conditions failure-inducing electrochemical reactions occur so that these conditions can be avoided during routine assembly.

Electrochemical failure occurs in the presence of electrical potential, moisture (from a humid environment) and ionic residue.

If any of these is not present, electrochemical reactions can't occur.

The ionic residue can come from unreacted plating residues, improperly cured solder resist or from flux.

These residues can cause corrosion, metal migration or dendritic growth leading to early failure.

SIR testing is performed with industry standard test coupons etched with patterns designed for the purpose (typically interdigitated combs).

The insulation resistance of a test pattern is monitored at intervals as temperature and humidity are varied.

Revised tests recommend test coupons complete with components.

There are several standards from organisations such as International Electrochemical Commission (IEC), IPC, International Standards Organisation (ISO) that largely replace the now defunct Bellcore specification.

Each defines different humidity, temperature, test duration, voltage bias, measurement frequency and test coupon.

It is recommended that technicians refer to the latest version of the IPC-9201 The SIR Handbook for detailed guidance on the subject.

Complete range of optoelectronics

2006-12-30T04:30:00.000-08:00

New campaign provides a one-stop shop for displays, visible and non-visible LEDs.

As part of its commitment to bringing the very latest technology to design engineers, Farnell InOne, the international distributor of electronic and industrial components, has launched its latest 'Technology First' initiative on rapidly developing optoelectronics technology. The new 'Technology First' campaign will offer the only complete range of optoelectronic technology available to the market, including displays, visible and non-visible LEDs, through a dedicated catalogue and the Farnell InOne website. 3,500 optoelectronic parts are available as part of the campaign - 2,000 of which are new to the industry - from a wide range of manufacturers such as Avago Technologies, Omron and ST Microelectronics.

Jamie Furness, EDE development manager at Farnell InOne, comments: 'Optoelectronic technology has developed and improved very rapidly in recent times.

LEDs have become more powerful, allowing them to have high levels of brightness whilst retaining efficient power monitoring.

This means that where design engineers may have had to use bulbs in the past, they can now use LEDs, opening up many new avenues.

Where LEDs were principally used in areas such as the mobile phone, handheld PC and game console markets, they can now be applied anywhere from the medical world to the security industry.

'As such, we feel it's really important to make sure that design engineers have all the support needed to make informed decisions that will help them achieve real benefit from these cutting edge developments.

Diagnostics softwarecomes with reference design

2006-12-29T02:51:00.000-08:00

Kozio has announced that evaluation versions of the company's kDiagnostics software product now ship with ADI Engineering's new Sidewinder XScale IXP465 Access Gateway Reference Design.

Kozio has announced that evaluation versions of the company's kDiagnostics software product now ship with ADI Engineering's new Sidewinder XScale IXP465 Access Gateway Reference Design. Kozio's turnkey validation package includes proven test suites for DDR SDRAM, Flash, Mini-PCI and connected devices, 10/100 Ethernet, Ethernet Switch, FXS and VoIP ports, USB 2.0 ports, USB 1.1 device port, SATA 1.0 host port, ATA port, RS-232 port. This validation suite is provided for evaluation purposes, and a complete validation package can be configured for custom IXP465 boards in just two weeks.

'We've been working with Kozio for more than two years to make it easier to prove out our hardware board designs, and kDiagnostics is a key product for us' notes Barry Dallavalle, software director of ADI Engineering 'It has proven to be extremely useful, and is a cornerstone of the factory test production we do for our customers, and a key part of testing boards that are returned.

Kozio is extremely responsive and very technically capable, and they are a pleasure to work with.' Kozio continues to expand its FullCircuit evaluation program, and continues to expand its long-running partnership with ADI Engineering This release of Kozio's validation software supports the new XScale IXP465 processor; Intel's latest processor in the IXP4XX family, and includes updates to its automated VoIP and USB test packages.

'We are pleased to continue our strong and productive partnership with ADI Engineering as they expand their offering of XScale reference platforms,' stated Joseph Skazinski, president of Kozio.

'This year we are shipping on twenty processor reference platforms for PowerPC and XScale, and are very pleased with how our evaluation program has taken off.' kDiagnostics' USB validation suite verifies the operation of Universal Serial Bus (USB) 2.0 and 1.1 host and devices.

Tests and commands are provided to perform a full reset of the host controller, start the host controller running, perform device enumeration tests, validate the basic functionality of an internal USB device, and display information about internal USB devices, including USB 2.0 support, bulk transfers, and supported endpoint packet sizes.

In addition, mass transfers to a connected USB storage device are offered when the device supports such a feature.

The Voice/Audio test commands verify the higher-level functionality of voice channels utilizing SLIC (Subscriber Line Interface Circuit) components.

Tests in this category validate data transfer to and from SLICs using the high-speed serial interface.

Tests include voice recording and playback from a connected telephone and D-F (Dual Tone Multiple Frequency) tone generation and detection (also known as touch tone dialing).

Low-level commands are available for generating dial tones, busy signals and can also be used to generate a perfect 1 kHz test tone.

Kozio's support is available immediately for any custom IXP465 board design.

Kozio can deliver turnkey diagnostics for custom boards using the Intel XScale IXP465 in two weeks after a purchase order is received, and even sooner, if required.

Kozio provides proven hardware validation software for automating and accelerating the development of new processor-based devices.

Kozio's software is proven during processor validation and through processor reference platform partnerships.

Product developers using Kozio products save time during board bring-up, during production test, and throughout the product lifecycle.

Using Kozio's products saves development effort and reduces the risk of processor-based projects.

Automated assembly system use extended

2006-12-29T02:50:00.000-08:00

Leading automotive supplier, ArvinMeritor has extended the use of its GBP 0.5 million Komax Systems (formerly Sibos) automated assembly system.

Leading automotive supplier, ArvinMeritor has extended the use of its GBP 0.5 million Komax Systems (formerly Sibos) automated assembly system by arranging for it to be rejigged and retooled for a new production job in China. Komax Systems is represented in the UK by production automation specialist, Contax . The original Komax automation system was tooled up for a product manufactured at ArvinMeritor's factory in Tennessee, USA in 2000.

Production started in 2001, and the Komax system proved very successful.

When the product was discontinued, ArvinMeritor wished to retain their Komax system and redeploy it at another site.

Explained Rupert Mander, Industrialisation Manager at ArvinMeritor, 'The system had worked well for us and we decided to find another use for it.

It was designed in a flexible manner and we wanted to exploit this to ensure that we had full use of the system during its lifecycle.' ArvinMeritor identified a new task for the Komax system, producing the locking mechanism for car doors at its factory in China.

The system was duly shipped from the USA via the UK to Komax's factory in Switzerland where it was retooled and sent on to China.

'This is a perfect example of maximising investment,' commented Contax's managing director, Mike Rapson.

'When our customers purchase a high quality system they need to be sure that they will reap the rewards over a long period of time.

'ArvinMeritor wanted to extend the life of their automation system, and found that it was more cost effective to have it re-tooled and shipped half way around the world than to replace it.

They know that it performs well and it was worth the initial investment and the extra cost of retooling.' He continued, 'New is not always the only solution.

In circumstances where our customers have made a major capital investment in a system, we would always seek to maximise its use, by reconditioning or retooling it where required.'

Adhesives and coatings made for electronics

2006-12-28T02:50:00.000-08:00

A comprehensive family of coatings, adhesives, encapsulants, potting, sealing and masking products cover micro-electronic and opto-electronic manufacture, rework and repair.

Ever increasing sophistication is the story of adhesives in the electronics industry and market leaders Intertronics are at the forefront of that movement in the UK. The Dymax range of adhesives from Intertronics is a comprehensive family of specialist coatings, adhesives, encapsulants, potting, sealing and masking products for micro-electronic and opto-electronic manufacture, rework and repair. In particular they are valuable for unitising/strain relief, wire tacking, heat dissipation and ruggedising of assemblies.

The Dymax UV curing adhesives are ideal for wire tacking and thermal management situations, offering fast cure times with ease of use and high in-situ performance.

They are easy to use, low cost UV cure adhesives that cure in seconds so offering increased productivity over epoxies, silicones and hot melts.

The 'on demand' cure feature of these resins means no rework as a result of adhesive migrating onto solder pads or through holes.

Dymax adhesives are ideal for bonding heat skinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering.

Industrial components migrate to Zanzibar

2006-12-28T02:49:00.000-08:00

Distributor of electronic and industrial components, repair and operations products and services, is one of the first suppliers to migrate its complete catalogue to emarketplace, Zanzibar.

Farnell InOne, international distributor of electronic and industrial components, repair and operations products and services, is one of the first suppliers to migrate its complete catalogue from the OGCbuying.solutions Catalist service to its new emarketplace, Zanzibar, allowing public sector buyers direct access to the full Farnell InOne range. The transition of over 130,000 Farnell InOne products to the new system is the largest on the Zanzibar site and enables buyers direct access to the distributor's range over the internet to transact end-to-end requisitions, orders and invoices. The Zanzibar website is a key part of the Government's procurement strategy and is accessible by all public sector organisations in the UK, allowing government departments both choice and financial savings in their procurement efforts.

Mark Peers, Public Sector Business manager of Farnell InOne commented: 'As one of the first suppliers to make the transition from Catalist to Zanzibar, we can offer our public sector customers buying efficiency with both major procurement savings and a wealth of e-procurement benefits - from online transactions to e-invoicing'.

'This means that the full Farnell InOne linecard - from tooling, to lighting, maintenance and repair equipment and our full RoHS compliant catalogue - is now available across the entire public sector.'

Placement machine platform wins technology award

2006-12-27T00:46:00.003-08:00

The Electronics Assembly Systems Division of Siemens' Automation and Drives Group has gained the Global Technology Award for its Siplace D-Series placement machine platform.

The Electronics assembly systems Division of Siemens' Automation and Drives Group (A and D) has been honoured with the Global Technology Award for its Siplace D-Series placement machine platform which was introduced earlier this year. The Global Technology Awards, now in its second year, are designed to recognise companies and people that are achieving the highest standards and driving the industry forward. The new Siplace platform impressed the independent panel of judges with innovations such as the digital vision system, linear direct drives and state-of-the-art software that produce significant time and cost savings in the manufacturing process.

The award was presented at the Assembly Technology Exposition in Rosemont, Illinois, USA.

The new Siplace platform, which was globally introduced in May 2006, meets the requirements for both standard and high-performance applications.

It is based on the modular Siplace platform and features the digital Siplace vision system as well as the latest Siplace software.

With this combination, it meets the needs of all electronics manufacturers in terms of flexibility and price-performance ratio.

Equipped with the innovative digital camera technology, the machines of the Siplace D-Series are able to recognise and reliably place an extremely wide range of components at maximum placement speed.

Its special high-resolution sensors identify components based on their geometry and colour.

Furthermore, the vision system can be pre-optimised for the next measurement to quickly and reliably detect faulty components.

This is extremely beneficial when placing components with leads that are difficult to distinguish from the background.

The vision system then transfers this new data to the Siplace Pro programming system, which makes it available to the placement machine.

Any adjustments can be made directly on the machine or offline on the Vision Teaching Station.

Representing the award sponsor, Global SMT and Packaging, Trevor Galbraith summed up the award: 'The independent jury of Chinese, European and American industry experts felt that the D-Series from Siemens AandD met all the criteria required for this prestigious award.

It was judged on the supplier's capability to meet industrial challenges and apply existing technologies in a creative manner.

The panel also felt that the system excelled in overall quality, economic efficiency and consistent performance.' Ray Bruce, divisional director of the UK and Ireland EA division of the Siemens Automation and Drives Group commented: 'I am delighted to accept this award and that the D Series has achieved this recognition.

It is testament to our ongoing work and commitment to build solutions that deliver true technological and efficiency advantages to our customers.'

DC appliance connector cables power mobile devices

2006-12-27T00:46:00.001-08:00

Quadrant has introduced to the UK a new range of DC appliance connector cables from Pro Car designed to power mobile electronic devices.

Quadrant has introduced to the UK a new range of DC appliance connector cables from Pro Car designed to power mobile electronic devices such as LCD-TV, DVD players, satellite receivers, TFT displays and other equipment in the automotive, marine, leisure and industrial industries. Manufactured by Pro Car, a German company with a high reputation for top quality DC plugs, socket outlets and connectors for connecting accessories and equipment to on-board electrical systems, this new range comprises 2A and 8A versions both of which connect a Universal plug to either a 2.1mm or 2.5mm diameter connector via a two metre, 2-core flat cable. The 2A version has a cable diameter of 0.4mm2 and connects to a right angle connector while the 8A version has a 0.75mm2 cable with a straight angle connector.

A version with a 12V DC 70W voltage regulator with an input voltage of 10.5 to 13.8VDC and an output voltage of 13 to 14VDC connects to a 2.5mm diameter connector and guarantees 12V even if battery runs low.

Surface mounter is +/- 45 micron place accurate

2006-12-26T00:45:00.000-08:00

A high-reliability surface mounter, which can place components to an accuracy of +/- 45 micron provides a cost-effective pick-and-place system that enables rapid return-on-investment.

Sony Manufacturing Systems Europe has extended its successful range of cellular electronic production equipment with the announcement of a new high-reliability surface mounter which can place components to an accuracy of +/-45 micron. The SI-F130AI high-speed mounter provides a cost-effective pick-and-place solution that enables rapid return-on-investment. The F Series has been proven in Sony's own production facilities and by third parties over an extended period of time.

'Our ethos is to provide real return-on-investment at every point in the cycle,' said Kazuo Ito, UK-based managing director of Sony Manufacturing Systems Europe.

'At the outset we offer flexible rentals, so that via leasing, our customers can increase their production capacity by 25,900 components/h (CPH) for just EUR 2,500/month'.

'By cutting maintenance requirements we also reduce lifetime cost: the small footprint of our cellular mounters allows us to provide maximum productivity per square metre of factory space.' Featuring an advanced 'third generation' Sony developed rotary 'planet' head that can move freely in two directions, and with an overlapping process to pre-load components, the SI-F130AI achieves tact times as low as 0.139s.

The device also features an ejector system that reduces PCB load/unload time to zero, further cutting cycle time.

The SI-F130AI is only 120cm wide and less than 145cm deep.

All Sony chip mounters are designed so that multiple cells can be connected in-line, within a small space, giving full flexibility to meet any low, medium or high mix production and throughput demands.

Equipped with high-speed 'on-the-fly' parts recognition, the SI-F130AI features an image processing system that automatically generates image data for complex new parts.

Its compact cellular design extends Sony's approach of offering a market-leading combination of speed, placement accuracy, and small footprint, to help create production lines that are flexible and expandable and thus improve cost-performance figures.

To facilitate its customers' advanced manufacturing operations, Sony Manufacturing Systems collaborates with Sony's Financial Services division to provide a range of monthly rental or finance options.

These give customers access to the latest technology, whilst managing capital expenses.

Sony Manufacturing Systems has worked closely with its software partner, Sony TiMMS, to offer further integrated hardware/software solutions for customers with more complex data handling and process requirements.

The TiMMS system not only provides industry leading mounter optimisation, but also real-time lean manufacturing control between procurement, design, manufacturing and test, improving inventory management and ensuring that their final product is not only completed most cost-effectively, but is fully traceable before and throughout its life cycle.

* About Sony - Sony manufactures audio, video, communications and information technology products for the global consumer and professional markets.

With its music, pictures, game and online businesses, Sony is uniquely positioned to be one of the Worldandacute;s Leading Consumer Brands.

Sony recorded consolidated annual sales of EUR 54.96 billion (yen 7,475 billion) for the fiscal year ended March 31, 2006 and it employs approximately 156,500 people worldwide.

In Europe, Sony recorded consolidated annual sales of EUR 12.61 billion (yen 1,715 billion) for the fiscal year ended March 31, 2006, based on an average market exchange rate for the same period of yen 136 to the EUR.

Sony Europe, headquartered at the Sony Center am Potsdamer Platz in Berlin, Germany, is responsible for the company's European electronics business and registered consolidated sales of EUR 8.22 billion (yen 1,118 billion) for the fiscal year ended March 31, 2006.

* About Sony Manufacturing Systems - drawing on a wealth of Sony experience and expertise in manufacturing, Sony Manufacturing Systems Europe (SMSE) provides manufacturing equipment and devices to aid technology development, design and quality assurance for a broad spectrum of industries.

These include automotive, aerospace, medical, systems manufacturing, consumer electronics and surface mount technology (SMT).

The SMSE product portfolio includes SMT equipment, measuring systems for motion and quality control, factory automation equipment and data recorders, as well as DUV lasers and optical disc analysers.

With its headquarters at Weybridge, UK, SMSE is the European arm of Sony Manufacturing Corporation, Japan.

It operates as a division of Semiconductor and Electronic Solutions (SES), a division of Sony United Kingdom - Show quoted text -

Fuel cell technology provider chosen

2006-12-26T00:44:00.000-08:00

Jadoo Power Systems has announced that Jadoo and technology partner Millennium Cell was chosen as fuel cell technology providers for the Greater Columbia 'Fuel Cell Challenge.'

Jadoo Power Systems has announced that Jadoo and technology partner Millennium Cell was chosen as fuel cell technology providers for the Greater Columbia 'Fuel Cell Challenge'. The Greater Columbia 'Fuel Cell Challenge' is a groundbreaking plan involving unprecedented integration of hydrogen fuel cell technology into multiple aspects of the City and University. Columbia's vision is to become the first planned end-to-end fuel cell city by building an innovation pipeline around fuel cells in three phases: Discovery, Development and Deployment.

Jadoo's line of N-Gen Fuel Cell Power Units and XRT Extended Runtime Accessories were awarded to various companies, governmental agencies and university research groups for use with a variety of sponsored projects.

Emergency Responders as well as Professional TV Broadcasters will benefit from the latest in fuel cell technology.

Features such as long runtime, zero degradation and rapid recharge make Jadoo's fuel cells an attractive power alternative for current 'brick' battery and generator users.

'Columbia is excited that the initial wave of projects includes a family of fuel cell products that already are commercialized and have an economic value proposition,' said City of Columbia Mayor Bob Coble.

'Building a knowledge economy in Columbia centreed around leading edge fuel cell technology is what this challenge is about.' 'Maintenance issues involved with gas generators and back-up battery usage is no longer a problem with the Jadoo XRT fuel system,' said Deputy Director Harold Reaves with the City of Columbia Department of Homeland Security.

'Predictable, reliable, off-grid power in a portable package will help our department respond more efficiently in emergency situations.' 'At ETV we love being on the cutting edge of education and technology, and we are very excited to be using Jadoo's N-Gen power units,' said Moss Bresnahan, President and CEO, SCETV.

'Thus far, our engineers are very impressed, and we are pleased to be part of this commitment that South Carolina is making in hydrogen fuel cell use.' Jadoo's XRT provides extended power support for a variety of battery operated applications when the grid is either unavailable or unreliable.

The XRT is a 100 W, 110VAC / 12VDC power support system with over 2200 Watt-hours runtime.

It is ideal for off-grid, critical applications, such as portable radio and laptop battery recharging, powering mobile law enforcement surveillance installations as well as providing back-up power for critical communication devices like satellite phones and modems.

The XRT currently uses six metal hydride canisters for fuel storage, which weigh approximately 30 total pounds.

Together with Millennium Cell, Jadoo is developing a chemical hydride-based fuel canister for the XRT that will deliver the same runtime at half the weight.

In the second phase of this program, the chemical hydride canister will be deployed in the applications targeted as part of this initiative.

'Millennium Cell is pleased to be partnered with Jadoo and South Carolina to provide an innovative, light weight fuel canister for the XRT.

We continue to be impressed with the initiatives in South Carolina and are honoured to be part of the first round of awards in this world class program,' said Adam Briggs, President of Millennium Cell.

'Being involved with the projects that Columbia Fuel Cell Challenge has awarded is very exciting,' said Larry Bawden, President and CEO at Jadoo.

'It is exactly what is needed to 'jump-start' large scale interest and draw attention to the new opportunities and applications that exist for hydrogen fuel cell power.

Columbia is truly developing a new economy around the latest in commercially-viable, alternative power.

X ray systems installed in Scotland

2006-12-25T00:43:00.001-08:00

Production automation system specialist, Contax , has recently installed four phoenix x-ray systems at different organisations in Scotland.

Production automation system specialist, Contax , has recently installed four phoenix x-ray systems at different organisations in Scotland. The users include: Selex Sensors and Airborne Systems, Kelvinside Electronics and two further electronic manufacturing companies. Selex Sensor and Airborne Systems, has purchased the phoenix x-ray nanome|x system to support the Captor Radar Tranche-2 Programmme for the Eurofighter Typhoon military aircraft.

Two major units of the system are manufactured by Selex in Edinburgh.

The printed electronic circuit assemblies within these units have a high population of BGAs, and the nanome x is used to provide diagnostics in the event of any test failures.

Commented Steve Touhey, production engineering Manger for Radar and Advanced Products at Selex Sensor and Airborne Systems, 'Without the diagnostic capabilities of the nanome x, the inspection and assessment of individual BGA joints, especially on micro-BGAs would be nigh impossible'.

'We chose this system because of its ease of use, clarity of image and downloadable software, which was specifically designed for the inspection of voids within BGA joints'.

He continued, 'In a perfect world, the nanome x would not be needed.

However, in the event of a test failure occurring its capabilities should ensure that the time taken to identify the route cause is kept to an absolute minimum,' he said.

Another user, Glasgow-based contract electronics manufacturer, Kelvinside Electronics Limited (KEL), specialises in supplying the military, medical, oil and gas industries, all of which have very high quality standards.

KEL has purchased the phoenix pcb|analyser to examine BGAs on circuit boards.

Explained David Baird, Managing Director at Kelvinside Electronics, 'We decided to purchase the phoenix pcb|analyser due to being awarded two large military contracts which involves a lot of BGA analysis.

This has provided us with a number of advantages.

Not only do we have greater control over reporting, but we have seriously reduced our turn-around time due to a much improved throughput of PCB assemblies'.

He concluded, 'Contax had recommended the phoenix system, and we were very happy with the demonstrations and reference sites.

The system is now in place and working extremely well for us.

It is on our network, and information taken from each board is stored and available to our clients.

In fact, the system has already proved so invaluable, that we have not yet had time to examine its full potential,' he finished.

The Making of a Leader

2006-12-25T00:43:00.000-08:00

OK International celebrates 60 years of manufacturing tools for the electronics assembly industry.

This year marks the 60th anniversary of OK International, the leading supplier of production assembly equipment. OKi has come a very long way since 1946, when it first opened its doors for business, but the company's direction and success today owe a great deal to its early years, and the vision of its founders. At its inauguration, OK Machine and Tool Corporation was a specialist in the precision machining of metal parts, primarily for the defence industry.

Over the following years, its focus evolved to the point that by the 1970s, it had moved into the manufacture and distribution of wire wrapping products for telephone switching systems.

Drawing on its expertise and knowledge of the telecommunications industry, it was then just a short step for OKi to make its processes available to the broader electronics industry.

Later, in 1989, OK International made the strategic decision that was to initiate the formation of the company we know today: it resolved to dedicate its resources to the development, manufacture and marketing of its own products, primarily for solder/desolder and rework.

Over the next few years, in alignment with that strategy, it acquired Metcal, Techcon and Impell.

Together with its own acquisition in 2000 by Dover Corporation, these acquisitions strengthened OK International's competencies in the manufacture and development of soldering, dispensing and fume filtration systems, and broadened its product line with patented technologies and products.

They also helped it to expand its customer base, markets, and geographic presence.

Today, thanks to these developments, OK International employs 300 people in 8 sites worldwide.

Its tools and systems are supplied to the global market through various channels including over 100 leading local distributors, and it counts the world's top OEMs and blue chip companies among its clients.

If getting to the top is no mean feat, staying there is even more of a challenge.

With this in mind, the company determined in 2005 that the time was right to strengthen its position by rebranding all its products under a single name.

The New OKi brand was launched at Productronica in the same year; a move that, for Paul Weaver, OK International's Vice President of European Sales, was faultless.

A year on, he notes: 'The principal benefit for our customers, our distributors and OK International itself, is clarity'.

'Before, with our multiple brands, it was sometimes difficult to deliver the message that we supplied equipment for every player and every part of the assembly workbench'.

'Now, our message is unequivocal, we offer the full range of soldering, rework, fume extraction and dispensing products, at all levels, from entry level to high-end tools and systems'.

'Now our clients are clear that they can source all of their equipment from us, whatever their application, whatever their technical requirements, whatever their budget'.

Of course, the message is important, but the messenger is even more important, and for OK International, its distributors are partners, to be supported locally, with a local sales message.

Again, where this was prohibitive as a multi-brand strategy, the single brand has facilitated its introduction.

Weaver: 'With our new localised marketing resources, we can concentrate on the specific needs of our local markets'.

'This is particularly important for our European distributors and customers, who receive local support and a local, rather than a global message'.

OK International has also opened up new sales channels, such as catalogue sales of its more mainstream products; a move that has proven highly successful in bringing in new clients.

The new message, new energy, new sales support and distribution channels, and new products mean significant growth in sales volumes.

This, in turn means more base materials handling, and more products coming off the manufacturing lines and moving through to the final customer.

It is clear that this must all be managed properly, as Weaver emphasises: 'The differentiator between us and our competitors is in our management of our total supply chain - from our vendors to after sales customer care'.

To this end, the company has been busy setting up new systems such as e-Kanban to streamline materials and production handling, and improving its consignment inventory management systems.

The result is lower cost manufacture and improved lead-times, all to the benefit of OK International, its distributors and its clients.

In driving these recent changes, OK International continues to demonstrate the determination and vision that have been the hallmark of its management since its inception 60 years ago, and there is no doubt that these qualities will continue to benefit the electronics industry well into the 21st Century.

Power quality technologies firm acquired

2006-12-24T00:42:00.000-08:00

The Schaffner Group, based in Luterbach, Switzerland, has announced it has expanded its competence by acquiring Jacke Transformatoren, a German company that develops power quality technologies.

The Schaffner Group, based in Luterbach, Switzerland, has announced it has expanded its competence by acquiring Jacke Transformatoren , a German company that develops power quality technologies. The acquisition is a strategic move to strengthen Schaffner's technological base and to become the first international company to offer solutions combining EMC, power quality and energy supply for systems and devices with globally recognised quality and performance standards. Schaffner has its US headquarters in Edison, N.J.

With its core markets of rail vehicles, alternative energy, ship-building, telecommunications, and transformer engineering, Jacke is an excellent addition to the internationally positioned Schaffner Group.

The merging creates a unique EMC and power quality competence which provides the foundation for new, innovative solutions to increase the operational safety and efficiency, as well as the productivity and profitability, of electrical and electronic systems.

Schaffner Jacke will continue its engineering and production operations in Banduuml;ren, Germany under its current management team.

Engineers' Views on Integrating CFD

2006-12-24T00:40:00.000-08:00

Flomerics has released the results of a new online survey highlighting engineers' views on integration between mechanical computer aided design (MCAD) and computational fluid dynamics (CFD) software.

Flomerics has released the results of a new online survey highlighting engineers' views on integration between mechanical computer aided design (MCAD) and computational fluid dynamics (CFD) software. When asked how important MCAD integration is for typical CFD users, 46% say it is 'very important today' and an overwhelming 68% say it will be 'very important in the future'. When the results are confined only to users of mechanical CAD software, these percentages increase to 52% and 74% respectively.

When asked what 'CFD integrated with MCAD' means, most people chose the option describing the tightest level of integration: 'A fully-embedded solution in a single environment'.

'The CFD user interface looks and operates like the MCAD software and the CFD solver interacts directly with the 'native' MCAD solid model data'.

'Most commercial CFD codes today are unable to solve directly using the native MCAD geometry,' said Ivo Weinhold, EFD Product Manager for Flomerics.

'Even vendors claiming 'Upfront CFD' capability actually require a translation from the native MCAD data into some neutral format such as Parasolid before the CFD analysis is performed'.

'The problem with this approach - apart from being slower - is that once transferred into the CFD environment all the design intelligence associated with the geometry such as assembly hierarchy, constraints and features are lost and only dumb geometrical entities remain'.

'This survey confirms that what engineers want is a familiar and consistent user interface for both the MCAD and CFD software, and full bi-directional associativity between the analysis data and the MCAD model'.

'Engineers also benefit from employing native CAD data and native kernel functions for meshing, preprocessing, and results visualization'.

'All of these requirements are satisfied by our EFD family of CFD software'.

The MCAD/CFD survey is based on over 600 completed responses from engineers using both CFD and mechanical design software in a broad range of industries.

The top three industries represented were aerospace and defence (32%), education (27%) and automotive (23%).

81% of respondents use CFD software and 55% use MCAD software.

The EFD family of CFD software from Flomerics includes EFD.Pro - a fully embedded CFD solution within the Pro/ENGINEER environment; EFD.V5, - a fully embedded CFD solution within the CATIA environment, and EFD.Lab - a general-purpose fluid analysis tool that includes a built-in solid modeler.

The analysis engine at the heart of the EFD product suite is the same analysis engine used by SolidWorks in their tightly-integrated CFD software - CosmosFloWorks.

All the software products in the EFD family work directly with the native CAD geometry and require no translation of data, so the solid model maintains intelligence such as assembly hierarchy, constraints, and features.

Users can take advantage of the existing data to conduct 'what if?' analyses directly from within their chosen design platform.

EFD makes it easy to perform flow simulation because it analyses the geometry and generates the computational grid in the background while the user only needs to interact with the familiar MCAD interface.

Distributor of electronic components runs a dash

2006-12-23T04:15:00.001-08:00

Farnell InOne, the Leeds based distributor of electronic components, entered a 26-strong running team - the 'Circuit Breakers' - in the Leeds Abbey Dash, raising GBP3,000 for Help the Aged.

The Leeds Abbey Dash annual fun run, which raises money for Help the Aged, saw over 3,500 people finish the 10km course on Sunday 26th November, with all proceeds going to fund an Help the Aged 'HandyVan' - an odd-job man service available to elderly members of the community in Leeds and West Yorkshire. Farnell InOne, the Leeds based distributor of electronic components, entered a 26-strong running team - the 'Circuit Breakers' - who raised a whopping GBP3,000 for Help the Aged. GBP1,000 of this was raised directly for Help the Aged, with a further GBP2,000 donated to the Armley Helping Hands Centre, a Help the Aged Charity that supports elderly people in Leeds and one that Farnell InOne has close links with.

Steven Webb, Company Secretary Farnell InOne, comments, 'Farnell InOne is proud to be associated with the Help the Aged Leeds Abbey Dash, and as well as raising money for a worthy cause the 'Circuit Breakers' all relished the challenge.

Support for evaluation kits with validation

2006-12-23T04:14:00.000-08:00

Kozio has announced support for Applied Micro Circuit's new PowerPC 440SPe Katmai, 440EPx Sequoia, 440GRx Rainier and 440GX Taishan Evaluation Kits.

Kozio, a leading provider of automated validation software ideally suited for board bring-up, manufacturing test and power-on self test, has announced support for Applied Micro Circuit's new PowerPC 440SPe Katmai, 440EPx Sequoia, 440GRx Rainier and 440GX Taishan Evaluation Kits. Kozio's kDiagnostics software will ship on these four new AMCC evaluation platforms, and support from Kozio is available immediately for custom designs using any of these processors. 'Our customers are able to accelerate their system development time by using Kozio's software and we are delighted to provide evaluation versions as part of our evaluation kits ,' notes Charlie Ashton, director of software at AMCC.

'Kozio software saves us, and our customers, time and effort.' 'Working with AMCC has proven truly valuable for both parties, as we provide support for evaluation platforms, and deliver proven validation software for the earliest adopters of this latest line of PowerPC technology,' stated Joseph Skazinski, president of Kozio.

'This year we are shipping on ten PowerPC processor reference platforms and support a dozen more for easy evaluation of our software.' Kozio's turnkey validation package is pre-installed on the Katmai, Sequoia, Rainier and Taishan evaluation platforms.

This evaluation version of kDiagnostics allows product developers to explore various benefits of Kozio's software, including proven test suites for IC components, buses and peripherals.

Kozio's automated validation software includes proven test suites for the 440EPx, 440GX, 440SPe, and 440GRx cores, expansion buses, memories and all peripherals, with full access to all special-purpose PowerPC registers.

Kozio's standard package includes test suites for DDR SDRAM, Flash, EEPROM and DMA, with full programming capabilities during testing and production serialization.

Kozio's software also includes full testing of UART, Ethernet (10/100), Gigabit Ethernet, PCI, PCI-X, PCI Express and connected devices, 12C and connected devices, USB 1.1 and 2.0 ports, temperature sensors, GPIO and connected devices, the Xilinx ACE compact flash controller, as well as other IC devices.

Validation suites for all four boards are provided for evaluation, and complete validation packages can be prepared for custom designs based on any of these four processors in just two weeks, arriving before the first custom boards return from assembly.

In addition, Kozio can provide fully automated test suites for manufacturing or production test and power-on-self-test, delivering the same test functions used for board bring-up.

This continues the expansion of Kozio's long-running partnership with AMCC.

This release of kDiagnostics validation software not only supports the newest processors in the AMCC Power PC family, but also includes updates to the automated USB packages, Chelsio TOE and LSI Logic SAS devices.

'AMCC has done a remarkable job of expanding their processor evaluation platforms and entire ecosystem,' notes Skazinski.

Oscilloscope-based DDR2 compliance test

2006-12-22T01:57:00.000-08:00

Agilent Technologies has introduced what it believes to be the industry's first oscilloscope-based DDR2 compliance test application.

Agilent Technologies has introduced what it believes to be the industry's first oscilloscope-based DDR2 compliance test application, ideal for engineers working in the computer, data storage, electronic data processing and consumer electronics industries. The Agilent N5413A DDR2 test application, which runs on Infiniium 54850 and 80000 Series oscilloscopes, provides DDR2 electrical compliance measurements based on the Joint Electronic Device Engineering Council (JEDEC) JESD79-2C DDR2 SDRAM Specifications and INTEL DDR2 667/800 JEDEC Specification Addendum Rev.1.1. The N5413A also features Advanced Debug mode, which provides crucial measurements such as eye-diagrams, mask tests, ringing measurements and other tests not covered in the JEDEC specifications that help engineers discover the root causes of problems in their designs.

DDR2 memory technology is an evolutionary upgrade to its predecessor, DDR.

DDR2 devices will feature higher bandwidths and smaller chip footprints and will consume less power and generate less heat.

'Adoption of DDR2 among system OEMs and system integrators is increasing, and we expect interest to continue accelerating into 2007,' said Jay Alexander, vice president and general manager of Agilent's design validation Division.

'We are pleased to be able to offer engineers the tools they need now for testing, debugging and characterizing DDR2 designs quickly and easily'.

With the N5413A DDR2 compliance test application, engineers can use an ordinary oscilloscope to perform automated testing and margin analysis.

The application automatically configures the oscilloscope for each test and provides informative reports.

It includes margin analysis that indicates how closely the device passes or fails each test.

When engineers conduct DDR2 tests, they may encounter difficulties connecting to the target device, configuring the oscilloscope, performing the tests and analysing the measured results.

The DDR2 compliance test application guides users through these steps and does most of this work for the user.

If a designer discovers a problem, the Advanced Debug feature in the test application and debug tools in the oscilloscope are available to aid in root-cause analysis.

The Advanced Debug functionality includes a unique technique that separates read/write burst signals on the same bus, which gives engineers a powerful tool for debugging their designs.

With the increasing data rate and decreasing window validity time of DDR2 memory systems, signal integrity performance of the measurement tools becomes critical to achieving accurate and repeatable measurements.

The advantages of Agilent's Infiniium 80000 Series award-winning oscilloscopes and InfiniiMax probing include the industry's lowest noise floor, lowest jitter measurement floor, lowest trigger jitter and flattest frequency response.

Superior signal integrity in measurement tools maximises DDR2 design margins.

The JEDEC Solid State Technology Association is the semiconductor engineering standardisation body of the Electronic Industries Alliance (EIA), a trade association that represents all areas of the electronic industry.

Current Agilent N5413A DDR2 clock characterisation application owners can upgrade to the new DDR2 compliance test application at no cost.

Bench power supply reflects use of lower voltages

2006-12-22T01:56:00.000-08:00

TTi (Thurlby Thandar Instruments) has replaced its best-selling EL302T triple-output laboratory power supply with a new model that incorporates a fully variable third output.

TTi (Thurlby Thandar Instruments) has replaced its best-selling EL302T triple-output laboratory power supply with a new model that incorporates a fully variable third output. The new EL302Tv is a linear regulated power supply with dual outputs of 0 to 30V at 0 to 2A. The third output is now continuously variable between 1.5 V and 5.0V at currents of up to 2A, replacing the fixed 3.3V/5V at 1A auxiliary output of its predecessor.

A 'push to measure' button allows the right-hand displays to show the settings for the auxiliary output, enabling the voltage to be set accurately without the need for an external meter.

The model change reflects the increasing use of low-voltage circuitry in most areas of electronics and the move away from standard operating voltages.

The price of the EL302Tv remains at USD305 (plus VAT), unchanged from that of the model it replaces.

Upgraded laboratory power supply costs no more

2006-12-21T01:55:00.000-08:00

TTi has replaced its best-selling EL302T triple-output laboratory power supply with a new model that incorporates a fully variable third output.

TTi (Thurlby Thandar Instruments) has replaced its best-selling EL302T triple-output laboratory power supply with a new model that incorporates a fully variable third output. The new EL302Tv is a linear regulated power supply with dual outputs of 0 to 30V at 0 to 2A. The third output is now continuously variable between 1.5 and 5.0V at currents of up to 2A, replacing the fixed 3.3/5V at 1A auxiliary output of its predecessor.

A 'push to measure' button allows the right-hand displays to show the settings for the auxiliary output, enabling the voltage to be set accurately without the need for an external meter.

The model change reflects the increasing use of low-voltage circuitry in most areas of electronics and the move away from standard operating voltages.

The price of the EL302Tv remains at GBP 305 (plus VAT), unchanged from that of the model it replaces.

Support for live receiver and transmitter testing

2006-12-21T01:54:00.000-08:00

Aeroflex has announced that it has added the ability to undertake live receiver testing and transmitter testing including HSDPA on its highly successful 6413A UMTS basestation test system.

Aeroflex has announced that it has added the ability to undertake live receiver testing and transmitter testing including HSDPA on its highly successful 6413A UMTS basestation test system. The capability is ideal for the ongoing maintenance of UMTS basestations to ensure they perform to specification as it enables testing to be undertaken without any disruption to live traffic caused by taking the basestation out of service. The performance of the basestation receiver is extremely important as it essentially defines quality of service in a cell.

With the low operating power of mobile terminals, the performance of the receiver has to be exceptionally good at all times.

A poorly performing basestation receiver will result in an increasing number of calls being dropped due to lower sensitivity and signal quality.

Phones will be required to transmit at higher power impacting battery life and potentially causing signal interference.

It will also make it difficult for revenue generating higher data rate services to be used.

A poorly performing base station will also significantly impact network planning as the number of calls a cell can handle will be restricted.

Conversely, a 1dB improvement in basestation receiver sensitivity, for example, can mean that 11% fewer basestations are required in network (source: WCDMA for UMTS by Harri Holma and Antti Toskala (Wiley 2004)).

The Aeroflex 6413A UMTS basestation test system is designed specifically for the installation and commissioning, maintenance, fault-finding, performance verification and optimisation of radio basestations.

A single-box portable solution, it is able to take complete control of the basestation via the Iub interface and perform all of the critical transmitter, receiver and functional tests without external control equipment or the need for detailed knowledge of the basestation's operation and control.

The addition of a live receiver and transmitter testing capability to the Aeroflex 6413A UMTS basestation test system compliments its existing Iub controlled test mode which facilitates the implementation of repeatable test scenarios in controlled environment based on the methods defined in the ETSI standard 3GPP TS25.141.

The Aeroflex 6413A's user interface is intuitive to use.

Based around an embedded PC and using touch-screen controls, all functions can be operated from the front panel.

Measurement results can be viewed while tests are running or stored for later analysis.

Tests can be run manually or automatically using pre-programmed test sequences.

'The addition of live receiver and transmitter testing to the Aeroflex 6413A will considerably improve its appeal to network operators,' said Ross Broadhurst, Product Marketing Manager at Aeroflex Test Solutions.

Stencil kits designed for BGA reworking

2006-12-20T02:06:00.000-08:00

Accurate, disposable stencils introduce probably the easiest, most reliable method for stencil printing solder paste on individual ball grid array component sites for rework.
Intertronics are pleased to introduce probably the easiest, most reliable method for stencil printing solder paste on individual Ball Grid Array (BGA) component sites for rework - accurate, disposable Flextac stencils in a complete BGA Stencil Rework Kit. Flextac stencils have an adhesive side that attaches temporarily to the PCB, preventing misalignment and solder paste smearing. Because Flextac stencils are inexpensive and disposable, they help users keep lead-bearing and lead-free soldering materials separate, preventing cross-contamination, which can happen when in-facility processing, or reworking older assemblies using tin/lead solders and newer boards that are lead-free, to help RoHS compliance.
Flextac stencils themselves are also RoHS compliant.
Flextac stencils are part of a complete CircuitMedic BGA stencil kit that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
Flexible Flextac solder paste stencils are laser cut for correct aperture size.
They are cut from high quality, anti-static polymer film with a residue-free adhesive backing.
Because they are self-sticking, no tape or fixturing is needed.
The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied.
This makes them easy to use, while leaving no residue on the board surface.
If the Flextac stencil is not correctly positioned, it can simply be repositioned.
The side tabs also serve as solder dams preventing solder paste overspill.
Since the residue-free adhesive seals around each BGA pad, one may make as many passes with the squeege as needed to ensure proper aperture filling.
The Flextac stencil is then peeled off, leaving a perfect deposit of solder on each pad.
Although Flextac stencils are disposable, they can be used several times.
The tools and materials in CircuitMedic kits have been used for decades by the most demanding commercial, medical and military electronics manufacturers.
They have been specifically designed to meet the requirements outlined in repair and rework guidelines published by the IPC.
The kits include in-depth instructions that follow recommended electronics industry methods.

Quality OK for production assembly equipment

2006-12-20T02:05:00.000-08:00

OK International, manufacturer of production assembly equipment, has announced that it has successfully achieved ISO 9001:2000 accredited status following a period of employee training and increased customer focus. The recognition is specific to the company's Head Quarters in Garden Grove, California and is applicable to all products that are managed and assembled from design through to delivery to the customer. The process of accreditation took nine months to complete from inception to completion.
All employees took part in ISO awareness training and the company implemented internal auditor training as well as creating procedures and other documentation necessary to fulfil its business process structure and more importantly its management commitment and involvement.
Paul Weaver, VP of European Sales for OK International, summed up what this accreditation means for the company: 'Achieving this accreditation sends a clear message to all of our customers that we continue to take our commitment to them extremely seriously.
Not only in the quality of our products but in the quality of our service to our customers on an ongoing basis.
Therefore, it is essential to continue to improve the quality of our systems/business processes'.
This recognition provides evidence to the market, both existing and future, that the company's quality management system has met or exceeds the provisions and requirements established for compliance.
Weaver continued: 'ISO 9001:2000 is all about showing the outside world that you have quality systems that are future proof and able to manage the business effectively.
The real bonus for me is the shift of focus; in the past the main focus of complying with ISO standards was all about internal systems, this latest revision has a much more outward focus concentrating on our customers.
This is an important milestone for OK International and I am looking forward to working with all of our customers ensuring that our solutions and services continue to give them both a technological and competitive advantage in the market'.

Selective soldering introduced to SMT on PCBs

2006-12-19T02:05:00.001-08:00

Selective soldering system provides an effective entry point for soldering through-hole and odd form components into surface-mount and mixed technology printed circuit boards.
The recently introduced Rhythm selective soldering system from Tyco Electronics provides electronics manufacturers with an effective entry point for soldering through-hole and odd form components into surface-mount and mixed technology printed circuit boards. The system presents solder from the underside of the printed circuit board without any special tooling or accessories. In spite of a low starting cost, Rhythm selective soldering systems boast many features commonly found only in higher cost systems.
Processing capabilities such as a small keep-away is made possible by a tilting axis.
Additionally, the machine offers an optional nozzle configuration for processing PWBs over a four-inch flat wave solder nozzle.
The Rhythm selective soldering machine conforms to SMEMA in-line manufacturing standards and is well suited for applications where the printed circuit board is manufactured in small or large lot quantities with high product mix.
For applications with higher thermal demands, the Rhythm selective soldering machine can be equipped with an optional infrared preheater.
The flexible features of the Rhythm selective soldering machine help ease soldering for most any component, regardless of its orientation or obstructions in the soldering area.
Performance and value combine to make the Rhythm viable for many soldering applications.
Tyco Electronics offers the Rhythm selective soldering system as part of its exclusive sales agreement with RPS.
In addition to sales, Tyco Electronics offers worldwide service and onsite-support for the Rhythm selective soldering system.

RoHS compliant surface mount headers introduced

2006-12-19T02:04:00.001-08:00

RoHS compliant surface mount headers offer a surface mount connector product with 0.100in centerlines that can withstand up to 280 deg C soldering temperatures.
RoHS compliant surface mount headers introduced RoHS compliant surface mount headers offer a surface mount connector product with 0.100in centerlines that can withstand up to 280 deg C soldering temperatures. Tyco Electronics Corporation has introduced a new line of RoHS compliant surface mount headers. The new MTA-100 surface mount headers offer designers a surface mount connector product with 0.100-inch centerlines that can withstand up to 280 deg C soldering temperatures.
Additionally, MTA-100 surface mount headers are conveniently packaged in tape and reel (225 per reel) further enhancing the product's processing.
MTA-100 surface mount headers are suitable for power connections on a wide range of industrial and commercial electronics including: garage door controls, HVAC controls, household appliances and power supplies.
The new headers are designed to mate with Tyco Electronics' MTA-100 insulation displacement connectors and CST-100 II crimp, snap connectors.
Available in two through eighteen contact positions, MTA-100 surface mount headers are rated for 250V AC and 5A.
Contact finishes include: tin, 15 microin gold, and 30 microin gold.
The housing is UL 94-V0 high temperature black nylon.
Additionally, housings have back wall polarization housings and offer friction locking.

RGB LED ringlight has ultra bright illumination

2006-12-18T02:03:00.000-08:00

The high intensity RGB LED ringlight capable of single red illumination 592 nm, a single green illumination of 520 to 535 nm and a blue illumination of 464 to 475 nm is available from Klughammer.
The high intensity RGB LED ringlight capable of single red illumination 592 nm, a single green illumination of 520 to 535 nm and a blue illumination of 464 to 475 nm as well as a separate UV ringlight is available from Klughammer Germany. It provides intense, shadow-free and homogeneous illumination. The coloured LEDs may be switched on and off independently.
The system enables singular intensity control of all three wavelengths plus you can merge all three wavelengths together to get mixed variations to perform and excite biological and material science specimens in fluorescence, probably the only system of its kind for those specialist requirements.

Electronics and lighting components detailed

2006-12-18T02:02:00.000-08:00

A 140 page catalogue details a comprehensive range of DIN rail mounting enclosures, interconnection, batteries, LEDs, miniature switches, interface modules and control products.
Camden Electronics has published a new catalogue for 2007 detailing the company's wide range of components for electronics, telecommunications, lighting and security applications. The 140 page catalogue includes detailed data on Camden's comprehensive range of products encompassing din rail mounting enclosures, PCB terminal blocks, interconnection, fuses and fuseholders, batteries, LEDs, miniature switches, relay bases, interface modules, IC and PLCC sockets and control products. Products appearing in the catalogue for the first time include a new size 12 version of the patented CNMB series DIN rail mounting enclosures, high current versions of the CNMB series capable of handling up to 57A, new and improved 36-way PCB terminal blocks, rising clamp terminal blocks offering improved strength and the latest CFTBN fused terminal block with spare fuse option.
* About Camden Electronics - Camden Electronics, based at St.
Albans, Hertfordshire, UK, is a leading manufacturer and supplier of PCB terminal blocks, fuses and fuseholders, sealed lead acid batteries, LEDs, miniature switches, interface modules, enclosures, IC and PLCC sockets and relay bases for the electronics, telecommunications, lighting, and electrical industries.
The company has BS EN ISO 9001:2000 accreditation and exports a significant proportion of its production to Europe and the Far East.

Analytical electronic and chemical solution

2006-12-17T03:36:00.001-08:00

3M has announced the launch of 3M Analytical Services, which forms part of the company's portfolio of service capabilities in electronic and chemical solutions.

3M has announced the launch of 3M Analytical Services, which forms part of the company's portfolio of service capabilities in electronic and chemical solutions. Providing access to the company's extensive RandD resources for the first time, the services are available to companies - not just existing 3M customers - particularly in the areas of health and safety, design, assembly and manufacture. The services can be used to identify problems with a product or process; ensure that legislation or certification requirements are being met; or to analyse and improve existing product materials.

The new services eliminate the need for the customer to have any kind of scientific knowledge or understanding of the complexity of analytical testing.

An easy-to-use tool that 3M application engineers can run through with a customer asks a series of questions that lead towards a practical test or series of tests that could help solve customers' problems.

Mark Nursall, technical specialist, 3M UK explains, 'A company may come to us and ask for help in, for example, identifying the source of a particular odour, or ask us to find out why a product is not performing as expected, or indeed to benchmark two products.

We just need customers to tell us what their problem is - we do not expect them to have the technical knowledge necessary to specify what tests they want us to carry out - they can leave that to us.

This means our services are accessible to a far wider audience.' Based at the company's laboratories in Bracknell, UK, 3M Analytical Services consists of a team of experienced chemists and other experts, backed up by a range of highly sophisticated analytical devices, equipment and systems, representing a substantial investment by 3M in the UK.

Equipment includes an extractive FT-IR for real-time analysis of gases, an X-ray photoelectron spectrometer for surface analysis, and a canister-based system for analysing air samples and odours.

3M is one of only a very small number of UKAS* approved laboratories that are accredited to test and evaluate whole air samples for air quality for health and safety purposes.

3M Analytical Services draw on the extensive analytical resources that 3M has developed over the years in the UK.

The services now form part of the growing range of 3M products in the electronics and chemicals market.

Automated systems for micro assembly

2006-12-17T03:36:00.000-08:00

Contax, the production automation system specialist is exhibiting on stand B603 at MDT/Medtec at the NEC.
Contax, the production automation system specialist is exhibiting on stand B603 at MDT/Medtec at the NEC on 14-15 February 2007. At the Show, Contax will be demonstrating its collaborations with leading medical equipment suppliers and profiling a series of automation solutions. These will include automated systems for micro assembly, dispensing, conveyoring, curing and packaging.

Contax works with a series of world-class suppliers to offer its customers the best available solutions.

At MDT/Medtech, Contax will be specifically highlighting the following: Ismeca Exhibiting on the adjacent stand to Contax, number C601, Ismeca offers bespoke automatic assembly systems.

Part of the Komax Group, Ismeca's modular systems cover a wide variety of processes and specific medical device assembly applications including specialty and safety syringes, inhalers, valves and regulators and test and diagnostic kits.

Optel Vision Optel provides solutions for packaging line security inspection.

These include a bar code verification system; packaging integrity tool; and inspection systems specifically for barcodes, blister packs and packaging labels.

mta Automation mta offers a wide range of solutions for micro-dispensing, micro-soldering and assembly.

Its medical dispensing applictions rely on combining adapted micro-dispensers and automated robots.

For example, its recently launched Dual Dispensing Valve is ideally suited to applications that require two materials to be mixed accurately with high repeatability.

This could be used for epoxy resin based adhesives, where both the resin and hardening agent need to be blended efficiently.

By combining technologies from different sources, Contax can develop a complete solution.

Guidant Corporation, a world leader in the design and development of cardiovascular medical devices partnered with Contax to automate key steps in the manufacture of pulse generator products.* The equipment used in the automation solution included an RC500 robot from mta with advanced volumetric dispensing capability.

Contax also specified a Shuttleworth transport and indexing system.

The selection of a curing tunnel was also crucial as it had to provide both temperature and humidity control.

Caltherm was selected as the manufacuturer of choice, partly due to their proven track record, but also their willingness to adapt their design to meet Guidant's specific needs.

The Guidant process engineer commented, 'We obviously had a very detailed understanding of the process required, but Contax brought the wide ranging knowledge of the automation systems available.

They were able to take our requirements and then mix and match equipment - customising kit where necessary - to ensure that it met our demanding criteria'.

Continued Mike Rapson, Managing Director at Contax, 'By combining an in-depth understanding of the medical device arena, with expert technical knowledge and world leading systems, we are able to offer companies like Guidant the best possible solution'

Manufacturing test and power on self test

2006-12-16T03:35:00.001-08:00

Kozio has announced that an evaluation version of its kDiagnostics software is now shipping as part of Applied Micro Circuit's new Saguaro evaluation kit for the nP3705 packet processor.

Kozio, the leading provider of automated validation software ideally suited for board-bring up, manufacturing test and power on self test, today announced that an evaluation version of its kDiagnostics software is now shipping as part of Applied Micro Circuit Corporation's (AMCC's) new Saguaro evaluation kit for the nP3705 packet processor. Access to Kozio's full-featured evaluation software, as well as support from the company, is available immediately for custom designs using the PowerPC 440EP processor. This continues Kozio's long-running partnership with AMCC, as well as the company's FullCircuit evaluation program, which provides an evaluation version of kDiagnostics with a variety of third-party processor evaluation platforms.

Users have access to a full-featured evaluation version of the software, enabling them to test out the entire board in minutes and explore all the features of the technology.

'If you can get proven, pre-verified third-party diagnostics at a fraction of the cost of writing them yourself, it's hard to justify spending the engineering time developing custom code,' notes Al Arendt director of sales at Kozio.

'Our customers are enjoying increased success because their development engineers are spending more time developing products with higher performance, improved reliability and a wider range of features than their competitors.

Kozio is helping them deliver better products - on time.' Kozio's turnkey validation package is pre-installed on the Saguaro evaluation platforms, allowing potential customers to explore various benefits of kDiagnostics, including proven test suites for 440EP core and expansion bus, memories and all peripherals, with full access to all special-purpose Power PC registers.

Kozio's standard package includes test suites for DDR, SDRAM, EEPROM and DMA, with full programming capabilities during testing of UART, Ethernet (10/100), Gigabit Ethernet, PCI and connected devices, 12C and connected devices, USB port, and temperature sensor.

Kozio's support, including a full validation suite for board bring-up, is available immediately for any custom board using the 440EP processor.

Validation suites are provided for evaluation purposes, and a complete validation package can be prepared for custom 440EP boards in two weeks - even before the first custom board arrives from assembly.

In addition, Kozio can provide a fully automated test suite for manufacturing or production test and power-on-self-test, delivering the same test functions used for board bring-up.

Reflow soldering system saves operating costs

2006-12-16T03:34:00.000-08:00

Reflow soldering system handles traditional high volume reflow for both leaded and lead free alloys, and offers exceptional efficiencies in operating costs.

Production automation system specialist, Contax, has announced the availability of Speedline's Electrovert OmniFlex 7 reflow soldering system in the UK, Ireland and Benelux. This advanced new system handles traditional high volume reflow for both leaded and lead free alloys, and offers exceptional efficiencies in operating costs. By utilising sophisticated new heating and cooling transfer technologies and energy efficient designs, the OmniFlex 7 uses up to 50% less power, and up to 30-35% less nitrogen than comparable platforms.

Furthermore, maintenance intervals are reduced, so resulting in a much lower cost of ownership.

Specific features include the ability to offer the higher peak temperature requirements and smaller process windows required for lead-free soldering.

The OmniFlex 7 features a temperature process capability to 350 deg C, high-efficiency heat transfer and exceptional zone-to-zone seperation, so enabling easy lead-free processing.

Further design enhancements include standard closed-loop blower control and an advanced chamber design for more balanced airflow with minimal turbulence.

This improves heat transfer and substantially reduces power and nitrogen consumption.

Another significant feature is the VariCool cooling technology.

The nitrogen cooling module consists of vertical cooling chambers that offer independent, closed-loop variable blower control for precise control of cooling profiles and assembly exit temperatures.

Finally, a proprietary self-cleaning Flux Extraction System (FES) continuously filters, traps and collects flux volatile particles throughout the pre-heat, soak and reflow zones.

These particles are collected in containment jars that can be quickly and easily removed.

This self-cleaning process significantly reduces the need for maintenance, so increasing system uptime.

'Speedline's new OmniFlex 7 offers a completely advanced, flexible design,' said Mike Rapson, managing director at Contax.

'It is fully lead-free compatible and offers all the features that our customers need - low energy and nitrogen consumption and a self-cleaning FES facility.

This results in a very cost and energy efficient system that offers an excellent return on investment,' he said.

* About Contax - Contax is one of the UK and Ireland's most comprehensive suppliers of automation equipment.

Products range from PCB assembly, automatic optical and X-ray inspection, reflow solder, screen printing, precision liquid dispensing, cable preparation, robotic soldering and robotic assembly as well as cleaning systems.

Connector enables quick wire-to-board assembly

2006-12-15T03:34:00.000-08:00

A low-profile, small PCB footprint, connector from allows users to easily connect individual wires to a single row of contacts using IDC technology.

Connector enables quick wire-to-board assembly A low-profile, small PCB footprint, connector from allows users to easily connect individual wires to a single row of contacts using IDC technology. The new 9175 connector from passives and connectors specialist AVX's Elco Europe Division allows users to easily connect individual wires to a single row of contacts using IDC technology. Currently available as two-and three-way IDC connectors, the part is both low-profile (3.45mm) with a small PCB footprint (two-way: 5.0x2.5mm, three-way: 7.5x2.5mm) and allows for quick, easy assembly thanks to a dedicated single-wire insertion hand tool.

Before assembly, the part is surface mounted to the PCB.

Using the hand tool, 26 or 28 AWG solid/ stranded wires are inserted into the contact slot.

This process cuts the insulation and enables the individual conductors of the wire to form a homogeneous joint.

The shape of the moulding forms a restraint to the wire when fully inserted in the contact.

Contact material is phosphor bronze, with five re-terminations achievable for each individual contact.

Parts offer a current rating of 1A continuous through all contacts at 25 deg C (ambient), with a voltage rating of 125V, delivering a minimum insulation resistance of 100Mand#8486;, and a maximum termination resistance of 20mohms.

Devices operate between -40 and +80 deg C.

Due to ease and speed of assembly to the small volume intricate/flexible connections of high value devices, 9175 connectors can be used for connecting two or three wires between PCBs, in high volume consumer market applications, for example speakers, buzzers, microphones, vibration mechanisms.

Nine orders for EFD Family of CFD Software

2006-12-15T03:33:00.000-08:00

Flomerics has announced that it has received significant sales orders for its EFD family of computational fluid dynamics (CFD) software over the past quarter.

Flomerics has announced that it has received significant sales orders for its EFD family of computational fluid dynamics (CFD) software over the past quarter from Honda, WATTS Industries, Thales MESL, Boeing Shared Services Group, Meteor Gummiwerke, Philips Medical System DMC , Robert Bosch , ZF Getriebe and Eaton Electric. The EFD family of CFD software from Flomerics includes EFD.Pro - a fully embedded CFD solution within the Pro/ENGINEER environment; EFD.V5, - a fully embedded CFD solution within the CATIA environment, and EFD.Lab - a general-purpose fluid analysis tool that includes a built-in solid modeler. All the software products in the EFD family work directly with the native CAD geometry and require no translation of data, so the solid model maintains intelligence such as assembly hierarchy, constraints, and features.

Users can take advantage of the existing data to conduct 'what if?' analyses directly from within their chosen design platform.

EFD makes it easy to perform flow simulation because it analyses the geometry and generates the computational grid in the background while the user only needs to interact with the familiar MCAD interface.

The analysis engine at the heart of the EFD product suite is the same analysis engine used by SolidWorks in their tightly-integrated CFD software - CosmosFloWorks.

Design, partitioning, test for system-in-package

2006-12-14T03:32:00.000-08:00

The new System-in-Package (SiP) paradigm in electronics product implementation allows the mixing of optimum active and passive device technologies in bare die format within a single package outline.

The new System-in-Package (SiP) paradigm in electronics product implementation allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, short time-to-market functionality well matched to a wide range of low, medium and high volume electronics product applications. The novel addition of embedded passive component technology within such SiP modules also promises further performance, size, weight and cost benefits. The SiP approach allows board level functionality to be realised at the package level for smaller, lighter and higher functionality products.

However a major obstacle to the successful introduction of this new technology is the lack of a robust design methodology supported by rigorous simulation tools, accurate component and technology models.

The ADEPT-SiP project, that is funded through the DTI Technology Programme under the Design, Simulation and Modelling Technology priority area, is directed at eliminating this obstacle.

The 30-month ADEPT-SiP project started in May 2006 and will develop and demonstrate a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions.

It will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets.

Other key design stages will include thermal and EMC design, and design-for-manufacture, for test, reliability and for environmental impact.

Novel, high density embedded passive substrate technologies will be designed and simulated, process characterisation undertaken and component models developed for the full range of passive components and interconnection and assembly structures.

The core design, simulation and modelling activities will then be proven in SiP technology demonstrators.

The ADEPT-SiP project partners include Filtronic Broadband and Zarlink Semiconductors' Advanced Packaging Division based in Caldicot as SiP product end-users, Leeds University as modelling provider, Zuken, QuantumCAD and Flomerics as design providers, and Wurth Elektronik and TWI as technology providers.

Professional circuit board repair kit

2006-12-14T03:31:00.000-08:00

The new CircuitMedic CRC 201-2102 professional circuit board repair kit from Intertronics is a comprehensive package of equipment and information.

The new CircuitMedic CRC 201-2102 professional circuit board repair kit from Intertronics is a comprehensive package of equipment and information - it is probably the most complete and versatile circuit board repair kit to be found anywhere. Applications cover removal and replacement of coatings and components, repair of conductors and edge contacts, as well as plated holes, jumper wires, legend masking, key and slot, lifted lands. Naturally the kit includes lead free repair frames.

When you consider all the bad things that can happen to circuit boards to cause a reject, it's a wonder how some of them survive at all! They get nicked, cracked, broken, scratched, burned, conductors get ripped up, plated holes get torn out.

Some don't pass the final inspection.

Others become the victim of changed specifications or just may not look right.

That's where the CRC Professional Repair Kit comes in.

It's the total package.

The kit includes dry film, epoxy-backed circuit frames, and unique replacement circuits that do not use messy liquid epoxy.

It includes eyelets and setting tools for plated through hole repair, Circuit Tracks to repair damaged circuits, epoxy and colour agents for solder mask or base board repairs, and a comprehensive manual - all packaged in a convenient carrying case.

In addition Intertronics supply a PDF download - Repair Guide - this 186 page document gives a step-by-step walk through of all the likely repair processes - how to do it, tools needed, procedures, inspection etc, aimed to make one-off repairs easy or regular repair processes more successful.

Mini OTDR sets new performance standards

2006-12-13T00:54:00.001-08:00

The new Yokogawa AQ7270 fibreXplorer is a mini OTDR which sets new standards in terms of performance, speed of operation, and ease of use.

Mini OTDR sets new performance standards The new Yokogawa AQ7270 fibreXplorer is a mini OTDR (optical time-domain reflectometer) which sets new standards in terms of performance, speed of operation, and ease of use to aid the installation and maintenance of core, metro and access networks including FTTH (fibre to the home) and PON (passive optical networks). The AQ7270 offers the industry's best performance in terms of event separation capability and the shortest dead zone - less than 80 cm - to enable multiple-event detection even when events are close to one another. Its high-speed operation optimises work efficiency, while automatic test functions enable installation operatives to execute tests easily and reliably.

'The worldwide spread of broadband services has stimulated the installation of optical fibre in metro and access networks, which in turn has increased the demand for portable and reliable test equipment to aid the installation and maintenance of these networks', comments Terry Marrinan, Sales and Marketing Director, Europe and Africa, of Yokogawa Europe's Test and Measurement Group: 'Our new mini OTDR has been developed to address these challenges with the particular aims of improving operability to boost work efficiency and cost-effectiveness.' The AQ7270 is a compact, lightweight instrument measuring only 287 x 182 x 75mm and weighing 2.9kg.

It features a large (8.4in) high-luminance LCD display with a dark background which makes it easy to read the screen and manipulate markers, even in bright sunlight.

The AQ7270 Series includes eleven models, each of which will test up to four wavelengths covering the requirements of core, metro and access networks.

Seven wavelengths: 850, 1300, 1310, 1490, 1550, 1625 and 1650 nm - are currently available in the product line-up.

Key features which improve operational efficiency are the instrument's speed of operation and its powerful integrated test functions.

Fast power-up enables users to start testing within 10 seconds on turning the OTDR on, while one-button testing is used to execute preset test routines for dramatically improving the productivity of operatives without specialist technical skills.

The AQ7270 is equipped with a number of functions to help users to execute a reliable measurement easily, including a fully automatic mode which sets appropriate test conditions according to the fibre under test, carries out the measurement, and saves the data to a file.

In addition, a 'fibre in use' indicator and alarm prevents on-channel measurements being made on fibres with in-service wavelengths.

Other features include multiple languages for menus, internal data storage of up to 1000 traces) and external USB storage.

A number of options are available to expand the instrument's test capability and work efficiency, including an optical power monitor, light source, built-in printer and built-in dummy fibre to aid near-end evaluation.

Oscilloscopes for the German Federal Armed Forces

2006-12-13T00:53:00.000-08:00

Agilent Technologies has won a European-wide bid to supply the German Federal Armed Forces with more than 1500 digital storage oscilloscopes (DSOs).

Agilent Technologies has won a European-wide bid to supply the German Federal Armed Forces with more than 1500 digital storage oscilloscopes (DSOs). The Agilent 6000 Series oscilloscopes will be used by engineers and technicians to test electrical equipment at the maintenance and repair facilities of the German air force, navy and army. Agilent will begin delivering the oscilloscopes before the end of the year.

Agilent created the 6000 Series oscilloscopes to meet the challenges that engineers and technicians face with testing sophisticated electronic designs.

Today's designs are no longer based only on analog technology, but increasingly contain digital signals and serial communication buses, creating an environment of mixed fast and slow signals.

This mixed-signal environment means engineers need to measure composite signal conditions and view time-correlated analog and digital signals.

Agilent's 6000 Series oscilloscopes give engineers these capabilities.

'Our new 6000 Series has made its mark on the oscilloscope market,' said Hans-Janduuml;rgen Bochtler, sales manager for Agilent's Electronic Measurement Group in Germany, Austria and Switzerland.

'Since introducing the new oscilloscope family last year, we have recorded significant growth and won market share in this highly competitive arena'.

The 6000 Series includes 19 different oscilloscope models with frequency ranges from 100 MHz to 1 GHz with two or four analog channels.

The series also includes mixed signal oscilloscopes (MSOs) that offer 16 digital channels integrated with the analog channels.

The 6000 Series oscilloscopes offer many technological innovations, such as a high-resolution display and fast signal processing speed, which simplify the task and shorten the time it takes to identify intermittent interference signals.

They also offer deep digital memory, multiple standard I/O interfaces (LAN/USB/GPIB), and progressive serial trigger possibilities for I2C/SPI/CAN/LIN buses.

With optional application packages, the oscilloscopes can decode the signals from these specialised buses and quickly make internal FPGA measurements.

In November 2006, Agilent added three models to the 6000 Series that are optimised for use in test systems.

Because of their LXI (LAN eXtensions for Instrumentation) interfaces and compact form-factor (only 44 mm high), these models are especially suitable for installing in test racks.

Reliability test alliance

2006-12-12T00:53:00.000-08:00

Agilent Technologies has announced a formal agreement with Core Wafer Systems (CWS) for the semiconductor test market space.

Agilent Technologies has announced a formal agreement with Core Wafer Systems (CWS), a leading provider of accelerated and long-term reliability test solutions and analysis tools for the semiconductor test market space. The Advanced Scaleable Unified Reliability (ASUR) suite of solutions from CWS exclusively uses Agilent's system tester and instruments for the Single Device Reliability (SDR) and multi-site Parallel Device Reliability (PDR) test products. ASUR includes fifth-generation PDQ-WLR, the accelerated reliability standard in the test industry offered by Agilent since 1994.

Complementing the testing methodology is the Reliability Data Analyser (RDA) software from CWS for real-time, post-test analysis and lifetime prediction for devices, metallisation and dielectrics.

As part of the agreement, Agilent offers CWS software reliability solutions, services and test structure libraries, which are uniquely compatible with Agilent hardware.

Agilent will sell a turnkey solution and support the integrated software and hardware as a single source vendor for reliability customers.

'CWS' software reliability test solutions are a natural extension to the reliability solutions already supported by the Agilent B1500A semiconductor device analyser and the Agilent 4070 series of parametric testers,' said Minoru Ebihara, vice president and general manager of Agilent Hachioji Semiconductor Test Division.

'Now we can offer a complete range of semiconductor reliability test solutions, from instruments to systems, and the modular nature of our approach makes it easy and cost-effective for our customers to start small and add later to their reliability test capabilities as their needs change'.

'We are pleased to continue and expand our partnership with such an established and well-respected leader in the industry,' said Roger Goetz, CEO, Core Wafer Systems.

'This alliance with Agilent will allow us to further expand our reach to the worldwide customer base'.

'Now all customers will have convenient access to these advanced tools, which will help them increase efficiency and lower their overall cost-of-test at the deep nanometer scale'.

Core Wafer Systems (CWS) specialises in single-site and multi-site (parallel) accelerated and long-term reliability testing and analysis, and provides modular wafer-level and package-level solutions for current and emerging technologies.

Analyser optimised for serial-data-based designs

2006-12-12T00:52:00.000-08:00

Agilent Technologies announces an oscilloscope measurement system with specialised tools for designing, debugging and validating designs that include high-data-rate serial buses.

Agilent Technologies announces an oscilloscope measurement system with specialised tools for designing, debugging and validating designs that include high-data-rate serial buses. The new Agilent DSA80000B digital signal analyser (DSA) system offers the industry's lowest noise floor, jitter-measurement floor and trigger jitter, and the flattest frequency response, making it possible for engineers to gather more accurate data about the low-voltage differential signals in their designs. The DSA80000B DSA is ideal for engineers working in the communications, data storage, computer, aerospace/defence and consumer electronics industries.

Agilent's DSA80000B DSA is built around an Infiniium DSO80000B Series oscilloscope and the InfiniiMax probing system, which provide critical capabilities for achieving accurate and repeatable measurements.

The oscilloscope and probe capabilities are augmented with high-speed serial data analysis and EZJIT Plus jitter-analysis software to give designers additional capabilities for designing, debugging and validating their serial-data-based designs.

The high-speed serial data analysis software provides designers with a fast and easy way to pinpoint signal integrity problems and validate performance for serial interface designs.

It allows designers to perform mask testing, characterize serial data streams that employ embedded clocks, and decode 8b/10b data from serial data streams.

The software also enables designers to verify compliance to computer, communications and data-communications standards such as PCI Express, Serial ATA (SATA), serial attached SCSI (SAS), Fibre Channel (FC), XAUI and Gigabit Ethernet.

With the faster edge speeds and shrinking data-valid windows in today's high-speed digital designs, insight into the causes of signal jitter is critical for ensuring the reliability of designs.

The EZJIT Plus jitter-analysis software helps designers identify and quantify jitter components.

Time correlation of jitter to the real-time signal makes it easy to trace jitter components to their sources.

The DSA80000B DSA's superior signal integrity capabilities come from Agilent's RF design experience, proprietary packaging technologies and CMOS ADC architecture.

Superior signal integrity helps engineers maximise design margins because they do not waste measurement accuracy due to poor noise, jitter or frequency response of the oscilloscope or probing system.

Draft-802.11n MIMO test solution

2006-12-11T00:52:00.000-08:00

Agilent Technologies has announced an innovative test solution in support of the draft-802.11n specification.

Draft-802.11n MIMO test solution Agilent Technologies has announced an innovative test solution in support of the draft-802.11n specification. The 802.11n standard adds Multiple-Input Multiple-Output (MIMO) to increase data throughput and increase range. The accuracy, fast measurement speed and reliability of Agilent's new test solution make it the ideal choice for manufacturing managers and engineers performing high-volume test on draft-802.11n devices or modules.

Agilent's solution consists of the N4011A MIMO/Multi-Port Adapter and the N4010A Wireless Connectivity Test Set, configured with Option 103 for WLAN Tx/Rx analysis and Option 108 for 802.11n MIMO modulation analysis.

A MIMO upgrade kit is available for customers who currently own the N4010A test set.

The N4011A connects to the N4010A test set to provide four switchable RF I/O ports for testing devices of all WLAN formats, including draft-802.11n.

The N4010A Option 108 and N4011A combination provides fast electronic switching to allow capture and analysis of WLAN bursts on multiple channels without compromising measurement accuracy.

This innovative technique allows full demodulation of the MIMO signal, providing greater insight to failure mechanisms revealed by measurements such as channel isolation and single-channel or MIMO EVM.

'In high-volume manufacturing environments, the speed of the N4010A/N4011A provides increased throughput, while its measurement accuracy and repeatability provide users with confidence in the quality of the test device,' said Earl Thompson, vice president and general manager of Agilent's Wireless Division.

'This level of performance is critical to ensuring the lower cost of test that today's manufacturing managers and engineers demand'.

'In the process, it helps them improve their overall competitiveness as well as profitability'.

Agilent's draft-802.11n MIMO test solution also provides an interface to connect the device-under-test to a golden radio.

This 19-inch rack-width setup enables calibrated multi-channel receiver tests and uplink/downlink throughput testing.

When coupled with N4010A's parametric tests, these capabilities provide a comprehensive test functionality which ensures product quality.

The Agilent N4010A Wireless Connectivity Test Set is flexible enough to measure the latest emerging wireless standards.

As a versatile multi-format wireless connectivity test solution, it can be configured to meet the needs of today's Bluetooth, Bluetooth EDR, WLAN 802.11a,b,g and n and ZigBee applications.